[go: up one dir, main page]

WO2004066369A3 - Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser - Google Patents

Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser Download PDF

Info

Publication number
WO2004066369A3
WO2004066369A3 PCT/NL2004/000040 NL2004000040W WO2004066369A3 WO 2004066369 A3 WO2004066369 A3 WO 2004066369A3 NL 2004000040 W NL2004000040 W NL 2004000040W WO 2004066369 A3 WO2004066369 A3 WO 2004066369A3
Authority
WO
WIPO (PCT)
Prior art keywords
holder
carrier
laser light
cutting device
semiconductor products
Prior art date
Application number
PCT/NL2004/000040
Other languages
English (en)
Other versions
WO2004066369A2 (fr
Inventor
Egmond Henri Joseph Van
Joannes Leonardus Jurrian Zijl
Marcel Hermanus Johanne Rensen
Original Assignee
Fico Bv
Egmond Henri Joseph Van
Joannes Leonardus Jurrian Zijl
Marcel Hermanus Johanne Rensen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Egmond Henri Joseph Van, Joannes Leonardus Jurrian Zijl, Marcel Hermanus Johanne Rensen filed Critical Fico Bv
Priority to EP04703293A priority Critical patent/EP1588405A2/fr
Priority to JP2006500732A priority patent/JP2006517730A/ja
Priority to US10/542,213 priority patent/US20060231454A1/en
Publication of WO2004066369A2 publication Critical patent/WO2004066369A2/fr
Publication of WO2004066369A3 publication Critical patent/WO2004066369A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne une plaque de support et un dispositif de support destinés à soutenir et à fixer des produits à semiconducteurs au cours de la séparation par lumière laser desdits produits. L'invention se rapporte également à un procédé permettant de soutenir et fixer des produits à semiconducteurs au cours de leur séparation par lumière laser.
PCT/NL2004/000040 2003-01-22 2004-01-19 Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser WO2004066369A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04703293A EP1588405A2 (fr) 2003-01-22 2004-01-19 Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser
JP2006500732A JP2006517730A (ja) 2003-01-22 2004-01-19 キャリヤ、ホルダー、レーザー切断装置及びレーザー光を使用する半導体製品の分離方法
US10/542,213 US20060231454A1 (en) 2003-01-22 2004-01-19 Carrier, holder, laser cutting device and method for separating semiconductor products using laser light

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1022463A NL1022463C2 (nl) 2003-01-22 2003-01-22 Drager, houder, lasersnij-inrichting en werkwijze voor het met behulp van laserlicht separeren van halfgeleider producten.
NL1022463 2003-01-22

Publications (2)

Publication Number Publication Date
WO2004066369A2 WO2004066369A2 (fr) 2004-08-05
WO2004066369A3 true WO2004066369A3 (fr) 2004-09-30

Family

ID=32768719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2004/000040 WO2004066369A2 (fr) 2003-01-22 2004-01-19 Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser

Country Status (8)

Country Link
US (1) US20060231454A1 (fr)
EP (1) EP1588405A2 (fr)
JP (1) JP2006517730A (fr)
KR (1) KR20050099506A (fr)
CN (1) CN1742359A (fr)
NL (1) NL1022463C2 (fr)
TW (1) TW200417101A (fr)
WO (1) WO2004066369A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1027929C2 (nl) * 2004-12-31 2006-07-03 Fico Bv Houder en werkwijze voor het separeren van objecten, en flexibele materiaallaag met gesepareerde objecten.
US7642485B2 (en) 2005-01-26 2010-01-05 Disco Corporation Laser beam processing machine
DE102005046031B3 (de) 2005-09-26 2007-07-12 Schott Ag Verfahren zur Separierung von Teilen aus einem Substrat
CN101522358B (zh) * 2006-09-27 2012-07-04 芝浦机械电子装置股份有限公司 薄膜切割装置以及薄膜切割方法
WO2013082076A1 (fr) * 2011-11-30 2013-06-06 Corning Incorporated Support pour feuilles de verre mince et procédé d'utilisation
DE102016106706A1 (de) * 2016-04-12 2017-10-12 Laser Imaging Systems Gmbh Vorrichtung zum Fixieren von Objekten mittels Vakuum
CN113547225A (zh) * 2020-04-22 2021-10-26 鸿鎷科技有限公司 具有石英底座的精密陶瓷工作台

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102850A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd ウェハホルダ
WO2001075966A1 (fr) * 2000-04-04 2001-10-11 Synova S.A. Procede de coupe d'un objet et de traitement ulterieur du materiau coupe et support permettant de maintenir ledit objet ou ledit materiau coupe
US20020139235A1 (en) * 2001-02-20 2002-10-03 Nordin Brett William Singulation apparatus and method for manufacturing semiconductors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028991U (ja) * 1983-08-02 1985-02-27 日本電気株式会社 レ−ザ加工装置
TW524873B (en) * 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
JPH1140523A (ja) * 1997-07-22 1999-02-12 Mitsubishi Electric Corp 基板切断装置および基板切断方法
JP2000164535A (ja) * 1998-11-24 2000-06-16 Mitsubishi Electric Corp レーザ加工装置
JP2000164536A (ja) * 1998-11-25 2000-06-16 Disco Abrasive Syst Ltd チャックテーブル
US6885522B1 (en) * 1999-05-28 2005-04-26 Fujitsu Limited Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
JP2002144070A (ja) * 2000-11-02 2002-05-21 Tdk Corp レーザ加工用被加工物支持装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102850A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd ウェハホルダ
WO2001075966A1 (fr) * 2000-04-04 2001-10-11 Synova S.A. Procede de coupe d'un objet et de traitement ulterieur du materiau coupe et support permettant de maintenir ledit objet ou ledit materiau coupe
US20020139235A1 (en) * 2001-02-20 2002-10-03 Nordin Brett William Singulation apparatus and method for manufacturing semiconductors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 291 (E - 1093) 24 July 1991 (1991-07-24) *

Also Published As

Publication number Publication date
JP2006517730A (ja) 2006-07-27
EP1588405A2 (fr) 2005-10-26
US20060231454A1 (en) 2006-10-19
TW200417101A (en) 2004-09-01
KR20050099506A (ko) 2005-10-13
NL1022463C2 (nl) 2004-07-26
WO2004066369A2 (fr) 2004-08-05
CN1742359A (zh) 2006-03-01

Similar Documents

Publication Publication Date Title
AU2003262077A1 (en) Method for cutting semiconductor substrate
TWI339876B (en) Semi-conductor cutting method
AU2003252359A1 (en) Semiconductor light-emitting device, method for manufacturing same and light-emitting apparatus using same
AU2003298532A1 (en) Grating-stabilized semiconductor laser
AU2003246348A1 (en) Method for dividing semiconductor wafer
AU2003248339A1 (en) Method for dividing semiconductor wafer
EP1586407A4 (fr) Dispositif de decoupe par laser, procede de decoupe par laser et systeme de decoupe par laser
EP1523077A4 (fr) Boitier pour semi-conducteur optique
AU2003236531A1 (en) Process for preparing olefins from oxygenates
AU2003227230A1 (en) Semiconductor laser device
SG115549A1 (en) Epitaxial substrate for compound semiconductor light emitting device, method for producing the same and light emitting device
AU2002366503A1 (en) Water carrier for semiconductor process tool
TW200802567A (en) Method of cutting and machining a silicon wafer
AU2003268640A1 (en) Production method for light emitting device
TW200633809A (en) Method and device for separating products with a controlled cut edge, and separated product
AU2003248343A1 (en) Process for producing semiconductor device
WO2004066369A3 (fr) Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser
AU2003277738A1 (en) Apparatus for cutting lumber
AU2003227586A1 (en) Method for oligomerizing olefins
AU2003268174A1 (en) Semiconductor laser
AU2003286940A1 (en) Cutting apparatus for welded part
AU2003223872A1 (en) Method, device and installation for cutting textiles by means of a laser beam
AU2003251536A1 (en) Method for forming semiconductor processing components
TW200702093A (en) Method and device for cutting electronic components with a laser beam
TW200635689A (en) Holder and method for separating objects, and flexible material layer with separated objects

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004703293

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2006500732

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 20048026699

Country of ref document: CN

Ref document number: 1020057013533

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 1020057013533

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2004703293

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2006231454

Country of ref document: US

Ref document number: 10542213

Country of ref document: US

DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
WWP Wipo information: published in national office

Ref document number: 10542213

Country of ref document: US