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WO2003086955A1 - Procede et dispositif pour le fonctionnement d'un element micromecanique - Google Patents

Procede et dispositif pour le fonctionnement d'un element micromecanique Download PDF

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Publication number
WO2003086955A1
WO2003086955A1 PCT/EP2002/004122 EP0204122W WO03086955A1 WO 2003086955 A1 WO2003086955 A1 WO 2003086955A1 EP 0204122 W EP0204122 W EP 0204122W WO 03086955 A1 WO03086955 A1 WO 03086955A1
Authority
WO
WIPO (PCT)
Prior art keywords
micromechanical element
temperature
micromechanical
operating
chip
Prior art date
Application number
PCT/EP2002/004122
Other languages
English (en)
Inventor
Ulrike DAUDERSTÄDT
Lars Leonardsson
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Micronic Laser Systems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Micronic Laser Systems Ab filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority to PCT/EP2002/004122 priority Critical patent/WO2003086955A1/fr
Publication of WO2003086955A1 publication Critical patent/WO2003086955A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0083—Temperature control
    • B81B7/009—Maintaining a constant temperature by heating or cooling
    • B81B7/0093—Maintaining a constant temperature by heating or cooling by cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems

Definitions

  • the present invention relates to the operating of a micromechanical element, and more specific to the operating of a deflectable micromechanical element containing a metal or an alloy.
  • Microelectromechanical systems comprising one or more deflectable micromechanical elements arranged on a chip are nowadays used in many applications.
  • microelectromechanical systems comprising one or more micromirrors are used for the spatial modulation of a light or an UN radiation beam (ultraviolet radiation beam) in image generating devices.
  • UN radiation beam ultraviolet radiation beam
  • aluminum is preferably used as material for the micromirrors because of its good optical reflection properties in this spectral region.
  • the use of aluminum is advantageous because standard processes known in the semiconductor industry can be used for the deposition and the structuring of the micromechanical elements avoiding the need of a special technology for manufacturing the micromechanical elements and allowing the integration into a semiconductor manufacturing process.
  • the micromirror is shaped as a thin plate which is deflectable arranged on the chip.
  • radiation from a suitable radiation source is impinging on the micromirror and is reflected back to a projection surface.
  • an electrical signal is applied to the micromirror causing a deflection of same in response to the applied electrical signal.
  • the deflection of the micromirror changes the phase of part of the reflected beam resulting in a spatial modulation of the reflected beam at the projection surface.
  • the deflection of the micromirror has to be controlled to a high degree of accuracy. Therefore, good mechanical properties and in specific a good elastic behavior are required for the material of the flexible elements such as hinges or torsional bars mechanically connecting the micromirror to the chip in such a way that the micromirrors can deflect appreciably.
  • microelements made of aluminum causes problems since microelements made of aluminum are known to behave in a non-elastic manner during the operation of same.
  • a deflected spring made of aluminum is not returning to its original position after being released from a deflected position in which it was kept for a longer time.
  • the deflection increases with time. This known effect has time constants in the order of minutes to several hours and is partially reversible.
  • the above described mechanical operation problem of the micromechanical element made of aluminum can be evaded by a non- analog operation of same wherein the position of the deflected micromechanical element is not required to be exact and variations of the element's deflection are allowed within a certain range or where end positions are determined by mechanical stops .
  • One approach to reduce the problem for analog operation at least to an acceptable level is to use a low-duty cycle operation for the MEMS-device wherein a long time deflection of the micromechanical element is avoided by deflecting same only for a small time period.
  • low-duty cycle operation is restricted to a certain class of applications excluding applications requiring a static operation of the micromechanical element.
  • micromechanical element of an aluminum alloy instead of pure aluminum.
  • a certain improvement of the mechanical properties can be achieved by the replacement of pure aluminum with an aluminum alloy.
  • the mechanical operation is improved by forming the micromechanical element of an aluminum alloy, the mechanical problems are only reduced to a certain level but not solved.
  • an improved operation for a micromechanical element made of a metal or an alloy, or a sandwich of at least two layers of dissimilar materials, wherein at least one is a metal or an alloy is achieved by cooling the micromechanical element to a temperature lower than the normal operation temperature.
  • an improved mechanical behavior of the micromechanical element is obtained resulting in a more stable operation compared to the operation of the micromechanical element at the normal operation temperature.
  • the cooled micromechanical element maintains its deflected position with a better accuracy. Furthermore, a residual deflection observed in the normal temperature operation when the micromechanical element is released from a state in which same was deflected for a prolonged time is reduced by cooling the micromechanical element .
  • the present invention provides a method for operating a micromechanical element containing a metal or an alloy, the micromechanical element being arranged on a chip and being deflectable.
  • the method comprises the steps of cooling the micromechanical element to a temperature lower than the normal operating temperature of the micromechanical element and operating the micromechanical element at the temperature lower than the normal operating temperature of the micromechanical element.
  • the present invention provides a device for operating a micromechanical element containing metal or an alloy, the micromechanical element being arranged on a chip and deflectable.
  • the device comprises cooling means thermally connected to the micromechanical element and operable to cool the micromechanical element to a temperature lower than the normal operating temperature of the micromechanical element.
  • the device comprises operating means for operating the micromechanical element while same is cooled to the temperature lower than the normal operating temperature of the micromechanical element .
  • the micromechanical element is a micromirror containing aluminum or an aluminum alloy.
  • a UV radiation which is impinging on the micromirror is reflected by same and directed to a projection surface.
  • the reflected radiation is modulated by an electrical signal applied to the micromirror by the operating means .
  • the inventive step of cooling the micromirror during the operation of same is achieved by means of one or more Peltier elements placed in a direct contact with the surface of the chip.
  • the micromirror is cooled to temperatures between +10° C and 25° C to avoid a condensation of moisture contained in the air surrounding the chip.
  • the chip is arranged so that it is cooled by circulating gas or a liquid such as water.
  • the chip is arranged in an air-free surrounding or in an environment comprising air with a low degree of moisture or some other controlled atmosphere.
  • an operation of the micromechanical element at lower temperatures is enabled since a condensation of moisture is avoided or shifted to lower temperatures.
  • Fig. 1 shows a block diagram of a device for operating a chip
  • Fig. 2 shows a diagram comprising deflection measurement data of micromirrors made from an aluminum alloy at different ambient temperatures during deflection-relaxation cycles .
  • a device 10 for operating a micromechanical element according to a preferred embodiment is shown.
  • the device 10 comprises mounting means 12 for mounting a chip 14.
  • the chip 14 comprises a microelectromechanical system (MEMS) including a micromechanical element 16 made of a metal or an alloy.
  • the micromechanical element 16 includes for example a micromirror comprising a thin metal plate which is deflectably arranged on the chip 14.
  • Operating means 18 are connected via an electrical connection 20 to the micromechanical element 16 for applying an operating signal to the micromechanical element 16.
  • An electrostatic field is generated between a counter electrode 22 and the micromechanical element 16 in response to the operating signal causing the micromechanical element 16 to deflect.
  • the counter electrode 22 is arranged on the chip opposite to the micromechanical element 16 and connected to ground. However, it is intended in other embodiments to apply other constant voltages or electrical signals to the counter electrode 22 in order to generate the electric field. Furthermore, in one embodiment, the micromechanical element 16 is connected to ground and an electric field is generated by an electrical signal applied to the counter electrode. Preferably, the counter electrode 22 is arranged close to the micromechanical element 16 to achieve a high electrostatic field.
  • the device 10 comprises cooling means 24 operable to cool the micromechanical element 16 to a temperature lower than the normal operation temperature of the micromechanical element 16.
  • the cooling means 24 is thermally connected to the micromechanical element 16 via a thermal conductor 26.
  • the thermal conductor 26 can be any suitable thermal conductor, such as a massive metal block, a thermal-conducting gas, air, or liquid.
  • cooling means 24 can be any suitable heat sink operable to achieve a heat transfer via the thermal conductor 26 from the micromechanical element 16 to the cooling means 24.
  • cooling means 24 includes a Peltier element which is directly mounted on a surface of the chip 14. In this embodiment, heat from the micromechanical element 16 is conducted to the cooling means 24 via the surface of the chip 14 connected to the Peltier element.
  • the direct transmission of the heat from the chip 14 to the Peltier element enables in one embodiment the cooling of the micromechanical element 16 below 10° C without a condensation of the moisture of the surrounding air by arranging the chip and the Peltier element in a vacuum or a controlled atmosphere (e.g., a dry gas) .
  • a vacuum or a controlled atmosphere e.g., a dry gas
  • the chip 14 and the Peltier element are placed in a suitable air tight housing which is evacuated thereafter, or filled or flushed with a controlled atmosphere (e.g., a dry gas).
  • a temperature controller 28 is connected via a temperature control signal connection 30 to the cooling means 24. Furthermore, a temperature sensor 32 is thermally connected to the micromechanical element 16 to sense the temperature of the micromechanical element 16 and to provide a temperature signal indicative of the temperature of the micromechanical element 16 via a temperature signal connection 34 to the temperature controller 28.
  • the temperature sensor and the cooling means, respectively, are connected to the chip on which the micromechanical element, the mirror, is arranged.
  • the micromechanical element 16 is a micromirror made of aluminum or an aluminum alloy used for a spatial modulation of UV radiation, and where the flexible elements that mechanically connect the micromirror to the chip are integrated parts of the micromirror.
  • At least a part of the micromirror 16 is illuminated by a suitable generator for UV radiation such as an ex- cimer laser with a radiation in the UV spectral region and preferably with a radiation in the deep UV spectral region.
  • a suitable generator for UV radiation such as an ex- cimer laser with a radiation in the UV spectral region and preferably with a radiation in the deep UV spectral region.
  • the UV radiation is directed to the micromirror 16 and impinges on same. Thereafter the radiation is reflected by the micromirror 16 due to the high degree of reflection provided by the micromirror' s material containing aluminum or an aluminum alloy and is directed to a projection surface.
  • the micromirror 16 is used for maskless mi- crolithography.
  • the projection surface is the surface of a wafer covered with a photo resist layer and the reflected beam defines regions on the photo resist layer which are to be removed after a developing process.
  • Other embodiments include the use of the micromirror for projection devices and for image generating systems.
  • an operating signal generated by the operating means 18 is applied via the connection 20 to the micromirror 16.
  • an electrostatic force is generated between the micromirror 16 and the counter electrode 22 which is connected to ground.
  • the mi- cromirror 16 comprises a free standing aluminum plate deflectably connected to the chip 14 via a spring.
  • the electrostatic force acting on the micromirror 16 deflects the micromirror 16 in response to the applied operating signal.
  • the deflection of the micromirror 16 changes the phase of part of the reflected beam resulting in a spatial modulation of the reflected beam at the projection surface.
  • the temperature controller 28 For controlling the temperature of the micromirror 16, the temperature controller 28 generates a temperature control signal in response to the temperature signal provided by the temperature sensor 32.
  • the temperature controller 28 applies the temperature control signal via the temperature control signal connection 30 to the Peltier element to cause same to apply a predetermined temperature to the micromirror 16 which is lower than the normal operation temperature of the micromirror 16.
  • the normal operating temperature of the micromirror 16 is about 50° C due to the heat dissipation of the electric circuitry on the chip.
  • micromirror 16 By cooling the micromirror 16 during the operation of same to a temperature lower than the normal operation temperature of the micromirror 16, a more accurate and stable deflection of the micromirror 16 is obtained compared to the operation at the normal operation temperature, as will be described in more detail below.
  • Fig. 2 measurement data of the electrostatic de- flection of micromirrors made from an aluminum alloy are shown. The micromirrors were subjected to different ambient temperatures and for each temperature two cycles of deflection and relaxation were performed.
  • the micromirrors were electrostatically deflected for three hours by the application of a constant voltage to the micromirrors and then released by turning off the applied voltage for one hour. Thereafter, in the second cycle, the procedure of deflecting for three hours and releasing for one hour was repeated. The deflection of the mirrors was monitored by means of a white-light interferometer (WLI) .
  • WLI white-light interferometer
  • the y-axis shows the deflection ⁇ z of the micromirrors relative to the starting position in nm. Furthermore, the x-axis shows the time t after starting the first relaxation cycle.
  • the deflection of the micromirrors almost instantly increases from 0 nm to about 50 nm. Thereafter, a rapid increase in deflection from 50 nm to about 80 nm followed by a slower increase in deflection from 80 nm to about 105 nm can be observed during a time period of three hours in which the constant voltage is applied to the micromirrors. After turning off the applied voltage, the micromirrors are released from their deflected state causing the deflection of the micromirrors to instantly decrease to a position of about 45 nm followed by a rapid decrease to about 32 n . Within the one hour of relaxation, the residual deflection of about 32 nm is only reduced by a small amount.
  • the deflection of the micromirrors at the temperature of about 50° C returns to about 80 nm followed by a rapid increase to about 105 nm and further increases slowly to about 122 nm during the time period of three hours, in which the constant voltage is applied in the second cycle.
  • the deflection of the micromirrors subjected to the temperature of 50° C instantly returns to about 55 nm, rapidly decreasing to 40 nm and showing a slight decrease within one hour after the release of the micromirrors.
  • the mechanical properties of the micromirrors subjected to the temperature of about 50° C do not allow a stable operation since same show a high residual deflection after the release of same and a significant increase of the deflection during the application of a constant voltage.
  • the deflection of the micromirrors instantly rises to about 52 nm, followed by a rapid increase to 70 nm and a slower increase during the three hours in which the applied voltage was kept constant to about 80 nm.
  • the deflection of same returns instantly to about 25 nm, rapidly decreasing to about 10 nm, showing a slight additional reduction during the relaxation of a period of one hour in which no voltage was ap- plied.
  • the mechanical behavior is significantly improved at 25° C compared to 50° C because of the small variations during the application of the constant voltage and the reduced residual deflection after releasing same from the deflected state.
  • the mechanical behavior of the micromirrors at a temperature of about 10° C is now explained.
  • the micromirror at the temperature of 10° C instantly deflects to about 50 nm, which rapidly increase to about 60 nm.
  • the deflection of the micromirrors is then maintained within a range of 5 nm.
  • the micromirror at the temperature of 10° C instantly returns to about 8 nm deflection, rapidly decreasing to almost exactly the starting position of 0 nm deflection and maintains there with almost no variations.
  • the mechanical behavior of the micromirrors made from a aluminum alloy can be significantly improved by cooling the micromirrors to a temperature lower than the normal operating temperature. A significant improvement of the mechanical behavior was observed for the temperature of 25° C and an almost perfect mechanical behavior with small variations of the deflection in the deflected state and no detectable residual deflection a short time after release was observed at the temperature of 10° C.
  • a limited temperature range from +25° C to +10° C is preferred to avoid a condensation of moisture contained in the air on the micromirror 16, as will be described below.
  • the condensation has to be avoided since water droplets condensed on the chip are not only reducing the reflection properties of the micromirror 16 in optical applications but are also a source of contamination and can cause the mirrors to stick to the substrate.
  • chemical reactions and in specific oxidation of components arranged on the chip is promoted by condensed water droplets.
  • the condensation for a typical degree of moisture starts at a temperature of about 10° C resulting in a lower limit for a preferred temperature range.
  • the upper limit of the preferred temperature range is at about 25° C since at this temperature significant improvements of the micromechanical behavior are achieved, as explained above. Consequently, if the micromechanical element 16 is used in air and no additional means are provided to shift the condensation to a lower temperature or to avoid the condensation, a preferred temperature range for the operation of the micromechanical element 16 extends from +10° C to ⁇ 25 °C.
  • the operation at lower temperatures as low as -10° C or even less is enabled if the chip is placed in a moisture free chamber. This is achieved for example by an air tight housing, in which the chip 14 is arranged and wherein a vacuum or a controlled atmosphere (e.g., a dry gas) is provided.
  • a vacuum or a controlled atmosphere e.g., a dry gas
  • an operation at lower temperatures without a condensation of moisture can be obtained by reducing the degree of moisture of the surrounding air.
  • suitable chemicals such as silicat gel near the chip 14.
  • the present invention is directed to the operation of any deflectable micromechanical element containing any metal or alloy.
  • the chip can comprise of one or more micromechanical elements operable in optical or non-optical applications .
  • elements made of a metal or a metal alloy were described.
  • the present invention is not limited to such embodiments.
  • the present invention is also applicable to micromechanical elements containing an alloy that contains non-metals, e.g., silicon.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

La présente invention a trait à un procédé pour le fonctionnement d'un élément micromécanique (16) contenant du métal ou un alliage comprenant le refroidissement de l'élément mécanique (16) à une température inférieure à la température normale de fonctionnement de l'élément micromécanique (16) et le fonctionnement de l'élément micromécanique (16) à la température inférieure à la température normale de fonctionnement de l'élément micromécanique (16).
PCT/EP2002/004122 2002-04-12 2002-04-12 Procede et dispositif pour le fonctionnement d'un element micromecanique WO2003086955A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2002/004122 WO2003086955A1 (fr) 2002-04-12 2002-04-12 Procede et dispositif pour le fonctionnement d'un element micromecanique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2002/004122 WO2003086955A1 (fr) 2002-04-12 2002-04-12 Procede et dispositif pour le fonctionnement d'un element micromecanique

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Publication Number Publication Date
WO2003086955A1 true WO2003086955A1 (fr) 2003-10-23

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335859A (ja) * 2006-06-07 2007-12-27 Asml Netherlands Bv リソグラフィ用ミラーアレイ
WO2009013278A1 (fr) * 2007-07-25 2009-01-29 Carl Zeiss Smt Ag Dispositif de réglage de température d'un élément optique
DE102009045171A1 (de) 2009-09-30 2010-10-07 Carl Zeiss Smt Ag Vorrichtung zur wenigstens annähernd kontaktlosen bzw. mechanisch entkoppelten Kühlung eines thermisch belasteten Elements

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935610A1 (de) * 1989-10-26 1991-05-02 Messerschmitt Boelkow Blohm Monolithisch integrierbares peltier-kuehlelement
EP0738910A2 (fr) * 1995-04-18 1996-10-23 Texas Instruments Incorporated Améliorations concernant un dispositif à miroirs microscopiques digital (DMD)
WO2001059363A1 (fr) * 2000-02-10 2001-08-16 Light And Sound Design, Inc. Super-refroidisseur pour dispositif producteur de chaleur
WO2002019027A1 (fr) * 2000-08-28 2002-03-07 Matsushita Electric Industrial Co., Ltd. Dispositif video de projection
US20020163625A1 (en) * 2000-08-28 2002-11-07 Toshiaki Tabuchi Projection video device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935610A1 (de) * 1989-10-26 1991-05-02 Messerschmitt Boelkow Blohm Monolithisch integrierbares peltier-kuehlelement
EP0738910A2 (fr) * 1995-04-18 1996-10-23 Texas Instruments Incorporated Améliorations concernant un dispositif à miroirs microscopiques digital (DMD)
WO2001059363A1 (fr) * 2000-02-10 2001-08-16 Light And Sound Design, Inc. Super-refroidisseur pour dispositif producteur de chaleur
WO2002019027A1 (fr) * 2000-08-28 2002-03-07 Matsushita Electric Industrial Co., Ltd. Dispositif video de projection
US20020163625A1 (en) * 2000-08-28 2002-11-07 Toshiaki Tabuchi Projection video device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335859A (ja) * 2006-06-07 2007-12-27 Asml Netherlands Bv リソグラフィ用ミラーアレイ
WO2009013278A1 (fr) * 2007-07-25 2009-01-29 Carl Zeiss Smt Ag Dispositif de réglage de température d'un élément optique
DE102007034652A1 (de) 2007-07-25 2009-01-29 Carl Zeiss Smt Ag Vorrichtung zur Temperatureinstellung eines optischen Elements
DE102009045171A1 (de) 2009-09-30 2010-10-07 Carl Zeiss Smt Ag Vorrichtung zur wenigstens annähernd kontaktlosen bzw. mechanisch entkoppelten Kühlung eines thermisch belasteten Elements

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