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WO2003037953A1 - Resin composition - Google Patents

Resin composition Download PDF

Info

Publication number
WO2003037953A1
WO2003037953A1 PCT/JP2002/011224 JP0211224W WO03037953A1 WO 2003037953 A1 WO2003037953 A1 WO 2003037953A1 JP 0211224 W JP0211224 W JP 0211224W WO 03037953 A1 WO03037953 A1 WO 03037953A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
group
ingredient
fatty acid
parts
Prior art date
Application number
PCT/JP2002/011224
Other languages
French (fr)
Japanese (ja)
Inventor
Hironobu Iyama
Toru Fujiki
Toshiki Mori
Original Assignee
Sumitomo Chemical Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Company, Limited filed Critical Sumitomo Chemical Company, Limited
Publication of WO2003037953A1 publication Critical patent/WO2003037953A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Organic Insulating Materials (AREA)

Abstract

A resin composition which comprises the following ingredients (A), (B), and (C) and may contain the ingredient (D) in an amount of up to 0.05 parts by weight per 100 parts by weight of the ingredient (A); and an insulating material obtained by curing the composition. A copolymer comprising [a] structural units derived from a monomer containing neither an epoxy group nor an ester group but containing a vinyl group and [b] structural units derived from a monomer containing a vinyl group and an epoxy group. A polymerization initiator. An antioxidant. A fatty acid and/or fatty acid salt.
PCT/JP2002/011224 2001-10-31 2002-10-29 Resin composition WO2003037953A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001334333A JP2003137969A (en) 2001-10-31 2001-10-31 Resin composition for film molding
JP2001/334333 2001-10-31

Publications (1)

Publication Number Publication Date
WO2003037953A1 true WO2003037953A1 (en) 2003-05-08

Family

ID=19149481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/011224 WO2003037953A1 (en) 2001-10-31 2002-10-29 Resin composition

Country Status (3)

Country Link
JP (1) JP2003137969A (en)
TW (1) TW200300143A (en)
WO (1) WO2003037953A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4380127B2 (en) * 2002-03-28 2009-12-09 住友化学株式会社 Thermosetting resin composition and adhesive film
JP5277865B2 (en) * 2002-03-28 2013-08-28 住友化学株式会社 Thermosetting resin composition and adhesive film
AU2003281688A1 (en) * 2002-07-29 2004-02-16 Sumitomo Chemical Company, Limited Thermosetting resin composition and adhesive film
JP4999254B2 (en) * 2003-07-29 2012-08-15 住友化学株式会社 Curable resin composition and protective film
JP5498832B2 (en) * 2009-03-25 2014-05-21 電気化学工業株式会社 Energy ray curable resin composition, adhesive and cured product using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4893677A (en) * 1972-03-14 1973-12-04
JPH10316955A (en) * 1997-05-13 1998-12-02 Minnesota Mining & Mfg Co <3M> Thermosetting adhesive composition, production thereof, and adhesion structure
WO2000000566A1 (en) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
WO2002000756A1 (en) * 2000-06-28 2002-01-03 Sumitomo Chemical Company, Limited Insulating resin composition, adhesive resin composition and adhesive sheeting

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4893677A (en) * 1972-03-14 1973-12-04
JPH10316955A (en) * 1997-05-13 1998-12-02 Minnesota Mining & Mfg Co <3M> Thermosetting adhesive composition, production thereof, and adhesion structure
WO2000000566A1 (en) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
WO2002000756A1 (en) * 2000-06-28 2002-01-03 Sumitomo Chemical Company, Limited Insulating resin composition, adhesive resin composition and adhesive sheeting

Also Published As

Publication number Publication date
TW200300143A (en) 2003-05-16
JP2003137969A (en) 2003-05-14

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