[go: up one dir, main page]

WO2001063670A3 - Integrated circuit package with device specific data storage - Google Patents

Integrated circuit package with device specific data storage Download PDF

Info

Publication number
WO2001063670A3
WO2001063670A3 PCT/US2001/040198 US0140198W WO0163670A3 WO 2001063670 A3 WO2001063670 A3 WO 2001063670A3 US 0140198 W US0140198 W US 0140198W WO 0163670 A3 WO0163670 A3 WO 0163670A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
data storage
circuit package
specific data
device specific
Prior art date
Application number
PCT/US2001/040198
Other languages
French (fr)
Other versions
WO2001063670A2 (en
Inventor
Henrik Hoyer
Larry Leighton
Thomas Moller
Gary Lopes
Original Assignee
Ericsson Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Inc filed Critical Ericsson Inc
Priority to AU2001272081A priority Critical patent/AU2001272081A1/en
Publication of WO2001063670A2 publication Critical patent/WO2001063670A2/en
Publication of WO2001063670A3 publication Critical patent/WO2001063670A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A data storage system for integrated circuit packages includes an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, wherein the lid includes a data storage component contained on one or more exterior surfaces of the integrated circuit package. Data retrieval means may also be provided. By way of examples, the data storage component may be a bar code, a digitally encoded etching, or an electronic memory element.
PCT/US2001/040198 2000-02-28 2001-02-28 Integrated circuit package with device specific data storage WO2001063670A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001272081A AU2001272081A1 (en) 2000-02-28 2001-02-28 Integrated circuit package with device specific data storage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51444700A 2000-02-28 2000-02-28
US09/514,447 2000-02-28

Publications (2)

Publication Number Publication Date
WO2001063670A2 WO2001063670A2 (en) 2001-08-30
WO2001063670A3 true WO2001063670A3 (en) 2002-01-31

Family

ID=24047175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/040198 WO2001063670A2 (en) 2000-02-28 2001-02-28 Integrated circuit package with device specific data storage

Country Status (2)

Country Link
AU (1) AU2001272081A1 (en)
WO (1) WO2001063670A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10259049A1 (en) * 2002-12-17 2004-07-15 Infineon Technologies Ag Integrated semiconductor module
DE10344409A1 (en) 2003-09-25 2005-04-28 Marconi Comm Gmbh Method for manufacturing a high-frequency module
EP4166497A1 (en) * 2021-10-15 2023-04-19 Schott Ag Enclosure with information pattern

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150464A (en) * 1983-02-15 1984-08-28 Toshiba Corp Semiconductor device
JPS61131549A (en) * 1984-11-30 1986-06-19 Sharp Corp Semiconductor circuit package
JPH0429358A (en) * 1990-05-25 1992-01-31 Fuji Photo Film Co Ltd Semiconductor device
DE4340223A1 (en) * 1992-11-27 1994-06-01 Gold Star Electronics Semiconductor device package with chip-specific data label - enables chip to be distinguished from others of same origin by reference to metallic plate attached after encapsulation
US5642307A (en) * 1992-07-09 1997-06-24 Advanced Micro Devices, Inc. Die identifier and die indentification method
JPH1126650A (en) * 1997-06-30 1999-01-29 Mitsumi Electric Co Ltd Resin sealed package
US5984190A (en) * 1997-05-15 1999-11-16 Micron Technology, Inc. Method and apparatus for identifying integrated circuits

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150464A (en) * 1983-02-15 1984-08-28 Toshiba Corp Semiconductor device
JPS61131549A (en) * 1984-11-30 1986-06-19 Sharp Corp Semiconductor circuit package
JPH0429358A (en) * 1990-05-25 1992-01-31 Fuji Photo Film Co Ltd Semiconductor device
US5642307A (en) * 1992-07-09 1997-06-24 Advanced Micro Devices, Inc. Die identifier and die indentification method
DE4340223A1 (en) * 1992-11-27 1994-06-01 Gold Star Electronics Semiconductor device package with chip-specific data label - enables chip to be distinguished from others of same origin by reference to metallic plate attached after encapsulation
US5984190A (en) * 1997-05-15 1999-11-16 Micron Technology, Inc. Method and apparatus for identifying integrated circuits
JPH1126650A (en) * 1997-06-30 1999-01-29 Mitsumi Electric Co Ltd Resin sealed package

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 008, no. 285 (E - 287) 26 December 1984 (1984-12-26) *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 319 (E - 450) 30 October 1986 (1986-10-30) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 196 (E - 1200) 12 May 1992 (1992-05-12) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 04 30 April 1999 (1999-04-30) *

Also Published As

Publication number Publication date
AU2001272081A1 (en) 2001-09-03
WO2001063670A2 (en) 2001-08-30

Similar Documents

Publication Publication Date Title
WO2005001935A3 (en) Integrated circuit package having stacked integrated circuits and method therefor
WO2003053791A3 (en) Apparatus and method for monitoring environment within a container
HK1029662A1 (en) Semiconductor device and method for manufacturing the same circuit substrate and electronic device.
WO2002029635A3 (en) Picked-up image managing device and method of determining group name
AU2002234475A1 (en) Memory element, method for structuring a surface, and storage device
WO2001069517A3 (en) Device for characterizing piece goods
EP0655839A3 (en) Electronic system, semiconductor integrated circuit and termination device.
WO2004055828A3 (en) Memory and access devices
AU2001243387A1 (en) Electronic semiconductor circuit which includes a tunnel diode
WO2002003196A3 (en) Protection of boot block data and accurate reporting of boot block contents
GB2341277B (en) An electronic component package with posts on the active surface
HK1020399A1 (en) Oscillation circuit, electronic circuit, semiconductor device, electronic equipment and clock.
ZA992492B (en) Encapsulation package and method of packaging an electronic circuit module.
WO2006084177A3 (en) Nested integrated circuit package on package system
MXPA02008736A (en) Electronic device packaging.
WO2002065492A3 (en) Integrated transformer
WO2005010731A3 (en) Integrated electronic credit application, contracting and securitization system and method
HK1034726A1 (en) Resin composition for semiconductor encapsulation,semiconductor device comprising the same and proc ess for the production of semiconductor device using the same.
WO2003036690A3 (en) Identification code reader integrated with substrate carrier robot
IL146865A0 (en) Integrated circuit package having a substrate vent hole
WO2006055645A3 (en) Rfid tag in a substrate
WO2003038647A3 (en) Packaged combination memory for electronic devices
WO2001063670A3 (en) Integrated circuit package with device specific data storage
AU2001270467A1 (en) Electronic chip component comprising an integrated circuit and a method for producing the same
TW200615107A (en) Release film for encapsulation of semiconductor chip

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP