WO2001020544A1

WO2001020544A1 - Ic card and manufacturing method for ic card

Info

Publication number: WO2001020544A1
Application number: PCT/KR2000/001003
Authority: WO
Inventors: Ken Saruta
Original assignee: 3B System Inc.
Priority date: 1999-09-10
Filing date: 2000-09-04
Publication date: 2001-03-22
Also published as: AU7454500A; KR100363657B1; KR19990084064A; KR200170147Y1

Abstract

The integrated circuit chip card of this invention is manufactured by installing the board-protecting plate to protect the integrated circuit board (COB, COF, Chip on lead frame) and the circuit element-protecting plate to protect the circuit elements of the integrated circuit in between the lower and the upper outside plates, and by forming a hole or groove for installing the board, the same size as the board on the board-protecting plate where the integrated circuit is located, and by forming a hole or groove for installing the circuit element, the same size as the circuit element on the circuit element-protecting plate where the integrated circuit is located, and then by laying out coils on the board-protecting plate and compressing the lower and the upper outside plates. Therefore, this invention prevents the cut or twist of the coil, made in the course of compressing because the integrated circuit chip card is manufactured by compressing the upper and the lower outside plates without curving the cut-section of coil, and prevents the damage on the circuit elements of the integrated circuit because the protrusion is prevented on the plane of the finished integrated circuit chip card, thus extending the card's durability.

Description

IC CARD AND MANUFACTURING METHOD FOR IC CARD

FIELD OF THE INVENTION

This invention relates to IC Card and its manufacturing method

for preventing any protrusion of the integrated circuit and damages

of contact part between the integrated circuit and the coils,

extending the card' s durability and reducing manufacturing cost.

BACKGROUND OF THE INVENTION

This integrated circuit chip card with a built-in integrated

circuit and various functions is used in a wide range of applications

from banking, to distribution and medical services. It has improved

memory capacity and security compared to general cards with

magnetic tape.

As shown on Fig 4, an existing integrated circuit chip card (50)

is composed of a frame which fixes and installs the integrated

circuit (53) and the coils (54) in between the upper and lower

outside plates (51 ,52).

For the above integrated circuit (53), the circuit element (53b)

is installed on the board (53a) to which the wiring (53c) connected with the circuit element (53b) is fixed and installed.

The above coils (54) can be formed as manifold winding or cut

images for generating more current by the changes of magnetism

from the magnetic field.

For the existing integrated circuit chip card, the integrated

circuit (52) is arranged on a part of the lower outside plate (51).

The coils (53) and the integrated circuit (52) are installed in

between the lower outside plate (51) and the upper outside plate

(54) as heating and compressing the upper outside plate (54) and

the lower outside plate (51) after connecting winding coils (53) and

the integrated circuit (52).

However, there were some problems such as short circuit when

the cut-section of the coils located at the edge of the board

compresses the upper and the lower outside plates by shearing and

tensile force due to the board forming the integrated circuit and the

thickness of the circuit element.

As the circuit element of the integrated circuit is protruded from

the outside of the finished integrated circuit chip card, the circuit

element can be easily damaged when used frequently. BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a side view of an integrated circuit chip card of this

invention;

Fig. 2 is a deal side view of an integrated circuit chip card of

this invention;

Fig. 3 is A-A line of cross-sectional view, showing an

integrated circuit chip card of this invention and its manufacturing

method;

Fig. 4 is A-A line of cross-sectional view of an existing

integrated circuit chip card;

descriptions of major parts of this invention as shown on the

drawings>

1 : Integrated circuit chip card

2 : Integrated circuit

2a : Board

2b : Circuit element

2c : Wiring

3 : Coil

4 : Lower outside plate

5 : Upper outside plate 6 : Board protecting plate

6a : Hole on the board

7 : Circuit element protecting plate

7a : Hole on the circuit element

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Fig. 1 and Fig. 2 show the integrated circuit chip card of this

invention, and major part 1 on the drawing is the integrated circuit

chip card.

Installing the integrated circuit (2) and coil (3) in between the

upper outside plate and the lower outside plate, the integrated

circuit chip card ( 1) of this invention includes board protecting plate

(6) and the circuit element protecting plate (7) in between the upper

outside plate and the lower outside plate.

The above integrated circuit (2) installed on the board (2a) is

composed of the circuit element (2b) with 1 body of several

transistors, resistance, memory, etc. and the wiring (2c) installed on

the board (2a) and connected with the circuit element (2b) for

outputting electric signal or supplying weak electricity.

The above coils (3) can be formed as manifold winding or cut images for generating more current by the changes of magnetism

from the magnetic field.

The above board protecting plate (6) installed on the upper part

of the lower outside plate (4) forms a hole on the board or a groove

(6a), the same size as the board (2a) of integrated circuit (2) on the

part where the integrated circuit (2) is located.

It is desirable for the thickness of the board protecting plate (6)

to be same as the sum of the board (2a) thickness of the integrated

circuit (2) and the protruded thickness of the wiring (2c).

Circuit element protecting plate (7) installed on the upper part

of the board protecting plate (6) forms a hole for installing circuit

elements and a groove (7a), the same size as the board (2a) of the

integrated circuit (2).

It is desirable that the thickness of the above circuit element

protecting plate (7) is the same as the height of the circuit element

(2b) protruded to the upper part from the board (2a) of the

integrated circuit (2).

Each of the board protecting plates (6) where the integrated

circuit (2) is located, and the circuit element protecting plate (7)

makes a separate hole (6a, 7a), the same size as the board (2a) and the circuit element (2b).

After installing the above board protecting plate (6) on the

lower outside plate (4), the board (2a) of the integrated circuit (2) is

inserted into the hole (6a) formed on the board protecting plate (6).

Circuit element protecting board (7) is installed on the board

protecting plate (6) by installing tightly wound coils (3) or cut on the

board protecting plate (6), sticking the cut-section of the coils (3) to

the wiring (2c) of the integrated circuit (2) and inserting the circuit

element (2b) of the integrated circuit (2) into the hole or groove (7a)

formed on the circuit element protecting board (7) of the board

protecting plate (6).

The integrated circuit chip card (1) is manufactured by installing

the upper outside plate (5) on the circuit element protecting board

(7) and compressing the lower outside plate (4) and the upper

outside plate (5).

Even though the integrated circuit chip card ( 1) can be

manufactured easily by applying an adhesive on the contact surfaces

of the upper outside plate (5) and the lower outside plate (4), the

board protecting plate (6) and the circuit element protecting board

(7) compress together, allowing it's thickness to increase. It can be simply manufactured using synthetic resins as

materials for the upper outside plate (5) and the lower outside plate

(4), the board protecting plate (6) and the circuit element protecting

board (7) by heating and compressing method.

Therefore, the integrated circuit chip card and its manufacturing

method of this invention can protect the integrated circuit, removing

the protrusion caused by the integrated circuit of the finished card.

UTILITY

The integrated circuit chip card and its manufacturing method of

this invention can prevent the cut or twist of the coil, made in the

course of compressing the upper and the lower outside plates

without curving the cut-section of coil.

Also by removing the protrusion on the plane of the finished the

integrated circuit chip card, the card' s durability can be extended.

More advantages are as follows.

The thickness of the whole card is thin and regular compared

with existing cards and space occurring due to the protrusion part of

the inner card and margins of cards or extreme separation are

prevented.

Claims

WHAT IS CLAIMED IS;

1. For the integrated circuit chip card, which the integrated circuit

and the coils composed of board, circuit element and wiring are

installed in between the lower and the upper outside plates,

the board protecting plate installed on the upper part of the lower

outside plate forms a hole or a groove on the board, the same size

as the board of the integrated circuit on the part where the

integrated circuit is located.

The integrated circuit chip card installed on the upper part of the

board protecting plate for inserting the circuit element of the

integrated circuit includes the integrated circuit protecting plate

which forms a hole for installing the circuit element and a groove,

the same size as the board of the integrated circuit.

2. For claim 1,

as far as the thickness of the board protecting plate, this integrated

circuit chip card features its allowable margin and thickness of this

integrated circuit board within 0 - 0.1 mm.

3. For claim 1 or claim 2, as far as the thickness of the board protecting plate, this integrated

circuit chip card features its allowable margin between the thickness

of the board of the integrated circuit and the sum of protruded

thickness of wiring within 0 ~ 0.15 mm.

4. For claim 1 ,

as far as the thickness of the circuit element protecting plate, this

integrated circuit chip card features its allowable margin and height

of the protruded circuit element to upper part on the integrated

circuit within 0 - 0.1 mm.

5. For this integrated circuit chip card which the integrated circuit

protecting plate protecting the circuit element of the integrated

circuit and board protecting plate protecting the board of the

integrated circuit are installed in between the upper and the lower

outside plates,

the integrated circuit chip card is manufactured by forming a

separate hole or groove, the same size of the board and the circuit

element,

inserting the board of the integrated circuit into the hole formed on the board protecting plate after installing the above board protecting

plate on the lower outside plate,

installing tightly wound coils or cut on the board protecting plate,

sticking the cut-section of the coils to the wiring of the integrated

circuit inserting the circuit element of the integrated circuit into the

hole or groove formed on the circuit element protecting board of the

board protecting plate,

installing the upper outside plate on the circuit element protecting

board and compressing the lower outside plate and the upper

outside plate.