WO2001016484A9 - A magnetically-assisted shape memory alloy actuator - Google Patents
A magnetically-assisted shape memory alloy actuatorInfo
- Publication number
- WO2001016484A9 WO2001016484A9 PCT/IB2000/001729 IB0001729W WO0116484A9 WO 2001016484 A9 WO2001016484 A9 WO 2001016484A9 IB 0001729 W IB0001729 W IB 0001729W WO 0116484 A9 WO0116484 A9 WO 0116484A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sma
- sma member
- magnet
- actuator
- magnetically
- Prior art date
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 title description 123
- 239000000696 magnetic material Substances 0.000 claims abstract description 61
- 238000004891 communication Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 48
- 229910000734 martensite Inorganic materials 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 7
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 229910001000 nickel titanium Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 24
- 230000008859 change Effects 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 230000007704 transition Effects 0.000 description 11
- 239000012530 fluid Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000004377 microelectronic Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 229910001047 Hard ferrite Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910000828 alnico Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000018199 S phase Effects 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910001035 Soft ferrite Inorganic materials 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- DSMZRNNAYQIMOM-UHFFFAOYSA-N iron molybdenum Chemical compound [Fe].[Fe].[Mo] DSMZRNNAYQIMOM-UHFFFAOYSA-N 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- WJZHMLNIAZSFDO-UHFFFAOYSA-N manganese zinc Chemical compound [Mn].[Zn] WJZHMLNIAZSFDO-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
- F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
- F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
- F03G7/061—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
- F03G7/0614—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element using shape memory elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
- F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
- F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
- F03G7/061—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
- F03G7/0614—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element using shape memory elements
- F03G7/06147—Magnetic shape memory alloys, e.g. ferro-magnetic alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
- F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
- F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
- F03G7/062—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the activation arrangement
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03G—SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
- F03G7/00—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
- F03G7/06—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
- F03G7/061—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
- F03G7/0616—Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element characterised by the material or the manufacturing process, e.g. the assembly
Definitions
- the present invention is directed to an actuator and, more particularly, to a
- a shape memory alloy is a material which has the ability to transition
- SMA is cold, that is, when the SMA is below its phase transition temperature, it has a
- SMA materials are advantageous for use in micromachined actuators, also
- SMA actuating devices can provide
- actuators provide a relatively large force in a relatively small three-dimensional space.
- SMA microactuators provide the potential to be fabricated using
- MEMS microelectromechanical systems
- SMA actuators may be incorporated on a substrate with electronic circuitry to share the same power supply
- SMA microactuators typically use electrical current or heat
- SMA microactuators employ a biasing spring to bias the SMA in its deformed shape
- microactuators on an individual basis, thereby increasing overall fabrication costs of
- the present invention is directed to an actuator.
- the actuator includes an
- the actuator includes a second magnet
- the present invention is directed to a relay.
- the relay
- SMA actuator connected to the substrate, and a moving contact connected to the magnetically-assisted SMA actuator and coupled to the fixed contact when the
- magnetically-assisted SMA actuator is in one of an actuated position and a non-
- SMA actuator is in another of the actuated position and the non-actuated position.
- the present invention is directed to a valve.
- the present invention is directed to a method of
- the method includes cooling the SMA member to a
- the present invention is directed to a method of
- the method includes
- the present invention is directed to a method of
- the method includes
- the SMA member is in another of the martensitic phase and the parent austenitic
- the present invention represents an advancement over relevant actuators in
- an actuator according to the present invention may be formed using batch
- Fig. 1 is a combination cross-sectional side-view and block diagram
- Fig. 2 is a combination cross-sectional side-view and block diagram
- FIG. 3 is a cross-sectional side-view of a microactuator according to another
- Fig. 4 is a cross-sectional side-view of the microactuator of Fig. 3 in the "ON"
- Fig. 5 is a combination cross-sectional side-view and block diagram
- Fig. 6 is a combination cross-sectional side-view and block diagram
- Fig. 7 is a cross-sectional side-view of a microrelay according to the present
- Fig. 8 is a cross-sectional side-view of the microrelay of Fig. 7 in the "OPEN"
- Fig. 9 is a cross-sectional side-view of a microrelay according to another
- Fig. 10 is a cross-sectional side-view of the microrelay of Fig. 9 in the
- Fig. 11 is a cross-sectional side-view of a microrelay according to another
- Fig. 12 is a cross-sectional side-view of the microrelay of Fig. 11 in the
- Fig. 13 is a cross-sectional side-view of a microvalve according to the present
- Fig. 14 is a cross-sectional side-view of the microvalve of Fig. 13 in the
- Fig. 15 is a cross-sectional side-view of a microvalve according to another
- Fig. 16 is a cross-sectional side-view of the microvalve of Fig. 15 in the
- Fig. 17 is a cross-sectional side-view of a microvalve according to another
- Fig. 18 is a top-view of the microvalve of Fig. 17.
- Figs. 1 and 2 illustrate a microactuator 10 according to the present invention in
- microactuator 10 includes a member 12, a magnetic material portion 14, a first magnet
- the magnetic material portion 14 is separated from the first magnet 16 by a distance
- microactuator 10 of the present invention may be used in any device
- remote actuation such as, for example, relays, valves, and pumps.
- the member 12 is constructed of a shape memory alloy (SMA) such as, for
- TiNi titanium nickel
- alloy material undergoes a thermoelastic phase transformation in passing from a
- phase change temperature range To realize a mechanical translation of such a phase
- the alloy possesses a particular crystalline structure, which allows the material to
- the SMA material remains deformed until
- the SMA member 12 is biased in its deformed shape by the magnetic attraction
- material portion 14 is attached to a surface of the SMA member 12, and may be, for
- a "soft" magnetic material such as, for example, nickel iron, nickel, or nickel
- the magnetic material portion 14 is a
- the magnetic material portion 14 may also be soft ferrites such
- nickel-zinc or manganese-zinc ferrites As described hereinbelow in
- portion 14 may also be a "hard”, or permanent, magnetic material such as, for
- the magnetic material portion 14 may also include an electromagnet.
- the magnetic material portion 14 may also include an electromagnet.
- the SMA member 12 is formed from a
- the SMA member 12 and the magnetic portion 14 may be
- the first magnet 16 and the first magnet 16 are identical to one embodiment of the present invention.
- magnet 16 may be, for example, a hard, or permanent, magnet or an electromagnet.
- the first magnet 16 is a permanent magnet
- the first magnet 16 may be constructed of, for example, AlNiCo, NdFeB, SmCo, hard ferrites
- the SMA member 12 may be heated, for example, using electrical current or
- Figs, land 2 illustrate an embodiment of the present invention using
- the power control 18 modulates the
- switch 22 controls whether electrical power is supplied to the SMA member 12.
- switch 22 may be eliminated if its function is, for example, performed by the power
- FIGS. 3 and 4 illustrate another embodiment of the present invention in which
- the SMA member 12 is heated by resistive heaters 24. According to one embodiment
- microactuator 10 illustrated in Figs. 3 and 4 are in the
- the SMA member 12 is in its parent austenitic phase and in its memory
- the illustrated embodiment includes an insulating layer 26 constructed of, for
- the resistive heaters 24 may be patterned on
- the insulating layer 26 using, for example, conventional microfabrication techniques,
- heaters 24 may be patterned directly on to the SMA member 12.
- the SMA member 12 may be patterned directly on to the SMA member 12.
- illustrated embodiment includes two resistive heaters 24, although more or less
- resistive heaters 24 may also be employed. The operation of the microactuator 10 will now be described with reference to
- the SMA member 12 is biased into its deformed state by the magnetic attraction
- first magnet 16 biased into its deformed shape by first magnet 16 as illustrated in Fig. 1.
- the SMA member 12 is
- the switch 22 is closed in Fig. 1 and open in Fig. 2.
- the SMA member 12 assumes the memory shape illustrated
- first magnet 16 are both hard magnetic materials and like polarized such that a repulsive force exists between the two.
- inventions may be fabricated by forming thin films on a substrate using conventional
- microfabrication techniques including sputtering of an SMA film to form the SMA
- the first magnet 16 may also be formed using
- microactuator 10 according to the present invention
- inventions may be fabricated using exclusively batch fabrication techniques.
- microactuator 10 of the present invention may be formed using, for example
- the SMA member 12 is
- the magnetic material portion 14 and the first magnet 16 may be realized where the
- Figs. 5 and 6 illustrate the microactuator 10 in the "OFF" (i.e., non-actuated)
- the microactuator 10 illustrated in Figs. 5 and 6 includes a
- second magnet 28 which may be, for example, an electromagnet, such as an electromagnet
- the second magnet 28 is located
- first magnet 16 may be below the second magnet 28 or interleaved
- the magnetic flux force of the second magnet 28 may be oriented to aid or
- the magnetic force of second magnet 28 may be
- the second magnet 28 may be turned off if the attractive force of the first magnet 16 is
- the second magnet 28 may be turned off.
- Fig. 5 In another embodiment of the microactuator 10 of the present invention, Fig. 5
- Fig. 6 illustrates the "OFF" (i.e., non-
- magnet 16 and magnetic material portion 14 are like polarized such that a repulsive
- the present invention is also directed to a microrelay employing a
- FIGs. 7 and 8 illustrate a microrelay 40
- the microrelay 40 is formed on a substrate 42.
- the substrate 42 is formed on a substrate 42.
- the substrate 42 may include a semiconductor material such as, for
- silicon GaAs, or SiGe
- a non-conducting material such as, for example, silicon, GaAs, or SiGe
- microrelay 40 include the SMA member 12, the magnetic material portion 14, and the
- the microrelay 40 includes a moving contact 44 and a pair of fixed
- the contacts 44, 46 may be any conducting material which ensures
- An insulator 48 may be
- the insulator 48 may
- silicon nitride silicon dioxide
- glass glass
- air or polymers such as, for
- the microrelay 40 further includes a support 50 to support the
- the support 50 is of sufficient mechanical structure to support the
- SMA member 12 may be constructed of, for example, metal, ceramic, or
- the microrelay 40 may be constructed using, for example, conventional
- SMA member 12 is in its martensitic phase, the attractive magnetic force between the
- the SMA member 12 may be heated by, for example, electrical current flowing
- the SMA member 12 in another embodiment of the present invention, the SMA member 12
- Fig. 7 is in its parent austenitic phase and in its martensitic phase in Fig.
- the SMA member 12 is
- the magnetic material portion 14 may be
- first and second substrates may be bonded together using conventional wafer bonding
- Figs. 9 and 10 illustrate another embodiment of a microrelay 40 according to
- the microrelay 40 illustrated in Figs. 9 and 10 includes a
- microactuator as described with respect to Figs. 5 and 6, having a second magnet 28
- the first magnet 16 may be positioned, for example,
- the first magnet 16 may be below
- the of the second magnet 28 may be oriented to aid or oppose the magnetic force of the
- the second magnet 28 may be formed on
- the substrate 42 using, for example, conventional MEMS fabrication techniques, conventional microelectronic fabrication techniques, or laminate-based fabrication
- the SMA member 12 in another embodiment of the present invention, the SMA member 12
- Fig. 9 is in its parent austenitic phase and in its martensitic phase in Fig.
- the SMA member 12 is
- an upper moving contact 52 is provided on the upper surface of the SMA member
- the upper moving contact 52 is in contact with the upper fixed
- the SMA member 12 illustrated in Fig. 11 is in its austenitic phase, and in
- Fig. 12 it is in its martensitic phase. According to this embodiment, as described
- the SMA member 12 is biased by a repulsive force between the first
- microrelay 40 In other embodiments of the microrelay 40 according to the present invention,
- moving contacts may be integrated with the SMA member 12.
- the present invention is also directed to a microvalve 60 employing a
- FIGs. 13 and 14 illustrate a microvalve 60 in the "CLOSED"
- the microvalve 60 is formed on the substrate 42.
- the microvalve 60 includes a number of ports 62, 63 defining openings in the
- fluid or gas may enter the microvalve 60
- openings 62 and 63 may be formed
- anisotropic etching of a silicon substrate etching of a glass substrate
- the microvalve 60 may further include
- the seal 64 may be constructed of, for example, metal or polymer such as, for
- the first magnet 16 may include, for example, a ring of
- the first magnet 16 comprises a number of small bar magnets 66 oriented around the
- the microvalve 60 may be formed on the substrate 42 using, for example
- the first magnet 16 biases the SMA member 12 to its deformed state, thereby causing the SMA member 12 to engage the
- the SMA member 12 cools, allowing it to be biased by the magnetic
- the SMA member 12 is biased by a repulsive force between the magnetic material
- member 12 illustrated in Fig. 13 is in its austenitic phase and in its martensitic phase
- Figs. 17 and 18 illustrate a microvalve 60 according to another embodiment of
- microvalve 60 includes one opening 62.
- the SMA member 12 is patterned to include
- Figs. 17 and 18 includes four arms 70, although in other embodiments of the present
- gas when the SMA member 12 is not engaged with the seal 64, gas may enter the microvalve 60 through the opening 62 and flow, as illustrated by arrow A
- the first magnet may include, for example, a number of bar magnets
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
- Reciprocating, Oscillating Or Vibrating Motors (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU22109/01A AU2210901A (en) | 1999-09-02 | 2000-08-30 | A magnetically-assisted shape memory alloy actuator |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38927499A | 1999-09-02 | 1999-09-02 | |
US09/389,274 | 1999-09-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2001016484A2 WO2001016484A2 (en) | 2001-03-08 |
WO2001016484A3 WO2001016484A3 (en) | 2002-01-17 |
WO2001016484A9 true WO2001016484A9 (en) | 2002-11-14 |
Family
ID=23537578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2000/001729 WO2001016484A2 (en) | 1999-09-02 | 2000-08-30 | A magnetically-assisted shape memory alloy actuator |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2210901A (en) |
WO (1) | WO2001016484A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2828000B1 (en) | 2001-07-27 | 2003-12-05 | Commissariat Energie Atomique | MAGNETIC ACTUATOR WITH MOBILE MAGNET |
DE10213671A1 (en) * | 2002-03-27 | 2003-10-23 | Karlsruhe Forschzent | Actuator for an optical-mechanical scanner and method using the actuator |
ITTO20020665A1 (en) * | 2002-07-26 | 2004-01-26 | Fiat Ricerche | ELECTRICITY GENERATOR |
KR20050018199A (en) | 2003-08-14 | 2005-02-23 | 삼성전자주식회사 | Variable capacity rotary compressor |
EP2270813B1 (en) * | 2009-06-29 | 2016-01-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Non-volatile memory |
DE102010010801B4 (en) | 2010-03-09 | 2013-02-21 | Eto Magnetic Gmbh | actuator |
US9897078B2 (en) | 2016-05-24 | 2018-02-20 | The Boeing Company | Bi-directional rotary shape memory alloy element actuator assemblies, and systems and methods including the same |
US10428805B2 (en) | 2016-09-14 | 2019-10-01 | The Boeing Company | Shape memory alloy actuators with heat transfer structures, actuated assemblies including the shape memory alloy actuators, and methods of manufacturing the same |
US10612867B2 (en) | 2018-02-21 | 2020-04-07 | The Boeing Company | Thermal management systems incorporating shape memory alloy actuators and related methods |
US11143170B2 (en) | 2019-06-28 | 2021-10-12 | The Boeing Company | Shape memory alloy lifting tubes and shape memory alloy actuators including the same |
US11525438B2 (en) | 2019-06-28 | 2022-12-13 | The Boeing Company | Shape memory alloy actuators and thermal management systems including the same |
US11168584B2 (en) | 2019-06-28 | 2021-11-09 | The Boeing Company | Thermal management system using shape memory alloy actuator |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4544988A (en) * | 1983-10-27 | 1985-10-01 | Armada Corporation | Bistable shape memory effect thermal transducers |
US5176544A (en) * | 1989-06-21 | 1993-01-05 | Johnson Service Company | Shape memory actuator smart connector |
SE464160B (en) * | 1989-07-07 | 1991-03-11 | Jan Cederstroem | DEVICE FOR THE FITTING OF LID ON CABLES FOR SEMI-CONDUCT CIRCUITS |
-
2000
- 2000-08-30 WO PCT/IB2000/001729 patent/WO2001016484A2/en active Application Filing
- 2000-08-30 AU AU22109/01A patent/AU2210901A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU2210901A (en) | 2001-03-26 |
WO2001016484A2 (en) | 2001-03-08 |
WO2001016484A3 (en) | 2002-01-17 |
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