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WO2000066998A2 - Procede et dispositif permettant de saisir une image d'une surface essentiellement cylindrique - Google Patents

Procede et dispositif permettant de saisir une image d'une surface essentiellement cylindrique Download PDF

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Publication number
WO2000066998A2
WO2000066998A2 PCT/AT2000/000104 AT0000104W WO0066998A2 WO 2000066998 A2 WO2000066998 A2 WO 2000066998A2 AT 0000104 W AT0000104 W AT 0000104W WO 0066998 A2 WO0066998 A2 WO 0066998A2
Authority
WO
WIPO (PCT)
Prior art keywords
image
round optics
sensor
optical sensor
optics
Prior art date
Application number
PCT/AT2000/000104
Other languages
German (de)
English (en)
Other versions
WO2000066998A8 (fr
WO2000066998A3 (fr
WO2000066998A9 (fr
Inventor
Gerhard Kucera
Michael Rudolf
Hubert Keller
Franz Seiser
Original Assignee
Festo Gesellschaft M.B.H.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Festo Gesellschaft M.B.H. filed Critical Festo Gesellschaft M.B.H.
Priority to AU39462/00A priority Critical patent/AU3946200A/en
Publication of WO2000066998A2 publication Critical patent/WO2000066998A2/fr
Publication of WO2000066998A3 publication Critical patent/WO2000066998A3/fr
Publication of WO2000066998A9 publication Critical patent/WO2000066998A9/fr
Publication of WO2000066998A8 publication Critical patent/WO2000066998A8/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/954—Inspecting the inner surface of hollow bodies, e.g. bores
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/952—Inspecting the exterior surface of cylindrical bodies or wires

Definitions

  • the invention relates to a method for detecting an image of a substantially cylindrical surface, such as surface of a ⁇ cavity and outer jacket of a substantially cylindrical workpiece.
  • image processing denotes the interpretation of an image, object or scene by using contactless sensors with the aim of obtaining information, monitoring machines or processes or checking workpieces.
  • An image processing system usually consists of the components: lighting, Sensor technology with optics, image digitization / image processing and image evaluation / generation of identification and control data.
  • CCD cameras are the most widespread as imaging sensors.
  • the semiconductor CCD cameras have become very cheap, small and light. They are available as a matrix sensor (2D arrangement, usually 780x580 pixels) and also as a line sensor (1D arrangement, from 256 to 8000 pixels).
  • Image processing is used to process the captured image so that it can be evaluated in the subsequent stages with relatively little effort. Here the image is rectified, the noise and redundant redundancies eliminated by data compression.
  • the pre-processed image is evaluated, errors classified or objects identified, which is done using appropriately programmed computers. Intelligent evaluation algorithms such as neural networks or fuzzy logic are often used here.
  • the present invention relates to the use of an image processing system in the field of surface inspection of - preferably finished - workpieces and specifically relates only to the image acquisition part of such an image processing system.
  • An image processing system offers decisive advantages especially in the field of surface inspection: It inspects objectively, reproducibly, fatigue-free and regardless of the condition of the staff.
  • an image acquisition unit and an image evaluation unit the image acquisition unit having all-round optics, which detects light from the entire circumference of the cylindrical surface and projects it onto an optical sensor, the all-round optics and cylindrical surface being moved relative to one another and after completion of a predeterminable movement path Partial image of the surface that has just been captured by the sensor is stored by the image evaluation unit and all partial images are combined to form an overall image of the surface and the all-round optics and cylindrical surface are continuously moved relative to one another.
  • the speed of the relative movement between the all-round optics and the surface is chosen to be the same throughout.
  • the surface is kept still and the all-round optics is moved further relative to the surface.
  • This variant is particularly suitable for workpieces that are large and / or heavy compared to the all-round optics and therefore can only be moved with greater effort than these.
  • the optical sensor is held stationary with respect to the all-round optics and the light detected by the all-round optics. preferably using optical fibers or mirror systems, is projected onto the optical sensor.
  • the spatial separation of the all-round optics and sensor thus achieved means that the part of the image acquisition unit to be moved can be manufactured with very small geometric dimensions.
  • the optical sensor in contrast to the embodiment just mentioned, provision can also be made for the optical sensor to be rigidly connected to the all-round optics and to be moved together with the latter in relation to the surface.
  • the all-round optics are held immovably and the surface is moved further relative to the all-round optics.
  • This design variant should be selected in particular if the surface whose image is to be captured is that of an endless strand of workpieces, e.g. an extruded plastic strand, a glass strand or the like.
  • the image evaluation unit recognizes defects in the surface by comparing the overall surface image with a reference image.
  • Another object of the invention is to provide a device of the simplest possible design for carrying out the method just discussed. According to a first variant of the invention, this is achieved by an image acquisition unit and an image evaluation unit, the image acquisition unit having all-round optics, which detects light from the entire circumference of the cylindrical surface and projects it onto an optical sensor, the all-round optics and cylindrical surface being held movable relative to one another and the optical sensor is a ring sensor.
  • an image acquisition unit and an image evaluation unit the image acquisition unit having all-round optics, which detects light from the entire circumference of the cylindrical surface and projects it onto an optical sensor, the all-round optics and cylindrical surface being kept movable relative to one another and optical sensor is a matrix sensor.
  • the optical sensor is implemented in CMOS technology or in CCD technology. Both technologies show sufficient for the application area in question
  • the all-round optics and, if appropriate, the optical sensor are fixed on a linear drive that can be moved continuously.
  • the linear drive is formed by an electrical spindle drive, since such drives can be produced in a relatively simple manner with the travel accuracy required in the context in question.
  • Spindle drive is formed by an electrical stepper or servo motor, because such drives are particularly easy to control.
  • Such a drive also has the necessary travel accuracy.
  • FIG. 1 shows a block diagram of a device according to the invention
  • FIG. 6 shows the overall picture of the bore according to FIG. 5;
  • FIG. 7 shows the circuit diagram of an image capturing component 9 which is held in CMOS technology
  • Fig.l is a block diagram of an inventive device for inspecting the
  • Outer surface of cylindrical workpieces, according to the principle of the invention be recorded.
  • the basic structure of the necessary devices is the same.
  • a device suitable for inspecting cavity surfaces is therefore described below.
  • such a device essentially comprises two main components, namely on the one hand the image acquisition unit 1 and on the other hand the image evaluation unit 2.
  • the image capturing unit 1 has all-round optics 6, which captures light from the entire circumference of the cylindrical surface 13 and projects it onto an optical sensor 8, 8 '(see FIG. 2, 3).
  • the electrical output of this sensor 8, 8 ' is connected to the image evaluation unit 2.
  • Cavity could be projected onto it, rather only a section - which, as explained in more detail below, a ring disk-shaped, the entire circumference
  • Section of the surface is to be projected onto it.
  • Partial images are combined into a total image of the surface in a manner also described below.
  • This linear drive 4 can be of any design, for example, a
  • Spindle drive threaded spindle is rotatably driven about its longitudinal axis, slide 5 has an internal thread which is penetrated by the threaded spindle) or a pneumatic linear drive (smooth-running pneumatic cylinder, its free
  • Piston rod end forms the carriage 5) can be specified.
  • Threaded spindle is preferably carried out by an electrical step or
  • all-round optics is understood in connection with FIG. 1 to be an objective which, due to its design, is permeable to any light which is incident on it in a plane running approximately normal to its geometric axis of symmetry 7 (see FIG. 2)
  • the relative movement between surface 13 and all-round optics 6 is here achieved in that the surface 13 or the workpiece on which this surface 13 is located is kept still and the all-round optics 6 is moved relative to the surface 13.
  • Another component of the image acquisition unit 1 is the optical sensor 8, 8 'onto which the light passing through the all-round optics 6 is projected.
  • image sensors are known per se and are designed, for example, as ring sensors 8 or as surface or matrix sensors 8 '.
  • This sensor is particularly preferably designed as a ring sensor 8, which means that its individual image acquisition components 9 are arranged in a ring.
  • these image acquisition components 9 are fixed on the lateral surface of a cylindrical support 10, as shown in FIG. With this design, the light incident through the all-round optics 6 does not need to be deflected, but can be made to fall directly on the sensor 8.
  • Both types of ring sensors 8 only have a single image line, so that, in contrast to surface sensors 8 '(cf. FIG. 4 a), they cannot detect a larger image, but only an image line.
  • the image acquisition components 9 are arranged in the form of a rectangular matrix, so that a larger-area image can be projected onto this sensor design. Both sensor designs can be used according to the invention, which will be explained further below.
  • the sensor 8, 8 ′ could also be at the tip of the endoscope 3, namely within the all-round optics 6.
  • the electrical signals generated by it and corresponding to the light incident on the sensor 8, 8 ′ must then be forwarded to the image processing unit 2 by means of corresponding electrical lines 24.
  • the sensor 8,8 'could be fixed outside the all-round optics 6, for example at the other end of the endoscope 3 or otherwise on the slide 5 of the linear drive 4 his.
  • the light incident through the all-round optics 3 would have to be fed to the sensor 8,8 ', which can be done, for example, by means of light guides or mirror systems.
  • the endoscope 3 can be designed with a smaller diameter, so that it can also be used for the inspection of narrower cavities.
  • Illumination of the cavity is also provided, which is preferably also fixed on the endoscope 3.
  • FIG. 5 shows only the surface 13 of a hole, but not the workpiece within which this hole is actually made.
  • the particularly preferred embodiment of the sensor 8 as a CMOS ring sensor is also assumed: the endoscope 3 comprising at least the all-round optics 6, possibly also the CMOS ring sensor 8, is pushed into the hole to be inspected along its axis of symmetry 14.
  • the image processing unit 2 has the components clocked in FIG. 1, switches 16, intermediate storage 17 and total image storage 18.
  • Each image capturing component 9 of the sensor 8 delivers a value, the size of which corresponds to the intensity of the image capturing in question.
  • Component 9 corresponds to falling light.
  • intermediate values 17 are combined to form an overall image 21 of the surface, simply by storing the values of each surface section
  • the endoscope 3 is moved further into the bore until the ring sensor 8 lies at the level of a second section 20 and the ring sensor 8 is read out again. Then the endoscope 3 is moved again and the ring sensor
  • Ring sensor 8 is detected, which is combined by the downstream image processing unit 2 to form an entire, leveled image of the surface (see FIG. 6).
  • the height h of each detected strip-shaped section 15, 20, 22 of the surface 13 is as high as one
  • the speed of the relative movement is preferably between
  • All-round optics 6 and surface 13 are consistently chosen to be of the same height, so that there is a continuous movement (see FIG.
  • Relative movement is reduced for the duration of the storage of a partial image (cf.
  • the CMOS ring sensor 8 is therefore read out each time a path corresponding to the pixel height h is covered, but without stopping the endoscope 3.
  • Component that is a pixel of the CMOS ring sensor 8, is shown in FIG. such
  • CMOS sensors have about 120 dB, which allows detailed recordings even in high-contrast environments
  • CCD sensors on the other hand, only have 70 to a maximum of 80dB. This significantly higher modulation range makes it easier to identify defects on reflective surfaces, such as those that can occur during die inspection in die-cast parts.
  • CMOS sensors do not show the blooming effect that occurs with CCD sensors if a very bright light beam remains in the same place for too long. Pixels saturated by the intense lighting can no longer hold their charge, so that they flow to neighboring pixels and also saturate them. The image information of the affected pixels is lost.
  • the sampling frequency i.e. the frequency with which the ring sensor 8 is read out can be directly proportional to the travel speed of the endoscope 3.
  • the displacement sensor 19 is connected to the linear drive 4. This displacement sensor 19 triggers the switch 16 by one pixel height each time the endoscope 3 is moved, so that the image evaluation device 2 is caused to read out the ring sensor 8.
  • An advantage of this triggered scanning is that the travel speed of the endoscope 3 can be freely selected within wide limits. Thus, e.g. in blind holes are gently braked without changing the resolution in the captured image. If the coupling of the covered endoscope path and scanning is made changeable, i.e. the length of the path, after which a new scan has to be carried out, is kept changeable, the recorded image can be given a variable resolution: if the endoscope path between two scans is increased, the resolution of the image in this area is reduced, conversely, the endoscope path between two scans is reduced, the resolution of the image increases. Areas of the hole that are of no interest (e.g. because experience has shown that surface defects do not occur there or because defects in such areas are less interesting for assessing the quality of the hole) can be scanned with reduced resolution and at a higher speed.
  • the processing of the overall image 21 of the surface i.e. its examination for any existing defects in the bore surface 13 is carried out by the image evaluation unit 2, which, in addition to the total memory 18, comprises a computer on which corresponding image processing software runs, which recognizes defects in the surface by comparing the overall surface image with a reference image.
  • the image evaluation unit 2 which, in addition to the total memory 18, comprises a computer on which corresponding image processing software runs, which recognizes defects in the surface by comparing the overall surface image with a reference image.
  • the optical sensor 8,8 ' can be arranged in the immediate vicinity of the all-round optics 6 and its outputs can be connected to the image evaluation device 2 by means of electrical lines 24, or an objectionable arrangement of the all-round optics 6 and the sensor 8,8' can be provided, the the light passing through the all-round optics 6 is fed to the sensor 8.8 'by means of light guides and / or mirror systems.
  • the principle according to the invention can also be used to record the image of the outer lateral surface of a cylindrical body.
  • FIG. 1 An image acquisition unit 1 suitable for this is shown in FIG. The most significant difference from the previously discussed device for recording the image of a cavity surface lies in the other design of the all-round optics 6.
  • a plane mirror 30 is arranged above the desk mirror 25, which is arranged inclined to the optical axis of the desk mirror 25 and serves to deflect the light coming from the desk mirror 25 onto the sensor 8,8 '.
  • the optical sensor 8, 8 ' is arranged behind the objective 31.
  • the workpiece 28 is illuminated by a plurality of light beams 32, 32 'surrounding the workpiece 28 in an annular manner, the angle of incidence of the light beams 32, 32' on the surface 13 of the workpiece 28, with respect to the optical axis 7, being not equal to 90 °, so that do not place the light beams 32, 32 'and the optical axis 7 perpendicular to one another, but the light beams penetrate the optical axis at an angle.
  • the desk mirror 25 can be translucent in a suitable manner in the area of incidence of the light beams 32, 32 'so that the light beams 32, 32' surrounding the workpiece 28 penetrate the desk mirror 25 and the semi-transparent mirror surface 26 and within a certain width on the entire circumferential surface Fall surface of the workpiece 28 and there scan a more or less narrow surface ring.
  • the workpiece 28 is illuminated in a ring laterally above the desk mirror 25. From there, the light is reflected onto the mirror surface 26 or scattered light reaches where the reflected light 33, 33 'falls upwards onto the plane mirror 30, which contains the light throws on the lens 31, which bundles the light and images it according to the imaging scale on the sensor 8,8 '.
  • this sensor 8, 8 ' can either be designed as a single-line ring sensor 8 (FIG. 9a) or by a matrix sensor 8' (FIG. 9b), the technology of the sensor being selectable in each case. however, CMOS or CCD sensors are preferably used, in particular ring sensors held in CMOS technology.
  • the individual partial images When using ring sensors 8, the individual partial images again have a height h corresponding to the pixel height p of these sensors 8; when using surface sensors 8 ', the individual partial images can be wider. Corresponding to the width of the surface section that can be projected onto the sensor 8, 8 ′,
  • the workpiece 28 in order to achieve the relative movement between surface 13 and all-round optics 6, the workpiece 28 can also be held immovably and the all-round optics 6 can be moved, for which purpose the latter on the carriage 5
  • Linear drive 4 is fixed.
  • the components of the plane mirror 30, lens 31 and sensor 8, 8 ' can also be kept movable, that is, they can also be fixed on the slide 5 of the linear drive 4, or they can also lie outside the linear drive 4, that is, they can be held immovably with respect to the all-round optics 6.
  • All-round optics 6 can also be designed in any other design.
  • the light beams can also be passed on by means of light guides.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Procédé et dispositif permettant de saisir une image d'une surface (13) essentiellement cylindrique, telle que la surface d'un espace creux ou la paroi externe d'une pièce essentiellement cylindrique. Ledit dispositif comporte une unité de saisie (1) d'images et une unité d'évaluation (2) d'images. L'unité de saisie (1) d'images comporte une optique (6) panoramique qui détecte la lumière provenant de la circonférence entière de la surface cylindrique (13) et la projette sur un capteur optique (8). L'optique (6) panoramique et la surface cylindrique (13) peuvent être déplacées l'une par rapport à l'autre et une fois un déplacement prédéterminé accompli, l'image partielle de la surface venant d'être saisie par le capteur (8) est mise en mémoire par l'unité d'évaluation (2) d'images. Toutes les images partielles sont réunies en une image complète de la surface. L'optique (6) panoramique et la surface cylindrique (13) sont déplacées sans interruption l'une par rapport à l'autre.
PCT/AT2000/000104 1999-04-30 2000-04-26 Procede et dispositif permettant de saisir une image d'une surface essentiellement cylindrique WO2000066998A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU39462/00A AU3946200A (en) 1999-04-30 2000-04-26 Method and device for detecting an image of an essentially cylindrical surface

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA779/99 1999-04-30
AT77999A AT408385B (de) 1999-04-30 1999-04-30 Verfahren und vorrichtung zur erfassung eines abbildes einer im wesentlichen zylindrischen oberfläche

Publications (4)

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WO2000066998A2 true WO2000066998A2 (fr) 2000-11-09
WO2000066998A3 WO2000066998A3 (fr) 2001-04-12
WO2000066998A9 WO2000066998A9 (fr) 2002-08-29
WO2000066998A8 WO2000066998A8 (fr) 2004-04-15

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PCT/AT2000/000104 WO2000066998A2 (fr) 1999-04-30 2000-04-26 Procede et dispositif permettant de saisir une image d'une surface essentiellement cylindrique

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AT (1) AT408385B (fr)
AU (1) AU3946200A (fr)
WO (1) WO2000066998A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005059530A1 (fr) * 2003-12-12 2005-06-30 Focke & Co. (Gmbh & Co. Kg) Procede et dispositif pour tester la surface d'un boudin de matiere en mouvement dans l'industrie du tabac
EP1582068A2 (fr) * 2002-12-03 2005-10-05 OG Technologies, Inc. Appareil et procede de detection de defauts de surface sur une piece telle qu'une barre metallique laminee et/ou etiree
US7460703B2 (en) 2002-12-03 2008-12-02 Og Technologies, Inc. Apparatus and method for detecting surface defects on a workpiece such as a rolled/drawn metal bar
US9759670B2 (en) 2014-12-23 2017-09-12 Mitutoyo Corporation Bore imaging system
US9880108B2 (en) 2014-12-23 2018-01-30 Mitutoyo Corporation Bore imaging system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007031358B4 (de) 2007-07-05 2023-03-16 Jenoptik Industrial Metrology Germany Gmbh Vorrichtung zur Abbildung der Innenfläche eines zylindrischen Hohlraums

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US5004339A (en) * 1979-02-27 1991-04-02 Diffracto Ltd. Method and apparatus for determining physical characteristics of objects and object surfaces
US5126872A (en) * 1987-12-10 1992-06-30 Birkle Sensor Gmbh & Co. Apparatus for optically scanning the surface of an object whose surface is capable of reflecting or scattering light
DE19713973A1 (de) * 1997-04-04 1998-10-15 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum optischen Prüfen der Mantelfläche zylindrischer Körper

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US4072427A (en) * 1976-07-28 1978-02-07 Bell Telephone Laboratories, Incorporated Fault inspection system
US5004339A (en) * 1979-02-27 1991-04-02 Diffracto Ltd. Method and apparatus for determining physical characteristics of objects and object surfaces
US5126872A (en) * 1987-12-10 1992-06-30 Birkle Sensor Gmbh & Co. Apparatus for optically scanning the surface of an object whose surface is capable of reflecting or scattering light
DE19713973A1 (de) * 1997-04-04 1998-10-15 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum optischen Prüfen der Mantelfläche zylindrischer Körper

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PATENT ABSTRACTS OF JAPAN vol. 1997, no. 11, 28. November 1997 (1997-11-28) & JP 09 196856 A (TSUBAKIMOTO CHAIN CO), 31. Juli 1997 (1997-07-31) -& US 5 905 595 A (TSUBAKIMOTO CHAIN CO) 18. Mai 1999 (1999-05-18) *
SOUTHWELL D ET AL: "A CONICAL MIRROR PIPELINE INSPECTION SYSTEM" MINNEAPOLIS, APR. 22 - 28, 1996,NEW YORK, IEEE,US, Bd. CONF. 13, 22. April 1996 (1996-04-22), Seiten 3253-3258, XP000773177 ISBN: 0-7802-2989-8 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1582068A2 (fr) * 2002-12-03 2005-10-05 OG Technologies, Inc. Appareil et procede de detection de defauts de surface sur une piece telle qu'une barre metallique laminee et/ou etiree
EP1582068A4 (fr) * 2002-12-03 2008-04-23 Og Technologies Inc Appareil et procede de detection de defauts de surface sur une piece telle qu'une barre metallique laminee et/ou etiree
US7460703B2 (en) 2002-12-03 2008-12-02 Og Technologies, Inc. Apparatus and method for detecting surface defects on a workpiece such as a rolled/drawn metal bar
US7627163B2 (en) 2002-12-03 2009-12-01 Og Technologies, Inc. Apparatus and method for detecting surface defects on a workpiece such as a rolled/drawn metal bar
WO2005059530A1 (fr) * 2003-12-12 2005-06-30 Focke & Co. (Gmbh & Co. Kg) Procede et dispositif pour tester la surface d'un boudin de matiere en mouvement dans l'industrie du tabac
US9759670B2 (en) 2014-12-23 2017-09-12 Mitutoyo Corporation Bore imaging system
US9880108B2 (en) 2014-12-23 2018-01-30 Mitutoyo Corporation Bore imaging system

Also Published As

Publication number Publication date
AT408385B (de) 2001-11-26
WO2000066998A8 (fr) 2004-04-15
AU3946200A (en) 2000-11-17
ATA77999A (de) 2001-03-15
WO2000066998A3 (fr) 2001-04-12
WO2000066998A9 (fr) 2002-08-29

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