[go: up one dir, main page]

WO2000060645A3 - Dual cmp pad conditioner - Google Patents

Dual cmp pad conditioner Download PDF

Info

Publication number
WO2000060645A3
WO2000060645A3 PCT/US2000/008340 US0008340W WO0060645A3 WO 2000060645 A3 WO2000060645 A3 WO 2000060645A3 US 0008340 W US0008340 W US 0008340W WO 0060645 A3 WO0060645 A3 WO 0060645A3
Authority
WO
WIPO (PCT)
Prior art keywords
pad
pad conditioner
dispense
cmp pad
conditioning
Prior art date
Application number
PCT/US2000/008340
Other languages
French (fr)
Other versions
WO2000060645A2 (en
Inventor
Albert H Liu
Landon Vines
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Priority to EP00919823A priority Critical patent/EP1190455A2/en
Priority to AU40444/00A priority patent/AU4044400A/en
Priority to KR1020007013508A priority patent/KR20010071353A/en
Priority to JP2000610047A priority patent/JP2002540972A/en
Publication of WO2000060645A2 publication Critical patent/WO2000060645A2/en
Publication of WO2000060645A3 publication Critical patent/WO2000060645A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

According to an example embodiment, the present invention is directed to a CMP polishing apparatus (100) having at least two conditioning arms (110+120) for use in conditioning a polishing pad (150). The CMP polishing apparatus includes a first pad conditioner (130) configured and arranged both to dispense slurry and to condition the pad. A second pad conditioner (140) is configured and arranged both to clean a portion of the polishing pad (150) and to dispense cleaning chemicals. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.
PCT/US2000/008340 1999-04-01 2000-03-29 Dual cmp pad conditioner WO2000060645A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP00919823A EP1190455A2 (en) 1999-04-01 2000-03-29 Dual cmp pad conditioner
AU40444/00A AU4044400A (en) 1999-04-01 2000-03-29 Dual cmp pad conditioner
KR1020007013508A KR20010071353A (en) 1999-04-01 2000-03-29 Dual cmp pad conditioner
JP2000610047A JP2002540972A (en) 1999-04-01 2000-03-29 Double CMP pad adjustment device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28371699A 1999-04-01 1999-04-01
US09/283,716 1999-04-01

Publications (2)

Publication Number Publication Date
WO2000060645A2 WO2000060645A2 (en) 2000-10-12
WO2000060645A3 true WO2000060645A3 (en) 2002-01-17

Family

ID=23087250

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/008340 WO2000060645A2 (en) 1999-04-01 2000-03-29 Dual cmp pad conditioner

Country Status (6)

Country Link
EP (1) EP1190455A2 (en)
JP (1) JP2002540972A (en)
KR (1) KR20010071353A (en)
CN (1) CN1362907A (en)
AU (1) AU4044400A (en)
WO (1) WO2000060645A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW495416B (en) * 2000-10-24 2002-07-21 Ebara Corp Polishing apparatus
JP2004514300A (en) * 2000-11-29 2004-05-13 インフィネオン　テクノロジーズ　アクチエンゲゼルシャフト Cleaning apparatus for cleaning a polishing cloth used for polishing a semiconductor wafer
DE10308064B4 (en) * 2003-02-26 2006-03-09 Infineon Technologies Ag Polishing agent supply in CMP processes
US7125324B2 (en) * 2004-03-09 2006-10-24 3M Innovative Properties Company Insulated pad conditioner and method of using same
KR20110065464A (en) * 2008-08-14 2011-06-15 어플라이드 머티어리얼스, 인코포레이티드 Chemical mechanical polishing apparatus and method having a mobile slurry distributor
US20100041316A1 (en) * 2008-08-14 2010-02-18 Yulin Wang Method for an improved chemical mechanical polishing system
US20100291840A1 (en) * 2009-05-12 2010-11-18 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for conditioning chemical mechanical polishing apparatus using multiple conditioning disks
CN102554782A (en) * 2010-12-20 2012-07-11 中芯国际集成电路制造(上海)有限公司 Polishing pad cleaning device and polishing pad finisher
US8920214B2 (en) * 2011-07-12 2014-12-30 Chien-Min Sung Dual dressing system for CMP pads and associated methods
US9149906B2 (en) * 2011-09-07 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for CMP pad conditioning
CN103182681A (en) * 2011-12-28 2013-07-03 青岛嘉星晶电科技股份有限公司 Rectifying device for millstone of double-sided grinder, and rectifying method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421768A (en) * 1993-06-30 1995-06-06 Mitsubishi Materials Corporation Abrasive cloth dresser
US5683289A (en) * 1996-06-26 1997-11-04 Texas Instruments Incorporated CMP polishing pad conditioning apparatus
WO1998045090A1 (en) * 1997-04-04 1998-10-15 Obsidian, Inc. Polishing media magazine for improved polishing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421768A (en) * 1993-06-30 1995-06-06 Mitsubishi Materials Corporation Abrasive cloth dresser
US5683289A (en) * 1996-06-26 1997-11-04 Texas Instruments Incorporated CMP polishing pad conditioning apparatus
WO1998045090A1 (en) * 1997-04-04 1998-10-15 Obsidian, Inc. Polishing media magazine for improved polishing

Also Published As

Publication number Publication date
WO2000060645A2 (en) 2000-10-12
CN1362907A (en) 2002-08-07
EP1190455A2 (en) 2002-03-27
AU4044400A (en) 2000-10-23
JP2002540972A (en) 2002-12-03
KR20010071353A (en) 2001-07-28

Similar Documents

Publication Publication Date Title
EP1055486A3 (en) Dressing apparatus and polishing apparatus
EP0870577A3 (en) Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
WO2000060645A3 (en) Dual cmp pad conditioner
AU1724400A (en) Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
WO2000000560A3 (en) Chemical mechanical polishing slurry and method for using same
CA2394626A1 (en) A cleaning wipe comprising low residue surfactant and hydrophilic polymer
AU4691800A (en) Method and system for cleaning a chemical mechanical polishing pad
SG66487A1 (en) Wafer polishing apparatus
WO2001078116A3 (en) System for the preferential removal of silicon oxide
SG80597A1 (en) Wafer polishing apparatus
AU8453298A (en) Polishing semiconductor wafers
AU2003274812A1 (en) Method for chemical mechanical polishing (cmp) of low-k dielectric materials
AU4977799A (en) Wafer cleaning apparatus
SG97909A1 (en) Fixed abrasive polishing tool
EP1075898A3 (en) Dresser and dressing apparatus
GB2368189B (en) Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP)
AU2001296997A1 (en) Slurry for chemical-mechanical polishing copper damascene structures
AU7851000A (en) Optimal offset, pad size and pad shape for cmp buffing and polishing
DE69831150D1 (en) Chemical-mechanical abrasive composition for semiconductor processing
EP1002626A3 (en) A linear CMP tool design using in-situ slurry distribution and concurrent pad conditionning
EP0842738A3 (en) Method of and apparatus for polishing and cleaning planar workpiece
ZA200110007B (en) Liquid abrasive cleaning compositions.
DE60017642D1 (en) Chemical-mechanical abrasive composition for semiconductor processing
GB2361447B (en) Wafer polishing apparatus
FR2776553B3 (en) GRINDING, CLEANING OR POLISHING TOOL THAT CAN BE ROTATED

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 00800898.1

Country of ref document: CN

AK Designated states

Kind code of ref document: A2

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2000919823

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020007013508

Country of ref document: KR

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 1020007013508

Country of ref document: KR

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

AK Designated states

Kind code of ref document: A3

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

WWP Wipo information: published in national office

Ref document number: 2000919823

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2000919823

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1020007013508

Country of ref document: KR