WO2000048435A9 - Method of plasma enhanced chemical vapor deposition of diamond - Google Patents
Method of plasma enhanced chemical vapor deposition of diamond Download PDFInfo
- Publication number
- WO2000048435A9 WO2000048435A9 PCT/US2000/003502 US0003502W WO0048435A9 WO 2000048435 A9 WO2000048435 A9 WO 2000048435A9 US 0003502 W US0003502 W US 0003502W WO 0048435 A9 WO0048435 A9 WO 0048435A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- diamond
- precursor
- methanol
- substrate
- carbon
- Prior art date
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 166
- 239000010432 diamond Substances 0.000 title claims abstract description 166
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 title claims description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims abstract description 156
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000002243 precursor Substances 0.000 claims abstract description 59
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 44
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000000151 deposition Methods 0.000 claims abstract description 31
- 150000001875 compounds Chemical class 0.000 claims abstract description 21
- 239000013078 crystal Substances 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 6
- 239000012705 liquid precursor Substances 0.000 claims abstract description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 51
- 230000008021 deposition Effects 0.000 claims description 29
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 28
- 229910052760 oxygen Inorganic materials 0.000 claims description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 26
- 229910052710 silicon Inorganic materials 0.000 claims description 26
- 239000010703 silicon Substances 0.000 claims description 26
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 23
- 239000001301 oxygen Substances 0.000 claims description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 21
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 17
- 239000011733 molybdenum Substances 0.000 claims description 17
- 229910052750 molybdenum Inorganic materials 0.000 claims description 17
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- 238000010494 dissociation reaction Methods 0.000 claims description 7
- 230000005593 dissociations Effects 0.000 claims description 7
- 239000002019 doping agent Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 230000001502 supplementing effect Effects 0.000 claims 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 5
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 abstract 1
- 238000001237 Raman spectrum Methods 0.000 description 18
- 239000007789 gas Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 15
- 238000000879 optical micrograph Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 9
- 239000006193 liquid solution Substances 0.000 description 9
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000011068 loading method Methods 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 5
- 230000002194 synthesizing effect Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- -1 diamond Chemical compound 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229910021398 atomic carbon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- UHZZMRAGKVHANO-UHFFFAOYSA-M chlormequat chloride Chemical compound [Cl-].C[N+](C)(C)CCCl UHZZMRAGKVHANO-UHFFFAOYSA-M 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- QFXZANXYUCUTQH-UHFFFAOYSA-N ethynol Chemical group OC#C QFXZANXYUCUTQH-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000004050 hot filament vapor deposition Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using DC or AC discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/277—Diamond only using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
Definitions
- the present invention relates to a method of synthesizing diamond.
- the present invention relates to a method of synthesizing diamond crystals
- CVD chemical vapor deposition
- crystal or film is grown on a substrate, which is usually maintained at a temperature
- Atomic hydrogen is believed to be crucial in the diamond CVD process. It is
- atomic hydrogen can be achieved at a varied percentage of molecular hydrogen in the
- a precursor comprising of acetylene and oxygen with a ratio of acetylene to oxygen
- atomic hydrogen is a burn product produced by the high temperature flame.
- atomic hydrogen there are
- OH and O radicals can play another role of atomic hydrogen in the diamond
- precursor or feedstock is a relative term depending on many other process parameters.
- Diamond has also been grown in a microwave plasma of a precursor comprising of an
- RF radio frequency
- water has a high freezing temperature making it
- the pure methanol vapor plasma contains a C/O/H
- filament temperature is much lower than that of energetic electrons in a plasma.
- hot-filament CVD of diamond in CO/H 2 mixtures has not been
- crystals and films can be deposited on large-area and/or irregularly shaped objects
- substrate temperatures to provide the deposition of high quality diamond.
- the present invention relates to a method of synthesizing
- a precursor comprising at least one carbon containing
- Such carbon containing compounds include
- the vaporized precursor comprises the same composition as the
- the substrate generally is sheet or wafer of silicon, copper, aluminum and
- the substrate is mounted on a water cooled
- the substrate can be either in touch with the plasma or at a distance
- the reactor chamber pressure generally is maintained between 1 mtorr and 250 torr.
- the substrate of about 25mm x 25mm was heated by the plasma
- Diamond is deposited at a rate of 0.05-20 ⁇ m per hour
- FIG. 1 is a schematic illustration of a microwave plasma enhanced chemical
- Figure 2 is an optical micrograph of a free-standing diamond film deposited in
- Figure 3 is a graphic illustration of a Raman spectrum for the diamond film of
- Figure 4 is an optical micrograph of a diamond film deposited in accordance
- precursor solution comprising 4 grams of isopropanol and 100 grams of methanol.
- Figure 5 is a graphic illustration of a Raman spectrum for the diamond film of
- Figure 6 is an optical micrograph of a free-standing diamond film deposited in
- Figure 7 is a graphic illustration of a Raman spectrum for the diamond film of
- Figure 8 is an optical micrograph of a diamond film deposited in accordance
- Figure 9 is a graphic illustration of a Raman spectrum for the diamond film of
- Figure 10 is an optical micrograph of diamond crystallites grown in
- Figure 11 is a graphic illustration of a Raman spectrum for a diamond
- Figure 12 is an optical micrograph of a diamond film deposited in accordance
- Figure 13 is a graphic illustration of a Raman spectrum for the diamond film
- Figure 14 is an optical micrograph of diamond crystallites grown in
- Figure 15 is a graphic illustration of a Raman spectrum for the diamond
- Figure 16 is an optical micrograph of diamond crystallites deposited in
- microwave plasma in the vapor of a precursor comprising isopropanol in the vapor of a precursor comprising isopropanol.
- Figure 17 is a graphic illustration of a Raman spectrum for the diamond
- the present invention relates to a method of synthesizing diamond crystals and
- optical windows as optical windows, machining tools, heat spreaders, tribological coatings, sensors and
- actuators electrochemical coatings, protective coatings, and wide-bandgap
- the method of the present invention uses a premixed
- molar ratio of atomic carbon to atomic oxygen being greater than one.
- Br, and OH radicals may be added to the methanol-based solution, it is not a requirement for the deposition of diamond crystals and diamond films by the method
- Figure 1 generally illustrates the plasma enhanced chemical vapor deposition
- the precursor 5 is fed from a precursor container 4 by a conduit 6, such as a
- TEFLON or metal tubing through a liquid flow controller 7, such as a needle valve,
- reactor chamber 1 is formed from a material
- the reactor chamber 1 is stainless steel and typically 8" in diameter.
- the reactor chamber 1 has
- the vapor precursor 5 is maintained at a pressure
- Electromagnetic energy 8 discharged at various frequencies, for example, DC,
- a window 9 such as a
- the electromagnetic energy 8 is microwave energy.
- the reactor chamber 1 is a part of the
- a substrate 11 is placed on a
- substrate holder 12 preferably a water cooled substrate holder to control the
- Substrate 11 temperature is monitored with
- the plasma 10 dissociates the vapor
- Methanol vapor (CH 3 OH) has a carbon to oxygen
- the growth rate and degree of non-uniformity also depend on the exposure of
- the precursor 5 comprises a solution of methanol and a proper quantity
- diamond growth is substantially uniform, reproducible, and at a higher
- isopropanol, ((CH 3 ) 2 CHOH), and acetone (CH 3 COCH 3 ) have respective carbon to
- the precursor 5 comprises only a carbon containing compound having carbon to oxygen ratios greater than one,
- the substrate with high quality diamond particles. Also, diamond growth is as well a
- the carbon containing compound can comprises dopant
- Such dopants include, but are not limited to, halides, metals, and the like. Still
- carrier gasses such as argon, hydrogen, and the like may be utilized to
- the substrate can comprise any suitable material conventionally utilized in
- the substrate may be either unseeded or
- Seeding can be accomplished by polishing the
- particles such as 1 ⁇ m particles.
- diamond grains clearly visible using an optical microscope.
- the diamond grain sizes range from sub-micrometers to more than 500 ⁇ m.
- Typical deposition parameters are as follows:
- Argon ion laser was used to examine the phase purity of the deposited films.
- a liquid solution comprising 4.6 grams of ethanol and 100 grams of methanol
- the growth rate was about 1 ⁇ m per hour.
- Figure 2 shows the optical micrograph of the flee-standing diamond
- a liquid solution comprising 4 grams of isopropanol and 100 grams of
- methanol was used as the precursor feedstock.
- a molybdenum plate of 1/2 inch thick and 2 inches in diameter was polished by diamond paste containing 1 ⁇ m sized
- molybdenum substrate was of about 44 ⁇ m in thickness.
- the growth rate was
- Figure 4 shows the optical micrograph of the free-standing
- a liquid solution comprising 3.5 grams of acetone and 100 grams of methanol
- the diamond film was about 30 ⁇ m in thickness.
- the growth rate was
- Figure 6 shows the optical micrograph of the diamond film on
- a liquid solution comprising 15 grams of acetone and 100 grams of methanol
- the aluminum plate was polished by diamond paste containing 1 ⁇ m sized diamond powder and cleaned by acetone and methanol
- Microwave power of 650 W was applied at a
- the microwave power was increased to 800 W, and the vapor
- Figure 8 shows the optical micrograph of the diamond film on aluminum.
- the coating was indeed a diamond film.
- a liquid solution comprising 50 grams of acetone and 100 grams of methanol
- Microwave power of 1,100 W was applied at a vapor pressure of 35 torr, resulting in
- the substrate being heated to 724°C. After 2 hours, diamond nucleated and grew to
- the diamond crystallites are of good quality.
- a liquid solution comprising 50 grams of acetone and 100 grams of methanol
- a silicon wafer of 1" x 1" in size was placed on a water-cooled molybdenum holder.
- the silicon wafer was polished by diamond paste
- Microwave power of 1,100 W was applied at a
- Figure 12 shows the optical
- a liquid solution comprising 100 grams of isopropanol and 100 grams of
- methanol was used as the precursor feedstock.
- a silicon wafer of 1" x 1" in size was used as the precursor feedstock.
- Figure 14 shows the optical micrograph of the diamond crystallites on
- Substantially pure isopropanol was used as the precursor feedstock.
- a silicon wafer of 1" x 1 " in size was placed on a water-cooled molybdenum holder. The silicon
- Microwave power of 900 W was applied at a
- Figure 16 shows the optical micrograph of the
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU41666/00A AU4166600A (en) | 1999-02-10 | 2000-02-10 | Method of plasma enhanced chemical vapor deposition of diamond |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11977199P | 1999-02-10 | 1999-02-10 | |
US60/119,771 | 1999-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000048435A1 WO2000048435A1 (en) | 2000-08-17 |
WO2000048435A9 true WO2000048435A9 (en) | 2002-01-10 |
Family
ID=22386287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/003502 WO2000048435A1 (en) | 1999-02-10 | 2000-02-10 | Method of plasma enhanced chemical vapor deposition of diamond |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU4166600A (en) |
WO (1) | WO2000048435A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2387025A (en) * | 2002-03-26 | 2003-10-01 | Enfis Ltd | LED and laser diode array cooling |
-
2000
- 2000-02-10 WO PCT/US2000/003502 patent/WO2000048435A1/en active Application Filing
- 2000-02-10 AU AU41666/00A patent/AU4166600A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU4166600A (en) | 2000-08-29 |
WO2000048435A1 (en) | 2000-08-17 |
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