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WO2000040010A1 - Couverture a surface profilee pour reseau de capteurs d'images - Google Patents

Couverture a surface profilee pour reseau de capteurs d'images Download PDF

Info

Publication number
WO2000040010A1
WO2000040010A1 PCT/US1999/030654 US9930654W WO0040010A1 WO 2000040010 A1 WO2000040010 A1 WO 2000040010A1 US 9930654 W US9930654 W US 9930654W WO 0040010 A1 WO0040010 A1 WO 0040010A1
Authority
WO
WIPO (PCT)
Prior art keywords
lensing
cover
sensor array
image sensor
plate
Prior art date
Application number
PCT/US1999/030654
Other languages
English (en)
Inventor
Scott Campbell
Original Assignee
Photobit Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photobit Corporation filed Critical Photobit Corporation
Publication of WO2000040010A1 publication Critical patent/WO2000040010A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors

Definitions

  • the present specification generally relates to image
  • the sensor array is
  • the cover plate is a flat piece
  • transparent material such as glass, plastic or plexiglass
  • cover plate offers little in terms of optical enhancement.
  • optically-flat cover plate The contouring allows for the use
  • an incident light converts a singlet lens system into a
  • the contouring of the cover plate also allows using the
  • the mounting structures can be any suitable optical components, filters, and polarizers.
  • the mounting structures can be any suitable optical components, filters, and polarizers.
  • the contouring of the cover plate enhances the ability of the lensing element to
  • aberration is the natural tendency for a lens to produce its
  • a lensing structure may include lensing elements,
  • the present specification involves a cover
  • the cover includes a plate formed
  • the plate has a plurality of surfaces
  • At least one of the plurality is a lensing structure. At least one of the plurality
  • the camera system includes a lens system, an image sensor
  • the lens system carries and focuses the optical data onto
  • the lens system includes a plurality of lenses and a cover plate.
  • the cover plate is contoured
  • the image sensor array has a plurality of sensors.
  • sensors receive the optical data and integrate the data into
  • FIG. 1A is an exploded view of a cover plate
  • FIG. IB is a side view of the cover plate cut along the
  • FIG. 1C is another embodiment of the cover plate
  • FIG. 2A is one embodiment of an existing three-element
  • FIG. 2B is the lens system of FIG. 2A inserted into the
  • FIG. 3A is a diffraction grating blazed onto the surface
  • FIG. 3B is a diffraction grating blazed on a concave
  • FIG. 3C is a diffraction grating blazed on a convex
  • FIG. 4A is an injection molded cover plate having a post
  • FIG. 4B is an injection molded cover plate having a post
  • FIGS. 5A and 5B show top views of the cover plates
  • FIGS. 5C through 5H show different embodiments of the
  • FIGS. 6A through 6C show different embodiments of the
  • cover plate having a combination of lensing elements
  • FIG. 7A is a cut-away side perspective view of an image
  • FIG. 7B is a block diagram of the image sensor camera
  • FIG. 1A shows an exploded view of a cover plate 100
  • sensor array can be an array of active pixel sensors.
  • active pixel sensor includes a photoreceptor, e.g., a
  • photodiode or photogate an in-pixel follower transistor
  • the cover plate 100 is
  • the lensing element 104 operates to enhance the focusing of light
  • FIG. IB shows a side view of the cover plate 100 cut
  • FIG. 1C shows another embodiment of the cover plate 108
  • the cover plate 108 is placed in front of the sensor array
  • FIG. 2A shows one embodiment of an existing three-element
  • the lens system 200 includes a first convex
  • lens 202 lens 202
  • second plano-concave lens 204 lens 202
  • third plano-concave lens 204 lens 202
  • the lens system 200 also includes a lens
  • FIG. 2B illustrates the lens system 200 inserted into a
  • the cover plate 214 can have a mounting
  • the cover plate 214 can be a single-piece
  • the lens system 200 can be inserted into the cover plate
  • the lens system 200 can be secured
  • contoured lens 224 enhances the ability of the four-element
  • the aberration is the natural tendency for a lens
  • FIG. 3A shows a diffraction grating 302 blazed onto the
  • the concave grating forms a hybrid refractive-diftractive
  • grating 312 is formed on a convex surface 314 of a cover plate
  • the convex grating 312 can be manufactured using a
  • the convex grating forms a hybrid refractive-
  • FIG. 4A shows an injection-molded cover plate 400 having
  • the post 402 and the post 402 are a post 402 and a convex lensing surface 404.
  • the lensing surface 404 form a complete lens system
  • the post 402 and the lensing surface 404 form a lensing
  • lensing surface 410 can be contoured as a concave depression
  • FIGS. 5A through 5H show several different embodiments of
  • the mounting structure 500 is a mounting structure 500, 502.
  • the mounting structure 500 is a mounting structure 500, 502.
  • the mounting structure 502 is formed over the sensor array.
  • 500, 502 is configured to allow the lens system to be easily
  • FIG. 5A shows a top view of the cover plate 504 including
  • the mounting structure 500 forms a square pattern, which allows a square-
  • FIG. 5B shows a circular-shaped mounting
  • FIGS. 5C through 5H show several different embodiments
  • FIG. 5C shows a mounting structure formed with a mesa-
  • the protrusion 508 can be a clear material attached to
  • FIG. 5D shows a variation of the mounting structure
  • FIG. 5C The mounting structure in FIG. 5D can be
  • FIGS. 5E and 5F show two variations of the ringed
  • FIG. 5E shows a threaded retaining ring 514 on the outside wall of the
  • FIG. 5F shows the threaded retaining
  • the threaded retaining ring 514 is used to mount and
  • FIGS. 5G and 5H show a mounting structure formed with a
  • depression 516 can be used to lock the lens mount onto the
  • FIG. 5H also shows a threaded retaining
  • FIGS. 6A through 6C show different embodiments of the
  • cover plate having a combination of lensing elements
  • FIG. 6A shows a cover plate 600 having a lensing
  • element 608 is formed with a concave lensing surface 602.
  • the mounting structure 604 can have a threaded retaining
  • FIG. 6B shows another combination of a lensing element
  • the lensing element 616 is a lensing element 616 and a mounting structure 612.
  • the lensing element 616 is a lensing element 616
  • FIG. 6C shows a combination of a ringed mounting
  • lensing element 620 is formed with a post 624 and a convex
  • FIG. 7A shows a cut-away side perspective view of an
  • the camera system can be an
  • APS active pixel sensor
  • the camera system 700 includes a lens system
  • the lens system 708 includes a plurality of lenses 714
  • the lens system 708 may also be mounted on a lens mount 710.
  • the lens system 708 may also be mounted on a lens mount 710.
  • lensing elements such as a filter or a
  • the contoured cover plate 702 acts as an
  • FIG. 7B shows a block diagram of the image sensor
  • the camera system 700 receives optical image data 716.
  • the optical data 716 are focused by the
  • the sensor electronics 706 converts
  • contouring can be done on both surfaces of the cover plate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

L'invention concerne une couverture (214) pour un réseau de capteurs d'images (102). Cette couverture (214) comprend une plaque constituée d'une matière sensiblement transparente placée à côté du réseau de capteurs d'images (102). Cette plaque comporte une pluralité de surfaces et forme une structure lenticulaire (224). Au moins l'une des surfaces est profilée de façon à former une surface lenticulaire (226) capable d'apporter une amélioration de mise en image ou une fonction d'enrichissement.
PCT/US1999/030654 1998-12-24 1999-12-23 Couverture a surface profilee pour reseau de capteurs d'images WO2000040010A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11385098P 1998-12-24 1998-12-24
US60/113,850 1998-12-24

Publications (1)

Publication Number Publication Date
WO2000040010A1 true WO2000040010A1 (fr) 2000-07-06

Family

ID=22351897

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/030654 WO2000040010A1 (fr) 1998-12-24 1999-12-23 Couverture a surface profilee pour reseau de capteurs d'images

Country Status (1)

Country Link
WO (1) WO2000040010A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2819101A1 (fr) * 2000-12-28 2002-07-05 Atmel Grenoble Sa Capteur photosensible en technologie des circuits integres
EP1434426A3 (fr) * 2002-12-18 2004-11-10 Sanyo Electric Co., Ltd. Module de prise de vue et sa méthode de fabrication

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620149A (en) * 1969-08-04 1971-11-16 Olygin Optical Corp Threaded type coupling device for coupling a lens barrel with a camera body
US5371397A (en) * 1992-10-09 1994-12-06 Mitsubishi Denki Kabushiki Kaisha Solid-state imaging array including focusing elements
US5400072A (en) * 1988-12-23 1995-03-21 Hitachi, Ltd. Video camera unit having an airtight mounting arrangement for an image sensor chip
US5587832A (en) * 1993-10-20 1996-12-24 Biophysica Technologies, Inc. Spatially light modulated confocal microscope and method
US5600486A (en) * 1995-01-30 1997-02-04 Lockheed Missiles And Space Company, Inc. Color separation microlens

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620149A (en) * 1969-08-04 1971-11-16 Olygin Optical Corp Threaded type coupling device for coupling a lens barrel with a camera body
US5400072A (en) * 1988-12-23 1995-03-21 Hitachi, Ltd. Video camera unit having an airtight mounting arrangement for an image sensor chip
US5371397A (en) * 1992-10-09 1994-12-06 Mitsubishi Denki Kabushiki Kaisha Solid-state imaging array including focusing elements
US5587832A (en) * 1993-10-20 1996-12-24 Biophysica Technologies, Inc. Spatially light modulated confocal microscope and method
US5600486A (en) * 1995-01-30 1997-02-04 Lockheed Missiles And Space Company, Inc. Color separation microlens

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2819101A1 (fr) * 2000-12-28 2002-07-05 Atmel Grenoble Sa Capteur photosensible en technologie des circuits integres
WO2002054500A1 (fr) * 2000-12-28 2002-07-11 Atmel Grenoble S.A. Capteur photosensible en technologie des circuits integres
EP1434426A3 (fr) * 2002-12-18 2004-11-10 Sanyo Electric Co., Ltd. Module de prise de vue et sa méthode de fabrication

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