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WO2000038494A3 - Automatic inspection system with stereovision - Google Patents

Automatic inspection system with stereovision Download PDF

Info

Publication number
WO2000038494A3
WO2000038494A3 PCT/US1999/030206 US9930206W WO0038494A3 WO 2000038494 A3 WO2000038494 A3 WO 2000038494A3 US 9930206 W US9930206 W US 9930206W WO 0038494 A3 WO0038494 A3 WO 0038494A3
Authority
WO
WIPO (PCT)
Prior art keywords
stereo images
components
location
computed
reference points
Prior art date
Application number
PCT/US1999/030206
Other languages
French (fr)
Other versions
WO2000038494A2 (en
WO2000038494A8 (en
Inventor
Christopher B Jackson
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Priority to IL13777899A priority Critical patent/IL137778A0/en
Priority to AU33425/00A priority patent/AU3342500A/en
Priority to KR1020007009019A priority patent/KR20010040998A/en
Priority to JP2000590448A priority patent/JP2003522347A/en
Priority to EP99969986A priority patent/EP1057390A2/en
Priority to CA002321096A priority patent/CA2321096A1/en
Publication of WO2000038494A2 publication Critical patent/WO2000038494A2/en
Publication of WO2000038494A3 publication Critical patent/WO2000038494A3/en
Publication of WO2000038494A8 publication Critical patent/WO2000038494A8/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/239—Image signal generators using stereoscopic image cameras using two 2D image sensors having a relative position equal to or related to the interocular distance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G06T2207/10012—Stereo images
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20076—Probabilistic image processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/246—Calibration of cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N2013/0074—Stereoscopic image analysis
    • H04N2013/0081—Depth or disparity estimation from stereoscopic image signals

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

In one embodiment of the present invention, two banks (22, 24) of fixed array cameras provide tiled stereo images (I1, I2, I3) and electronics assemble the tiled stereo images into a mosaic image. The mosaic image includes height information derived from the two sets stereo images, and is also compensated as a function of reference points in the image to more closely conform to the actual board (10). Preferably, a SAM model is used to locate the reference points. Reconstructed SAM models corresponding to components on the board are applied within a search area where a certain type of component is expected to be found. The best-fit location of the component within the search area, as well as the skew angle and the probability are computed. The best-fit location is the location where the Manhabolis distance and the residual error are optimized. Once the best-fit location is computed, it is compared to tolerances to identify improperly placed components, the absence of components or the like.
PCT/US1999/030206 1998-12-19 1999-12-17 Automatic inspection system with stereovision WO2000038494A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IL13777899A IL137778A0 (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision
AU33425/00A AU3342500A (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision
KR1020007009019A KR20010040998A (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision
JP2000590448A JP2003522347A (en) 1998-12-19 1999-12-17 Automatic inspection system using stereo images
EP99969986A EP1057390A2 (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision
CA002321096A CA2321096A1 (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9828109.0 1998-12-19
GBGB9828109.0A GB9828109D0 (en) 1998-12-19 1998-12-19 Inspection equipment and methods of inspection

Publications (3)

Publication Number Publication Date
WO2000038494A2 WO2000038494A2 (en) 2000-06-29
WO2000038494A3 true WO2000038494A3 (en) 2000-09-14
WO2000038494A8 WO2000038494A8 (en) 2000-10-26

Family

ID=10844634

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/030206 WO2000038494A2 (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision

Country Status (8)

Country Link
EP (1) EP1057390A2 (en)
JP (1) JP2003522347A (en)
KR (1) KR20010040998A (en)
AU (1) AU3342500A (en)
CA (1) CA2321096A1 (en)
GB (1) GB9828109D0 (en)
IL (1) IL137778A0 (en)
WO (1) WO2000038494A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
EP1220596A1 (en) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
DE60238407D1 (en) * 2001-07-04 2011-01-05 Koninkl Philips Electronics Nv SELECTION OF REFERENCE MARKS FOR FAST ESTIMATION OF THE POSITION OF A PICTURE RECORDER
JP4596422B2 (en) * 2005-05-20 2010-12-08 キヤノンマシナリー株式会社 Imaging device for die bonder
EP1788345B1 (en) * 2005-06-17 2014-03-05 Omron Corporation Image processing device and image processing method performing 3d measurement
US20070130755A1 (en) * 2005-10-31 2007-06-14 Duquette David W Electronics assembly machine with embedded solder paste inspection
WO2009094489A1 (en) * 2008-01-23 2009-07-30 Cyberoptics Corporation High speed optical inspection system with multiple illumination imagery
CN101614679B (en) * 2008-06-27 2011-06-22 上海纺印印刷包装有限公司 Quality detection device for concave-convex printed product
US8894259B2 (en) 2009-09-22 2014-11-25 Cyberoptics Corporation Dark field illuminator with large working area
JP2013505465A (en) * 2009-09-22 2013-02-14 サイバーオプティクス コーポレーション High-speed, high-resolution 3D solar cell inspection system
US8681211B2 (en) 2009-09-22 2014-03-25 Cyberoptics Corporation High speed optical inspection system with adaptive focusing
US8872912B2 (en) * 2009-09-22 2014-10-28 Cyberoptics Corporation High speed distributed optical sensor inspection system
US8670031B2 (en) 2009-09-22 2014-03-11 Cyberoptics Corporation High speed optical inspection system with camera array and compact, integrated illuminator
US8388204B2 (en) 2009-09-22 2013-03-05 Cyberoptics Corporation High speed, high resolution, three dimensional solar cell inspection system
JP5465062B2 (en) * 2010-03-31 2014-04-09 名古屋電機工業株式会社 Substrate appearance inspection apparatus and substrate appearance inspection method
KR101160663B1 (en) * 2010-10-21 2012-06-28 한국원자력연구원 Three Dimensional Visualization of Stereo X-ray Images based on Volume Reconstruction
CN104081153B (en) * 2011-11-14 2017-06-27 Ev集团E·索尔纳有限责任公司 Determine the apparatus and method of substrate shape change
US20140198185A1 (en) * 2013-01-17 2014-07-17 Cyberoptics Corporation Multi-camera sensor for three-dimensional imaging of a circuit board
US11176635B2 (en) 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
US10126252B2 (en) * 2013-04-29 2018-11-13 Cyberoptics Corporation Enhanced illumination control for three-dimensional imaging
US9743527B2 (en) 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9707584B2 (en) 2014-07-09 2017-07-18 Nordson Corporation Dual applicator fluid dispensing methods and systems
CN106290423B (en) * 2016-10-18 2024-04-05 同方威视技术股份有限公司 Method, device and system for scanning imaging
WO2019111388A1 (en) * 2017-12-07 2019-06-13 ヤマハ発動機株式会社 Mounted-object working machine
CN113692215A (en) * 2021-07-30 2021-11-23 广州佳帆计算机有限公司 System, method and device for adjusting position of patch element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0301255A1 (en) * 1987-07-30 1989-02-01 Siemens Aktiengesellschaft Three-dimensional position recognition of component pins for automatic insertion
US4978224A (en) * 1987-07-14 1990-12-18 Sharp Kabushiki Kaisha Method of and apparatus for inspecting mounting of chip components
US5347363A (en) * 1991-07-25 1994-09-13 Kabushiki Kaisha Toshiba External lead shape measurement apparatus for measuring lead shape of semiconductor package by using stereoscopic vision

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978224A (en) * 1987-07-14 1990-12-18 Sharp Kabushiki Kaisha Method of and apparatus for inspecting mounting of chip components
EP0301255A1 (en) * 1987-07-30 1989-02-01 Siemens Aktiengesellschaft Three-dimensional position recognition of component pins for automatic insertion
US5347363A (en) * 1991-07-25 1994-09-13 Kabushiki Kaisha Toshiba External lead shape measurement apparatus for measuring lead shape of semiconductor package by using stereoscopic vision

Also Published As

Publication number Publication date
CA2321096A1 (en) 2000-06-29
WO2000038494A2 (en) 2000-06-29
JP2003522347A (en) 2003-07-22
IL137778A0 (en) 2001-10-31
GB9828109D0 (en) 1999-02-17
WO2000038494A8 (en) 2000-10-26
KR20010040998A (en) 2001-05-15
EP1057390A2 (en) 2000-12-06
AU3342500A (en) 2000-07-12

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