WO2000017688A1

WO2000017688A1 - Microstructured body and method for producing the same

Info

Publication number: WO2000017688A1
Application number: PCT/EP1999/006903
Authority: WO
Inventors: Hans Kragl
Original assignee: Harting Elektro-Optische Bauteile Gmbh & Co. Kg
Priority date: 1998-09-17
Filing date: 1999-09-16
Publication date: 2000-03-30
Also published as: DE19842694A1; EP1114345A1; CA2344455A1; JP2002525674A

Abstract

Microstructured body with a substrate (10) and at least one hardened coating which is provided on said substrate and which is microstructured and is precisely positioned relative to the surface of the substrate (10) is characterized in that the substrate (10) is provided with adjusting means (16, 18) for a microstructured cover (30) which can be placed on the substrate (10), said means are accessible from the exterior once the coating has hardened. A method for producing such a microstructured body comprises the following steps: first, a substrate (10) with adjusting means (16, 18) is produced. The surface of the substrate is then coated at least in some areas with a liquid material (20). Afterwards, a cover (30) having a microstructured surface is placed on the substrate (10). The cover (30) is provided with positioning means (34, 36), which are complementary to the adjusting means (16, 18) so that the cover (30) is arranged in a precisely defined position on the substrate (10). The cover is also provided with microstructures which serve to microstructure the coating. The cover (30) is then mechanically pressed onto the substrate (10), whereby at least part of the microstructured surface of the cover (30) is shaped into the coating. The applied material (20) is then hardened and lastly, the cover (30) is removed from the substrate (10).

Description

Microstructured body and process for its production

The invention relates to a microstructured body with a substrate and at least one cured coating applied to the substrate, which is microstructured and precisely positioned relative to the surface of the substrate. The invention further relates to a method for producing such a microstructured body.

A microstructured body of this type can be produced in particular by means of impression techniques. In the so-called LIGA

Processes are first carried out using microstructured master structures

X-ray lithography generated. These are then replaced by galvanic

Impression molding is made with a geometrically inverse surface. From this molding tool, a plastic part can then be obtained with a plastic molding step, which is of the same shape as the microstructured master structure. To this

For example, large quantities of high-precision, microstructured materials can be produced very inexpensively in the injection molding process

Manufacture plastic parts, which are referred to below as the substrate.

The disadvantage here is that only certain microstructures can be produced, namely those structures which are formed by molding a suitably microstructured tool can be achieved in a single homogeneous material. In this way, for example, no forms with undercuts can be obtained.

The object of the invention is therefore to create a microstructured body in which the structures can be designed in a wide variety of ways, so that the most varied areas of application open up.

This object is achieved according to the invention in a microstructured body of the type mentioned at the outset in that adjustment configurations are provided on the substrate for a microstructured cover which can be placed on the substrate and which are accessible from the outside after the coating has hardened. This opens up completely new freedoms through the possibility of combining different ones

Materials and designs, since additional components can be attached to the substrate with very high accuracy or can be precisely aligned for further work steps due to the adjustment designs accessible from the outside. Thus, a further coating can be applied to the microstructured coating, which cooperates with the first coating and the microstructures molded in it in order to realize special functions. This further coating can be precisely aligned relative to the substrate by means of a microstructured cover, which is positioned by means of the adjustment designs, so that a microstructured design can also be formed in the further coating, which is precisely aligned relative to the substrate. In addition, micro-structured designs can now be formed which cannot be produced by structuring the substrate alone, since, for example, an undercut on the tool would be required.

The adjustment designs can also serve to precisely align further components relative to the substrate, for example a microchip. The adjustment designs, which can consist, for example, of the precisely cut outer edges of the substrate or of a groove which is formed in the surface of the substrate, serve for the precise positioning of the cover relative to the substrate and can optionally be used for the further adjustment of the finished component. A microstructured surface or coating is understood here to mean a design which consists of different, flat or curved surfaces which are arranged three-dimensionally and at precise intervals and arrangements relative to one another, for example grooves, trenches, channels, cutouts, etc. These

Designs adhere to certain tolerances, which depend on the application to be achieved. These tolerances can be very narrow if precise positioning relative to other structures is required, or they can be comparatively large if special accuracy is not required. This reduces the

Processing effort.

According to one embodiment of the invention, the coating consists of a material which differs in at least one physical property from the material of the substrate. In this way, e.g. a waveguide can be formed. The waveguide can be formed in that the surface of the substrate is coated with the suitable material in the liquid state and in that a micro-structured cover is then placed on the substrate. This cover is pressed mechanically against the substrate and ensures that the microstructured designs which are to form the waveguide and which are formed on the substrate and / or the cover are molded in the coating. The cover must be positioned precisely relative to the microstructured substrate so that the applied material is in the required places after the cover has been pressed on. The still liquid material is then cured, for example by irradiation. Now the lid can be removed and the substrate with the applied, now hardened material remains, which in turn is microstructured. It is then possible, in further processing steps, to form further coatings on the microstructures obtained from the first coating.

According to a preferred embodiment of the invention, the coating forms a waveguide, the waveguide at least / 17688 ^rL

- 4 -

partially protrudes beyond the surrounding surface of the substrate. In this way, through the interaction of the microstructured cover with the substrate, waveguides with almost any cross section can be formed, which need not be free of undercuts, for example a round cross section.

According to one embodiment of the invention, the waveguide has a trapezoidal cross section and is arranged entirely on the surface of the substrate. A waveguide with a trapezoidal cross section can be shaped particularly well, since on the one hand the liquid material displaced into the design, which is also microstructured with a trapezoidal cross section, fills this cross section better than a rectangular cross section, for example, and on the other hand there is no danger when the cover is lifted off that the side surfaces and edges of the

The waveguide can be damaged because the inclined side surfaces of the waveguide easily detach from the cover in the manner of bevels.

According to another embodiment of the invention, a

Waveguides are formed with a circular cross-section, with one half of the cross-section recessed in the substrate and the other half raised above the surrounding surface of the substrate. In this way, microstructured designs can be obtained, if only by a corresponding one

Design of the substrate would have to be preserved, would lead to undercuts that could not be molded. Only when a part of the cross section of the waveguide is molded in the coating does the undercuts disappear, so that a circular cross section can also be achieved, for example.

According to one embodiment of the invention it is provided that a groove is formed in the coating. This groove can, for example, be a guide groove for an element to be coupled to the body. This element, for example a semiconductor chip designed as an optical transmitter or receiver, serves to supply signals to the microstructured body or to take signals from it. It is not necessary according to the invention to To take a picture of a groove serving to be coupled to the microstructured body during the manufacture of the substrate; the groove can later be formed at the desired location in a single step, for example simultaneously with the production of waveguides on the substrate.

According to one embodiment of the invention, it is provided that the adjustment designs are arranged at least partially in spatial proximity to the microstructured coating. This results in increased accuracy in the production of the molded microstructures. The position of the microstructures in the coating is in fact more precise relative to the microstructures of the substrate, the smaller the distances between the structures to be molded and the adjustment designs, since then any tolerances or possible material distortion are only very small

Have an impact.

A method according to the invention for producing microstructured bodies contains the following steps: First, a substrate is produced which has alignment configurations. Then the

Surface of the substrate coated at least in regions with a liquid material. A lid with a microstructured surface is then placed on the substrate, the lid being provided with positioning configurations which are complementary to the adjustment configurations, so that the lid is arranged in a precisely defined position on the substrate, and with configurations by means of which the coating is microstructured. The cover is then mechanically pressed onto the substrate, the microstructured surface of the cover being molded into the coating at least in some areas. Then the applied material is cured. Finally, the lid is removed from the substrate. This process opens up the possibility of obtaining microstructured designs that are adapted to the respective application. The adjustment configurations, together with the positioning configurations, enable the cover to be arranged precisely relative to the substrate, so that micro-structured configurations can be formed in the coating, which can lie precisely relative to micro-structures in the substrate. The accuracy obtained thereby makes it possible to microstructures obtained in subsequent work steps to build up further microstructures.

According to one embodiment of the invention, it is provided that the cover is microstructured in such a way that the applied coating is displaced from the areas to be structured when the cover is pressed on. In this way, recessed structures in particular can be molded. Then, in a further step, a second coating could be applied, which can be microstructured with a second lid.

According to one embodiment of the invention, it is provided that the cover is microstructured in such a way that the applied coating is forced into the areas to be structured when the cover is pressed on. In this way, especially sublime

Structures are molded. With the required precision, these can also be formed on a substrate whose surface has certain unevenness. This lowers the cost of manufacturing the substrate, which does not have to be manufactured in all surface areas with the precision required for microstructured areas.

According to one embodiment of the invention it is provided that the body is formed by the hardened coating which is lifted off the substrate. This enables a microstructured

Obtain body for example in the form of a film that is microstructured on both sides. It is only necessary to ensure that the coating applied to the substrate does not bond to it during curing, but rather can be separated from the substrate after curing. This works, for example, if as

Material for the substrate nickel and as a coating material plastic is used. If additional microstructures are formed on the film in further work steps, this then in turn serves as a substrate.

Advantageous refinements of the invention result from the subclaims. The invention is described below with reference to various embodiments, which are illustrated in the accompanying drawings. Although the embodiments shown each show an optical or electro-optical component, it is expressly pointed out that by means of the basic principles shown also

Components can be produced that have no optical functions, for example purely electrical or electronic components. The drawings show:

- Figure 1 shows a substrate before coating with a material;

FIG. 2 shows the substrate from FIG. 1 with an applied waveguide and a formed guide groove for an optical fiber that can be coupled to the waveguide;

- Figure 3 shows a substrate with a structured surface;

FIG. 4 shows the substrate from FIG. 3 and a microstructured cover which can be placed thereon;

- Figure 5 shows a substrate and a lid similar to that of Figure 4, but with additional positioning and adjustment designs;

FIGS. 6a to 6c a substrate and a cover, various materials being applied to the substrate;

FIGS. 7a and 7b show a substrate and a cover, a raised and recessed waveguide being formed on the substrate;

FIGS. 8a and 8b show a substrate and a cover similar to that of FIG. 7, an only raised waveguide being formed;

FIGS. 9a to 9e a substrate and a cover, a shielded high-frequency conductor being formed; FIGS. 10a and 10b show a substrate with a receiving opening for a chip;

FIGS. 11a to 11c show a substrate and a cover, by means of which a microstructured film can be produced;

FIGS. 12a to 12d show a substrate and a cover, partial metallization being achieved on a material applied to the substrate;

FIG. 13 shows an electro-optical component that can be produced by partial metallization of a substrate;

FIG. 14 shows an electro-optical component which is provided with a hollow channel through which a medium can flow; and

- Figure 15 is an optical component that can be used as a transceiver.

Based on Figures 1 to 4, the basic steps of

Production of a microstructured body described. First, a substrate 10 is made. This can be done in particular by molding from a microstructured tool using a plastic material.

The substrate 10 can be provided with trenches 12 and grooves 14 (see FIG. 3) on its structured surface. Furthermore, the outer edges of the substrate 10 can be microstructured, for example precisely cut, in order to serve as adjustment designs 16.

An optical material 20 is applied in a liquid state to the structured surface of the substrate 10. A cover 30 is then placed on the substrate 10 and the material 20 applied to it. The cover 30 is also provided with a microstructured surface, for example with projections 32 which protrude into the trenches 12 of the substrate, and with edges 34 which form positioning designs and with the Adjustment designs 16 cooperate such that the cover 30 is precisely adjusted and positioned relative to the substrate 10. When the cover 30 is applied to the substrate 10 in the correct position, it is pressed mechanically against the latter. The applied liquid material 20 is displaced from all the areas in which it is not desired. At the same time or subsequently, the liquid material 20 is cured, for example by means of radiation. Finally, the cover 30 is removed from the substrate 10. For this reason, the lid is often referred to as the "StripOff lid". After lifting the lid are the

Adjustment designs of the substrate are accessible again since they have not been contaminated with the liquid material.

What remains is the substrate 10, on which 20 different microstructures are now formed by means of the hardened material.

These microstructures contain, in particular, a waveguide 40 (see FIG. 2) and receptacles 42 for a schematically illustrated optical fiber 5, in each of which a guide groove 44 for the optical fiber 5 is formed.

In a further step, not shown, optical fibers can now be arranged in the guide grooves 44 and glued there, so that they are coupled to the waveguide 40.

Of particular importance here is that the positioning of the

Cover 30 relative to the substrate 10, no designs are used which will later serve to precisely accommodate the individual optical fibers. It is also of particular importance that the guide groove for the optical fiber is only produced in the work step with which the material applied to the substrate is also microstructured; in this way, contamination or damage to the guide groove for the optical fiber is prevented. The guide groove can in particular be produced with the same material that is also used for the waveguide and that is applied to the rest of the surface of the substrate. In this way, for example, a waveguide is produced in the structured surface of the body and a guide groove for an optical fiber that can be coupled to this waveguide in a single work step. The positioning of the guide groove for the optical fiber relative to the waveguide takes place with high accuracy, since the structure for forming the guide groove is located in the material on the cover, by means of which the waveguide is also formed on the substrate.

FIG. 5 shows a substrate 10 with a microstructured surface, as is largely known from FIGS. 1 to 4. In addition to the precisely structured outer edges 16, an adjustment design 18 in the form of a groove with a V-shaped cross section is provided. This is near the grooves 14 for the formation of

Waveguides arranged. The V-shaped groove 18 interacts with a positioning design 36 on the cover 30, which is designed as a projection with a V-shaped cross section. In this way, the accuracy of the positioning and adjustment of the cover 30 relative to the substrate 10 is increased. It is particularly advantageous if the

Adjustment design 18 and the positioning design 36 are arranged in the vicinity of surface structures of the substrate 10 and the cover 30, since tolerances due to material distortion etc. are reduced in this way. This makes it possible to precisely position functional elements, which are inserted into the recesses formed by means of the projections 32, relative to the waveguides.

A substrate 10 and a cover 30 are shown in FIGS. 6a to 6c, with the adjustment and positioning configurations 18, 36 making it possible to arrange the cover 30 in such a precise manner relative to the substrate 10 that in a first work step a first applied material is included Precise microstructures can be arranged and then a second material can be microstructured on the first material with the same accuracy.

With a first cover 30, which is provided with a projection 32, the first material 20 applied to the substrate 10 is microstructured in the trench 12 in such a way that a waveguide 40 with a precisely structured trench 46 is formed. Then a second material 22 is applied, which is optical

Distinguishes properties from the first material 20 and, after curing, forms a waveguide 41 nested in the waveguide 40. This enables the construction of asymmetrical Waveguide systems, ie waveguide systems made of waveguides with different phase velocities, or waveguide structures for a taper arrangement. The adjustment and positioning designs 18, 36, which are arranged much closer to the waveguides 40, 41 than the adjustment and positioning designs 16, 34, lead to particularly high accuracy.

In FIG. 7 it can be seen that by means of a recess 37 arranged in the cover 30, which interacts with the suitably designed trench 12, the coating is microstructured

Waveguide 40 with a circular cross section can be achieved. In contrast to the technique known from injection molding, this is also possible with a diameter of e.g. 0.5 mm still very filigree waveguide core is not self-supporting and therefore mechanically unstable, but is firmly glued to the substrate. This is a mechanically stable optical

Coupling to the round optical fiber possible.

With a suitable design of the recess 37, a raised waveguide 40 with any undercut-free cross-section can also be achieved on the surface of the substrate. In figure

8 shows a waveguide with a trapezoidal cross section. Since there are no depressions in the substrate in this configuration, apart from the adjustment configuration 18, this can be produced with a comparatively simple structured surface. All designs that have to be microstructured, i.e. the

Waveguides and the guide grooves for the optical fiber are designed as raised structures on the cover.

FIGS. 9a to 9e show how a shielded high-frequency conductor can be produced. First, the substrate

10 made with the trench 12. A metallic coating 50 is then applied to the microstructured surface of the substrate 10, which coating can optionally be reinforced galvanically or chemically.

A layer 48, which acts as a dielectric, is then formed in the trench 12 from a suitable first material by attaching the cover 30. This layer is created using a Projection 32 on the cover 30 microstructured. Thereupon a renewed metallic coating 52 is applied, which is polished on the surface in a last working step, so that the second metallic coating 52 only remains in the area of the trench 12. This coating can be galvanically or chemically reinforced in the same way as described above.

FIGS. 10a and 10b show a substrate 10, in which a waveguide 40 and a receiving opening 60 for an edge emitter laser diode 62 are formed by means of a microstructured cover. This is attached "up side down" to a heat sink 64. The receiving opening 60 and the waveguide 40 can be produced by means of a suitably shaped cover so precisely in a microstructured coating applied to the substrate 10 that the laser diode 62 after insertion into the

Receiving opening 60 is exactly coupled to the waveguide 40. After the adjustment has been made, all components must be connected using a polymer adhesive correctly selected in the index in order to achieve a long-term stable construction.

FIGS. 11a to 11c show how a microstructured film 70 can be produced by means of a substrate 10 and a cover 30. The substrate 10 and the cover 30 are provided with a microstructured surface such that a material 20 applied to the substrate 10 is shaped such that it contains, for example, optical lenses with bilateral lens curvature, Fresnell lenses or alignment structures. When the material 20 has hardened and is removed from the substrate 10, a microstructured film 70 results, in which these components are realized. Micro-structured mirrors can also be produced by metallic coating of certain surfaces. Local openings 72 in the otherwise continuous film are also possible.

FIGS. 12a to 12d show how a substrate 10, which is partially provided with the hardened, microstructured material 20, can be provided with a metallic coating. After the material 20 has been applied and hardened, a continuous metallic coating 80 is first applied. The surface of the substrate 10 is then polished, so that the metallic coating 80 is removed at all those places where it is not below this polished surface. Since the polishing is also carried out on the material which is arranged in the grooves 14 and is later to serve as a waveguide, it must be carried out with the finest grain. However, the metallic coating is very thin, so this is not a major problem. In addition, the waveguide is later covered with a material of a very similar index, which reduces the influence of surface roughness. After the metallic coating on the surface of the

If the substrate is polished (see FIG. C), the remaining metallic coating can be reinforced, for example galvanically, so that sufficiently high currents can flow in the electrical conductors 80. For this purpose, the metallic partial surfaces are electrically contacted and placed in an electroplating bath. About the control of the

Supply current, the layer thickness of the galvanic reinforcement can be adjusted. In FIG. 12d it can be seen that the right partial coating surface 80 has a greater wall thickness than the left partial coating surface 80.

The possibility of forming metallic coatings of different thicknesses on the substrate allows a thin coating, which acts as a heating conductor, and a thick coating, which acts as an associated cooling surface. In this way, for example, a thermo-optically switchable Mach-Zehnder interferometer can be formed. This is shown in Figure 13. A waveguide 40 is formed in the substrate 10 and branches into two interferometer arms 40 ′, 40 ″. A metallic coating with a thin wall serves as a heating conductor 82, while a metallic coating with a thick wall serves as a heat sink 84.

For the formation of the various structures of the Mach-Zehnder

Interferometers, it is particularly advantageous if the additional adjustment and positioning designs 18, 36 are used in the vicinity of the corresponding structures, designed for example as a groove and projection. FIG. 14 shows a substrate 10 in which a schematically illustrated hollow groove 90 is formed. Such a groove can be achieved, for example, by means of a suitably designed projection, which is provided on the cover and is molded as a microstructure in a material applied to the substrate. The hollow groove extends very close to an optical waveguide 40 which is curved. A closure member must be attached to the substrate 10 to create the hollow groove 90. The material of the closure part must have a refractive index which is smaller than that of the waveguides 40, 41 in order not to interfere with the optical field guidance. When a medium is sent through the hollow groove 90, symbolized by the arrow 90 ', there is an interaction between the optical field in the waveguide 40 and the medium flowing through the hollow groove 90. Since the waveguide 40 is curved in the vicinity of the hollow groove 90, it is very sensitive to the refractive index present there. This changes due to the interaction with the flowing medium, so that a stronger or weaker radiation occurs at the point of curvature depending on the refractive index, which radiation can be collected in the second waveguide 41 and guided to an optical fiber 5. To this

An optical sensor for the refractive index of the medium flowing in the hollow groove 90 is thus achieved. Thus, for example, the composition of a gas or a liquid mixture that flows continuously through the hollow groove 90 can be technically monitored. If a change in the composition of the flowing medium leads to a change in the index of the medium, the radiation from the continuous waveguide increases or decreases. The measurement of the light intensities in the optical fibers thus gives a measure of the refractive index of the medium. Conversely, in addition to the sensor function shown, an actuator function of the component is also possible.

If there are 90 liquids in the hollow groove,

Applying an electric field can change their index, for example liquid crystals, so can by an electric one

Voltage switching the light output from one to the other

Output can be effected. The component then functions as an optical one Switch. Reflective liquids, for example mercury, can also be used in the hollow groove 90.

FIG. 15 shows a substrate 10 in which a raised waveguide 40 with a large cross-section and a waveguide 41 with a smaller cross-section arranged in a recess are formed. Almost 100% of a light output coupled into the component by the optical fiber 5 is guided by means of the raised waveguide 40 to a photodetector symbolized by the arrow 97. At the same time, a light output that is emitted by a laser diode symbolized by arrow 98 can be coupled in via the thin waveguide 41 with little loss. In this way, a transceiver is formed which, despite the splitter design for incoming and outgoing signals, has less than 50% splinter loss.

According to FIGS. 7 and 8, the waveguide 40 can be designed as a raised and recessed microstructure or as only a raised microstructure, while the waveguide 41 is recessed, for example, in the manner of the waveguide shown in FIG.

Claims

claims

1. Microstructured body with a substrate (10) and at least one hardened coating applied to the substrate, which is microstructured and precisely positioned relative to the surface of the substrate (10), characterized in that on the substrate (10) adjustment designs (16, 18) are provided for a microstructured cover (30) which can be placed on the substrate (10) and which is accessible from the outside after the coating has hardened.

2. Microstructured body according to claim 1, characterized in that the coating consists of a material (20) which differs in terms of at least one physical property from the material of the substrate (10).

3. Microstructured body according to claim 2, characterized in that the coating forms a waveguide (40, 41).

4. Microstructuring body according to claim 3, characterized in that the waveguide (40, 41) protrudes at least partially over the surrounding surface of the substrate (10).

5. Microstructured body according to one of claims 3 and 4, characterized in that the waveguide (40, 41) has any formable cross-section and is arranged completely on the surface of the substrate (10).

6. Microstructured body according to one of claims 3 and 4, characterized in that the waveguide (40, 41) has a circular cross section, one half of the cross section deepened in the substrate (10) and the other half raised above the surrounding surface of the substrate (10) is arranged.

7. Microstructured body according to claim 1 or claim 2, characterized in that the microstructured coating has at least one area (44; 46; 90) recessed with respect to the surrounding surface.

8. Microstructured body according to claim 7, characterized in that in the coating a groove (44; 46; 90) is made of ^J göe.

9. Microstructured body according to claim 8, characterized in that the groove is a guide groove (44) for an element to be coupled to the body.

10. Microstructured body according to claim 9, characterized in that the structured coating forms at least one waveguide (40, 41) and that the guide groove (44) serves to receive an optical fiber (5) which can be coupled to the waveguide (40, 41) is.

11. Microstructured body according to claim 8, characterized in that the groove (90) is hollow and covered by a closure part and each end of the groove (90) opens onto an outside of the body.

12. Microstructured body according to one of the preceding claims, characterized in that the microstructured coating has at least one region (40, 41) raised in relation to the surrounding surface.

13. Microstructured body according to one of the preceding claims, characterized in that the adjustment designs contain at least one outer edge (16) of the substrate (10).

14. Microstructured body according to claim 13, characterized in that the adjustment designs contain at least one recess (18) which is formed on the surface of the substrate (10).

15. Microstructured body according to claim 14, characterized in that the recess is a groove (18).

16. Microstructured body according to claim 15, characterized in that the groove (18) has a V-shaped cross section.

17. Microstructured body according to claim 14, characterized in that the depression is an adjustment cross.

18. Microstructured body according to claim 14, characterized in that the recess is a cone.

19. Microstructured body according to one of the preceding claims, characterized in that the adjustment designs (16, 18) at least partially in spatial proximity to microstructured

Designs (12, 14) are arranged.

20. Microstructured body according to one of the preceding claims, characterized in that it has a heating element (82) formed on the coating and a cooling element (84) formed on the coating, so that a thermo-optical component is formed.

21. Microstructured body according to one of the preceding claims, characterized in that it is provided with a shield (50) so that a shielded high-frequency conductor is formed.

22. A method for producing microstructured bodies using the following steps:

a substrate (10) is produced, which has adjustment configurations (16, 18), - The surface of the substrate (10) is coated at least in regions with a liquid material (20),

- A cover (30) with a microstructured surface is placed on the substrate (10), the cover (30) being provided with positioning designs (34, 36) that correspond to the adjustment designs (16,

18) are complementary, so that the cover (30) is arranged in a precisely defined position on the substrate (10), and with micro-structured designs by means of which the coating is micro-structured, - the cover (30) is mechanically placed on the substrate ( 10) pressed, the microstructured surface of the cover (30) being molded at least in regions in the coating,

- The applied material (20) is cured,

- The lid (30) is removed from the substrate (10).

23. The method according to claim 22, characterized in that the cover (30) is microstructured in such a way that the applied coating is displaced from the areas to be structured when the cover (30) is pressed on.

24. The method according to claim 22, characterized in that the cover (30) is microstructured in such a way that the applied coating is pressed into the regions to be structured when the cover (30) is pressed on.

25. The method according to any one of claims 22 to 24, characterized in that a material (20) is used as the liquid material, which differs in its physical properties from the properties of the material of the substrate (10) in such a way that it is an optical waveguide (40, 41) forms.

26. The method according to claim 25, characterized in that the material (20) is pressed into the recess (37) in the cover (30) when the cover (30) is pressed on.

27. The method according to any one of claims 22 to 26, characterized in that after the first material (20) a second material (22) is applied, which is microstructured by means of a second lid.

28. The method according to any one of claims 22 to 27, characterized in that the body is formed by applying the coating to the substrate (10) and then curing.

29. The method according to any one of claims 22 to 27, characterized in that the body is formed by the hardened coating which is lifted off the substrate (10).

30. A microstructured film obtained by a method according to claim 29.