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WO1999067822A1 - Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module - Google Patents

Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module Download PDF

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Publication number
WO1999067822A1
WO1999067822A1 PCT/FR1999/001437 FR9901437W WO9967822A1 WO 1999067822 A1 WO1999067822 A1 WO 1999067822A1 FR 9901437 W FR9901437 W FR 9901437W WO 9967822 A1 WO9967822 A1 WO 9967822A1
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
connection pads
module
internal connection
cavity
Prior art date
Application number
PCT/FR1999/001437
Other languages
French (fr)
Inventor
Christophe Fletout
Benoît Thevenot
Original Assignee
Schlumberger Systemes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systemes filed Critical Schlumberger Systemes
Priority to JP2000556399A priority Critical patent/JP2002519849A/en
Priority to EP99957214A priority patent/EP1099254A1/en
Priority to AU42689/99A priority patent/AU4268999A/en
Publication of WO1999067822A1 publication Critical patent/WO1999067822A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

Definitions

  • the present invention relates to an integrated circuit module and a mixed connection card comprising such a module.
  • Such cards can be connected to a reader either by a contact link via the external connection pads of the card, or by a contactless link by magnetic, radio or optical coupling.
  • An integrated circuit module generally comprises a support film having a first face carrying the integrated circuit and internal connection pads, and a second face carrying external connection pads extending up to the periphery of the second face, the pads of internal and external connection being connected to the integrated circuit.
  • This module is intended to be fixed in a card with mixed connection comprising a card body in which an antenna is embedded.
  • the integrated circuit module is glued into a cavity of the card body so that the internal connection pads extend 1 perpendicular to the antenna terminals.
  • the internal connection pads are connected to the terminals of the antenna by a conductive adhesive received in holes extending in the card body directly above the terminals of the antenna and opening into the cavity.
  • the module is placed in the cavity of the card body by pressing it into the cavity after the conductive adhesive has been deposited in the holes in the card body. So that the contact between the conductive adhesive and each internal connection area is sufficient to allow an efficient electrical connection between the internal connection pads and the antenna terminals, there is generally deposited a quantity of glue such that glue overflows from the bore. As a result, during gluing, the excess glue is expelled from the cavity due to the pressure exerted on the module and rises between the edges of the cavity and the edge of the support film. The adhesive may then come to establish a short-circuit connection between an internal connection pad and an external connection pad, thus rendering the card unusable.
  • An object of the invention is to provide a means for preventing the formation of such short-circuit connections during bonding of the module.
  • an integrated circuit module comprising a support film having a first face carrying the integrated circuit and internal connection pads and a second face carrying external connection pads, the internal connection pads and the external connection pads being connected to the integrated circuit, the second face of the support film comprising at least one peripheral zone electrically isolated from the integrated circuit and extending opposite at least one of the internal connection pads .
  • the peripheral zone comprises a metal layer of the same thickness as the external connection pads.
  • External connection ranges are generally produced by depositing a conductive sheet on the second face of the support film and acid attack of this sheet to delimit the different areas of external connection.
  • the peripheral zone is cut from the initial conductive sheet. The manufacture of the module is therefore simple and the arrangement of peripheral zones electrically isolated from the integrated circuit is inexpensive.
  • At least one of the internal connection pads comprises a cavity.
  • the cavity can then receive the excess of conductive adhesive.
  • the cavity is in the form of a spiral.
  • the cavity will preferably be positioned so that it surrounds the area of the internal connection area intended to be in contact with the adhesive. This ensures both good contact with the antenna terminals and the production of a reserve volume sufficient to receive the excess adhesive.
  • the invention also relates to a mixed connection card comprising an integrated circuit module having at least one of the aforementioned characteristics.
  • FIG. 1 is a top view of the integrated circuit module according to the invention, from the side of the external connection pads,
  • FIG. 2 is a bottom view of this integrated circuit module
  • the integrated circuit module according to the invention comprises a support film 2.
  • the support film 2 has a first face 2.1 carrying an integrated circuit 3 and two internal connection pads 4, and a second face 2.2, opposite the first face 2.1, carrying a plurality of external connection pads 5.
  • the integrated circuit 3 is connected in a manner known per se to the internal connection pads 4 and to the external connection pads 5 by conductors 6, and is embedded in a drop of resin 7 also surrounding the conductors 6.
  • each strip 8 extends opposite an internal connection pad 4.
  • the strips 8 are spaced from the external connection pads 5 and electrically isolated from the integrated circuit.
  • Each internal connection pad 4 comprises a cavity 9 in the form of a spiral.
  • the card with mixed connection comprises a card body in which an antenna 11 is embedded.
  • the card body 10 comprises a cavity 12 for receiving the module 1 described above.
  • Holes 13 extend vertically above the terminals of the antenna 11 to open into the cavity 12.
  • the holes 13 contain conductive adhesive 14.
  • the module 1 is fixed with glue 15 of cyanoacrylate type in the cavity 12 so that the cavity 9 of each internal connection area 4 of the module 1 extends opposite the opening of a bore 13.
  • the conductive adhesive 14 contained in the holes 13 ensures the electrical connection between the terminals of the antenna 11 and the internal connection pads 4.
  • the strips 8 form an isolated area between the external connection pads 5 and the periphery of the support film so that the risk of a glue rise sufficiently large to reach an external connection pad is practically eliminated.
  • the excess conductive adhesive 14 is received in the cavities 9 of the internal connection pads 4.
  • the cavities 9 therefore make it possible to limit the flow of conductive adhesive and thus prevent an excessive amount of adhesive from rising by capillarity. between the edges of the cavity 12 and the edge of the support film 2 and risks reaching external connection areas.
  • the invention is not limited to the embodiment described and it is possible to make variant embodiments without departing from the scope of the invention as defined by the claims.
  • peripheral zone electrically isolated from the integrated circuit has been represented by a metal strip 8
  • this electrically isolated zone can be produced by leaving the second face of the support film bare in this zone.
  • the peripheral zone is formed of a bare strip extending substantially over the entire periphery of the second face.
  • the cavity 9 has been shown in the form of a spiral, it is possible to produce a cavity 9 in an arc extending in the vicinity of the external periphery of the connection pad 4, or in any other suitable form.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention concerns an integrated circuit module (1) comprising a support film (2) having a first surface (2.1) bearing the integrated circuit (3) and internal connection pads (4) and a second surface (2.2) bearing external connection pads (5) the internal and external connection pads being connected to the integrated circuit, the film support (2) second surface (2.2) comprising at least an electrically insulated peripheral zone (8) of the integrated circuit extending opposite at least one of the internal connection pads (4). The invention also concerns a mixed connection card comprising such a module.

Description

MODULE A CIRCUIT INTEGRE AYANT UNE FACE COMPORTANT UNE ZONE PERIPHERIQUE ISOLEE ELECTRIQUEMENT DU CIRCUIT INTEGRE, ET CARTE A CONNEXION MIXTE COMPORTANT UN TEL MODULEINTEGRATED CIRCUIT MODULE HAVING A FACE COMPRISING AN ELECTRICALLY ISOLATED PERIPHERAL AREA FROM THE INTEGRATED CIRCUIT, AND MIXED CONNECTION CARD COMPRISING SUCH A MODULE
La présente invention concerne un module à circuit intégré et une carte à connexion mixte comportant un tel module. De telles cartes peuvent être reliées à un lecteur soit par une liaison avec contact par 1 ' intermé- diaire de plages de connexion externe de la carte, soit par une liaison sans contact par couplage magnétique, radio ou optique.The present invention relates to an integrated circuit module and a mixed connection card comprising such a module. Such cards can be connected to a reader either by a contact link via the external connection pads of the card, or by a contactless link by magnetic, radio or optical coupling.
Un module à circuit intégré comprend généralement un film support ayant une première face portant le circuit intégré et des plages de connexion interne, et une seconde face portant des plages de connexion externe s'étendant jusqu'au pourtour de la seconde face, les plages de connexion interne et externe étant raccordées au circuit intégré. Ce module est destiné à être fixé dans une carte à connexion mixte comprenant un corps de carte dans lequel est noyée une antenne. Le module à circuit intégré est collé dans une cavité du corps de carte de façon que les plages de connexion interne s ' étendent à 1 ' aplomb de bornes de l'antenne. Les plages de connexion interne sont raccordées aux bornes de l'antenne par une colle conductrice reçue dans des perçages s ' étendant dans le corps de carte à 1 ' aplomb des bornes de 1 ' antenne et débouchant dans la cavité. La mise en place du module dans la cavité du corps de carte est effectuée en pressant celui-ci dans la cavité après le dépôt de la colle conductrice dans les perçages du corps de carte . Pour que le contact entre la colle conductrice et chaque plage de connexion interne soit suffisant pour permettre une liaison électrique efficace entre les plages de connexion interne et les bornes de l'antenne, il est en général déposé une quantité de colle telle que de la colle déborde du perçage. Il en résulte que lors du collage, la colle en excès est chassée de la cavité du fait de la pression exercée sur le module et remonte entre les bords de la cavité et le bord du film support. La colle risque alors de venir établir une liaison de court-circuit entre une plage de connexion interne et une plage de connexion externe, rendant ainsi la carte inutilisable.An integrated circuit module generally comprises a support film having a first face carrying the integrated circuit and internal connection pads, and a second face carrying external connection pads extending up to the periphery of the second face, the pads of internal and external connection being connected to the integrated circuit. This module is intended to be fixed in a card with mixed connection comprising a card body in which an antenna is embedded. The integrated circuit module is glued into a cavity of the card body so that the internal connection pads extend 1 perpendicular to the antenna terminals. The internal connection pads are connected to the terminals of the antenna by a conductive adhesive received in holes extending in the card body directly above the terminals of the antenna and opening into the cavity. The module is placed in the cavity of the card body by pressing it into the cavity after the conductive adhesive has been deposited in the holes in the card body. So that the contact between the conductive adhesive and each internal connection area is sufficient to allow an efficient electrical connection between the internal connection pads and the antenna terminals, there is generally deposited a quantity of glue such that glue overflows from the bore. As a result, during gluing, the excess glue is expelled from the cavity due to the pressure exerted on the module and rises between the edges of the cavity and the edge of the support film. The adhesive may then come to establish a short-circuit connection between an internal connection pad and an external connection pad, thus rendering the card unusable.
Un but de 1 ' invention est de fournir un moyen pour éviter la formation de telles liaisons de court- circuit lors du collage du module. En vue de la réalisation de ce but, on prévoit, selon 1 ' invention un module à circuit intégré comprenant un film support ayant une première face portant le circuit intégré et des plages de connexion interne et une seconde face portant des plages de connexion externe, les plages de connexion interne et les plages de connexion externe étant raccordées au circuit intégré, la seconde face du film support comprenant au moins une zone périphérique isolée électriquement du circuit intégré et s'étendant en regard d'au moins une des plages de connexion interne. Ainsi, s'il se produit une remontée de colle conductrice lors de la fixation du module à circuit intégré dans le corps de la carte, la colle conductrice n'atteint qu'une zone de la seconde face du film support isolée électriquement du circuit intégré. Le risque de formation d'un court-circuit est donc limité.An object of the invention is to provide a means for preventing the formation of such short-circuit connections during bonding of the module. With a view to achieving this aim, provision is made, according to the invention, for an integrated circuit module comprising a support film having a first face carrying the integrated circuit and internal connection pads and a second face carrying external connection pads, the internal connection pads and the external connection pads being connected to the integrated circuit, the second face of the support film comprising at least one peripheral zone electrically isolated from the integrated circuit and extending opposite at least one of the internal connection pads . Thus, if there is a rise in conductive adhesive when the integrated circuit module is fixed in the body of the card, the conductive adhesive only reaches an area on the second face of the support film electrically isolated from the integrated circuit. . The risk of a short circuit is therefore limited.
De préférence la zone périphérique comporte une couche métallique de même épaisseur que les plages de connexion externe .Preferably, the peripheral zone comprises a metal layer of the same thickness as the external connection pads.
Les plages de connexion externe sont en général réalisées par dépôt d'une feuille conductrice sur la seconde face du film support et attaque acide de cette feuille pour délimiter les différentes plages de connexion externe. Dans cette réalisation, la zone périphérique est découpée à partir de la feuille conductrice initiale. La fabrication du module est donc simple et l'aménagement de zones périphériques isolées électriquement du circuit intégré est peu coûteux.External connection ranges are generally produced by depositing a conductive sheet on the second face of the support film and acid attack of this sheet to delimit the different areas of external connection. In this embodiment, the peripheral zone is cut from the initial conductive sheet. The manufacture of the module is therefore simple and the arrangement of peripheral zones electrically isolated from the integrated circuit is inexpensive.
Avantageusement, au moins une des plages de connexion interne comprend une cavité. La cavité peut alors recevoir l'excédent de colle conductrice.Advantageously, at least one of the internal connection pads comprises a cavity. The cavity can then receive the excess of conductive adhesive.
Avantageusement alors, la cavité est en forme de spirale. On positionnera préférentiellement la cavité pour qu'elle entoure la zone de la plage de connexion interne destinée à être en contact avec la colle. On assure ainsi tout à la fois un bon contact avec les bornes d'antenne et la réalisation d'un volume de réserve suffisant pour recevoir l'excédent de colle.Advantageously then, the cavity is in the form of a spiral. The cavity will preferably be positioned so that it surrounds the area of the internal connection area intended to be in contact with the adhesive. This ensures both good contact with the antenna terminals and the production of a reserve volume sufficient to receive the excess adhesive.
L'invention concerne également une carte à connexion mixte comprenant un module à circuit intégré présentant au moins l'une des caractéristiques précitées.The invention also relates to a mixed connection card comprising an integrated circuit module having at least one of the aforementioned characteristics.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description qui suit d'un mode de réalisation particulier non limitatif de l'invention.Other characteristics and advantages of the invention will appear on reading the following description of a particular non-limiting embodiment of the invention.
Il sera fait référence aux dessins annexés, parmi lesquels :Reference will be made to the appended drawings, among which:
- la figure 1 est une vue de dessus du module à circuit intégré selon l'invention, du côté des plages de connexion externe,FIG. 1 is a top view of the integrated circuit module according to the invention, from the side of the external connection pads,
- la figure 2 est une vue de dessous de ce module à circuit intégré,FIG. 2 is a bottom view of this integrated circuit module,
- la figure 3 est une vue en coupe transversale d'une carte à connexion mixte selon l'invention. En référence aux figures, le module à circuit intégré selon l'invention, généralement désigné en 1, comprend un film support 2. Le film support 2 a une première face 2.1 portant un circuit intégré 3 et deux plages de connexion interne 4 , et une seconde face 2.2, opposée à la première face 2.1, portant une pluralité de plages de connexion externe 5. Le circuit intégré 3 est relié de façon connue en soi aux plages de connexion interne 4 et aux plages de connexion externe 5 par des conducteurs 6, et est noyé dans une goutte de résine 7 entourant également les conducteurs 6.- Figure 3 is a cross-sectional view of a mixed connection card according to the invention. With reference to the figures, the integrated circuit module according to the invention, generally designated in 1, comprises a support film 2. The support film 2 has a first face 2.1 carrying an integrated circuit 3 and two internal connection pads 4, and a second face 2.2, opposite the first face 2.1, carrying a plurality of external connection pads 5. The integrated circuit 3 is connected in a manner known per se to the internal connection pads 4 and to the external connection pads 5 by conductors 6, and is embedded in a drop of resin 7 also surrounding the conductors 6.
Conformément à l'invention, deux bandes réalisées à partir de la même feuille conductrice que les plages de connexion externe 5 mais séparées de celles-ci s'étendent sur la périphérie de la seconde face 2.2 du film support. Chaque bande 8 s'étend en regard d'une plage de connexion interne 4. Les bandes 8 sont espacées des plages de connexion externe 5 et isolées électriquement du circuit intégré. Chaque plage de connexion interne 4 comprend une cavité 9 en forme de spirale.According to the invention, two strips made from the same conductive sheet as the external connection pads 5 but separated from them extend over the periphery of the second face 2.2 of the support film. Each strip 8 extends opposite an internal connection pad 4. The strips 8 are spaced from the external connection pads 5 and electrically isolated from the integrated circuit. Each internal connection pad 4 comprises a cavity 9 in the form of a spiral.
En référence plus particulièrement à la figure 3, la carte à connexion mixte selon l'invention comprend un corps de carte dans lequel est noyée une antenne 11. Le corps de carte 10 comprend une cavité 12 pour recevoir le module 1 décrit précédemment .Referring more particularly to FIG. 3, the card with mixed connection according to the invention comprises a card body in which an antenna 11 is embedded. The card body 10 comprises a cavity 12 for receiving the module 1 described above.
Des perçages 13 s'étendent à l'aplomb des bornes de 1 ' antenne 11 pour déboucher dans la cavité 12. Les perçages 13 contiennent de la colle conductrice 14. Le module 1 est fixé avec de la colle 15 de type cyanoacrylate dans la cavité 12 de façon que la cavité 9 de chaque plage de connexion interne 4 du module 1 s'étende en regard du débouché d'un perçage 13. La colle conductrice 14 contenue dans les perçages 13 assure la liaison électrique entre les bornes de 1 ' antenne 11 et les plages de connexion interne 4.Holes 13 extend vertically above the terminals of the antenna 11 to open into the cavity 12. The holes 13 contain conductive adhesive 14. The module 1 is fixed with glue 15 of cyanoacrylate type in the cavity 12 so that the cavity 9 of each internal connection area 4 of the module 1 extends opposite the opening of a bore 13. The conductive adhesive 14 contained in the holes 13 ensures the electrical connection between the terminals of the antenna 11 and the internal connection pads 4.
On comprend que les bandes 8 forment une zone isolée entre les plages de connexion externe 5 et le pourtour du film support de sorte que le risque d'une remontée de colle suffisamment importante pour atteindre une plage de connexion externe est pratiquement éliminé.It is understood that the strips 8 form an isolated area between the external connection pads 5 and the periphery of the support film so that the risk of a glue rise sufficiently large to reach an external connection pad is practically eliminated.
De plus, la colle conductrice 14 en excès est reçue dans les cavités 9 des plages de connexion interne 4. Les cavités 9 permettent donc de limiter l'écoulement de colle conductrice et éviter ainsi qu'une quantité trop importante de colle ne remonte par capillarité entre les bords de la cavité 12 et le bord du film support 2 et risque d'atteindre des plages de connexion externe. Bien entendu l'invention n'est pas limitée au mode de réalisation décrit et on peut y apporter des variantes de réalisation sans sortir du cadre de 1 ' invention tel que défini par les revendications.In addition, the excess conductive adhesive 14 is received in the cavities 9 of the internal connection pads 4. The cavities 9 therefore make it possible to limit the flow of conductive adhesive and thus prevent an excessive amount of adhesive from rising by capillarity. between the edges of the cavity 12 and the edge of the support film 2 and risks reaching external connection areas. Of course, the invention is not limited to the embodiment described and it is possible to make variant embodiments without departing from the scope of the invention as defined by the claims.
En particulier, bien que la zone périphérique isolée électriquement du circuit intégré ait été représentée par une bande métallique 8, on peut réaliser cette zone isolée électriquement en laissant nue la seconde face du film support dans cette zone. On peut par exemple prévoir que la zone périphérique soit formée d'une bande nue s'étendant sensiblement sur tout le pourtour de la seconde face.In particular, although the peripheral zone electrically isolated from the integrated circuit has been represented by a metal strip 8, this electrically isolated zone can be produced by leaving the second face of the support film bare in this zone. One can for example provide that the peripheral zone is formed of a bare strip extending substantially over the entire periphery of the second face.
Bien que la cavité 9 ait été représentée en forme de spirale, on peut réaliser une cavité 9 en arc de cercle s'étendant à proximité du pourtour externe de la plage de connexion 4, ou en toute autre forme appropriée. Although the cavity 9 has been shown in the form of a spiral, it is possible to produce a cavity 9 in an arc extending in the vicinity of the external periphery of the connection pad 4, or in any other suitable form.

Claims

REVENDICATIONS 1. Module à circuit intégré (1) comprenant un film support (2) ayant une première face (2.1) portant un circuit intégré (3) et des plages de connexion interne (4) et une seconde face (2.2) portant des plages de connexion externe (5) , les plages de connexion interne et les plages de connexion externe étant raccordées au circuit intégré, caractérisé en ce que la seconde face (2.2) du film support (2) comprend au moins une zone périphérique (8) isolée électriquement du circuit intégré (3) et s'étendant en regard d'au moins une des plages de connexion interne (4) . CLAIMS 1. Integrated circuit module (1) comprising a support film (2) having a first face (2.1) carrying an integrated circuit (3) and internal connection pads (4) and a second face (2.2) carrying pads of external connection (5), the internal connection pads and the external connection pads being connected to the integrated circuit, characterized in that the second face (2.2) of the support film (2) comprises at least one isolated peripheral zone (8) electrically from the integrated circuit (3) and extending opposite at least one of the internal connection pads (4).
2. Module à circuit intégré selon la revendication 1, caractérisé en ce que la zone périphérique (8) comporte une couche métallique de même épaisseur que les plages de connexion externe.2. Integrated circuit module according to claim 1, characterized in that the peripheral zone (8) comprises a metal layer of the same thickness as the external connection pads.
3. Module à circuit intégré selon la revendication 1 ou la revendication 2, caractérisé en ce qu'au moins une des plages de connexion interne (4) comprend une cavité (9) .3. Integrated circuit module according to claim 1 or claim 2, characterized in that at least one of the internal connection pads (4) comprises a cavity (9).
4. Module à circuit intégré selon la revendication 3, caractérisé en ce que la cavité (9) est en forme de spirale .4. Integrated circuit module according to claim 3, characterized in that the cavity (9) is in the form of a spiral.
5. Carte à connexion mixte comprenant un corps de carte (10) dans lequel est noyée une antenne (11) , et un module à circuit intégré (1) comportant un film support5. Card with mixed connection comprising a card body (10) in which an antenna (11) is embedded, and an integrated circuit module (1) comprising a support film
(2) ayant une première face (2.1) portant le circuit intégré (3) et des plages de connexion interne (4) et une seconde face (2.2) portant des plages de connexion externe (5) , le module à circuit intégré étant disposé dans une cavité (12) du corps de carte de façon que les plages de connexion interne (4) s'étendent à l'aplomb de bornes de l'antenne (11), les plages de connexion interne (4) étant reliées aux bornes de l'antenne (11) par de la colle conductrice (14) reçue dans des perçages (13) s'étendant dans le corps de carte entre les plages de connexion interne (4) et les bornes de l'antenne (11), caractérisée en ce que la seconde face (2.2) du film support (2) comprend au moins une zone périphérique (8) isolée électriquement du circuit intégré et s'étendant sensiblement en regard d'au moins une des plages de connexion interne (4) .(2) having a first face (2.1) carrying the integrated circuit (3) and internal connection pads (4) and a second face (2.2) carrying external connection pads (5), the integrated circuit module being arranged in a cavity (12) of the card body so that the internal connection pads (4) extend in line with the terminals of the antenna (11), the internal connection pads (4) being connected to the terminals antenna (11) with glue conductive (14) received in holes (13) extending in the card body between the internal connection pads (4) and the terminals of the antenna (11), characterized in that the second face (2.2) of the support film (2) comprises at least one peripheral zone (8) electrically isolated from the integrated circuit and extending substantially opposite at least one of the internal connection pads (4).
6. Carte à connexion mixte selon la revendication 5, caractérisée en ce que la zone périphérique (8) comporte une couche métallique de même épaisseur que les plages de connexion externe (5)6. Mixed connection card according to claim 5, characterized in that the peripheral zone (8) comprises a metal layer of the same thickness as the external connection pads (5)
7. Carte à connexion mixte selon la revendication 5 ou la revendication 6, caractérisée en ce qu'au moins une des plages de connexion interne (4) comprend une cavité (9) pour recevoir un excédent de colle conductrice (14) .7. Mixed connection card according to claim 5 or claim 6, characterized in that at least one of the internal connection pads (4) comprises a cavity (9) for receiving an excess of conductive adhesive (14).
8. Carte à connexion mixte selon la revendication 7, caractérisée en ce que la cavité (9) est en forme de spirale s'étendant en regard du perçage (13) correspondant recevant la colle conductrice (14) . 8. Card with mixed connection according to claim 7, characterized in that the cavity (9) is in the form of a spiral extending opposite the corresponding hole (13) receiving the conductive adhesive (14).
PCT/FR1999/001437 1998-06-23 1999-06-16 Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module WO1999067822A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000556399A JP2002519849A (en) 1998-06-23 1999-06-16 Integrated circuit module having a surface including a peripheral area electrically insulated from the integrated circuit and hybrid connection card including the module
EP99957214A EP1099254A1 (en) 1998-06-23 1999-06-16 Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module
AU42689/99A AU4268999A (en) 1998-06-23 1999-06-16 Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9807912A FR2780201B1 (en) 1998-06-23 1998-06-23 INTEGRATED CIRCUIT MODULE HAVING A FACE COMPRISING AN ELECTRICALLY ISOLATED PERIPHERAL AREA FROM THE INTEGRATED CIRCUIT, AND MIXED CONNECTION CARD COMPRISING SUCH A MODULE
FR98/07912 1998-06-23

Publications (1)

Publication Number Publication Date
WO1999067822A1 true WO1999067822A1 (en) 1999-12-29

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EP (1) EP1099254A1 (en)
JP (1) JP2002519849A (en)
CN (1) CN1312957A (en)
AU (1) AU4268999A (en)
FR (1) FR2780201B1 (en)
WO (1) WO1999067822A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9685496B2 (en) 2007-12-04 2017-06-20 Renesas Electronics Corporation Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104934676B (en) * 2015-06-23 2018-03-09 西安空间无线电技术研究所 A kind of implementation method of millimeter wave frequency band Waveguide-microbelt transition structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0065437A1 (en) * 1981-04-30 1982-11-24 COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) Device for protecting electronic circuits such as integrated circuits from electrostatic charges
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
EP0449691A1 (en) * 1990-03-28 1991-10-02 Schlumberger Industries Electronic Memory Card Manufacturing Process
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0065437A1 (en) * 1981-04-30 1982-11-24 COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) Device for protecting electronic circuits such as integrated circuits from electrostatic charges
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
EP0449691A1 (en) * 1990-03-28 1991-10-02 Schlumberger Industries Electronic Memory Card Manufacturing Process
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9685496B2 (en) 2007-12-04 2017-06-20 Renesas Electronics Corporation Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
US10115783B2 (en) 2007-12-04 2018-10-30 Renesas Electronics Corporation Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device

Also Published As

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EP1099254A1 (en) 2001-05-16
AU4268999A (en) 2000-01-10
JP2002519849A (en) 2002-07-02
CN1312957A (en) 2001-09-12
FR2780201A1 (en) 1999-12-24
FR2780201B1 (en) 2001-09-21

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