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WO1999016089A1 - Elements ceramiques stratifies - Google Patents

Elements ceramiques stratifies Download PDF

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Publication number
WO1999016089A1
WO1999016089A1 PCT/JP1998/004208 JP9804208W WO9916089A1 WO 1999016089 A1 WO1999016089 A1 WO 1999016089A1 JP 9804208 W JP9804208 W JP 9804208W WO 9916089 A1 WO9916089 A1 WO 9916089A1
Authority
WO
WIPO (PCT)
Prior art keywords
oxide
silver
conductor
multilayer ceramic
ceramic
Prior art date
Application number
PCT/JP1998/004208
Other languages
English (en)
Japanese (ja)
Inventor
Kazuaki Suzuki
Takahide Kurahashi
Hidenori Ohata
Original Assignee
Tdk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corporation filed Critical Tdk Corporation
Priority to EP98943039A priority Critical patent/EP0940825B1/fr
Priority to DE69834098T priority patent/DE69834098T2/de
Publication of WO1999016089A1 publication Critical patent/WO1999016089A1/fr
Priority to US09/315,156 priority patent/US6235221B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H01P1/387—Strip line circulators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Definitions

  • the present invention relates to a multilayer ceramic component.
  • a ceramic material which is an oxide magnetic material, and a conductor material are co-fired, and one or more functions are provided in one component.
  • a laminated ceramic component is manufactured by laminating a ceramic material and a conductive material by a printing method, a sheet method, or the like, and cutting the laminated body into a desired shape and dimensions, followed by firing or This laminate is manufactured by firing, cutting into a desired shape and dimensions, and then forming an external conductor as necessary. Therefore, these multilayer ceramic components have a structure having an internal conductor between the ceramic layers. Ag, Cu, etc.
  • the inner conductor suitable for high frequency, especially microwave are generally used as the inner conductor suitable for high frequency, especially microwave, but in the above-mentioned manufacturing method, melting of the inner conductor is prevented in order to obtain sufficient characteristics. It was considered necessary to perform firing at a temperature below the melting point of the internal conductor. For this reason, ceramic materials fired at high temperatures include conductive materials with low resistivity but low melting points, such as Ag and Cu. It was considered impossible to use the material for the inner conductor.
  • Japanese Patent Application Laid-Open No. 6-252618 by the present applicant proposes a method of forming the above-mentioned low-melting internal conductor in a ceramic not intended for low-temperature firing.
  • This is called a conductor melting method, in which a multilayer ceramic component is fired at a temperature between the melting point and the boiling point of the conductive material used as the inner conductor, and the fired conductor material is solidified during the cooling process to form an inner conductor. It is.
  • the grain boundaries between the metal particles formed when the molten conductive material solidifies become thin enough to be regarded as having virtually disappeared.
  • the irregularities also tend to be smaller, so the high-frequency resistance of the internal conductor decreases and the Q value in the high-frequency region increases.
  • a low-cost conductive material having a relatively low melting point such as Ag or Cu, can be used for the inner conductor.
  • the ceramic and the internal conductor can be co-fired, it is very advantageous in terms of productivity and cost.
  • voids are formed in the internal conductor during solidification during the cooling process after the internal conductor is melted, thereby increasing the resistance value of the internal conductor and increasing the Q of the multilayer ceramic component.
  • the value may decrease, or in rare cases, the inner conductor itself may break due to a void.
  • the gas existing in the voids expands during the cooling process due to the effect of latent heat of solidification, causing cracks in the element. For this reason, the yield decreases. Therefore, when manufacturing a multilayer ceramic component by the conductor melting method, it is necessary to suppress the occurrence of voids in the internal conductor.
  • the present applicant has developed a void and a crack due to the void even when using an internal conductor containing silver as a main component and co-firing with a ceramic material by a conductor melting method.
  • International Publication WO988 No. 05045 proposed a multilayer ceramic component having the following conductive paste and an internal conductor formed using the conductive base.
  • the conductive paste is a conductive paste in which a conductive material mainly composed of silver and a metal oxide are dispersed in a vehicle, and the metal oxide is a Ga oxide, a La oxide, or a Pr oxide.
  • a conductive paste which is at least one of an oxide, an Sm oxide, an Eu oxide, a Gd oxide, a Dy oxide, an Er oxide, a Tm oxide and a Yb oxide.
  • this conductor paste when a ceramic material is co-fired with the ceramic material by a conductor melting method to produce a multilayer ceramic component, no voids are generated and no crack is generated in the ceramic body. Also, the conductor resistivity is low. By using this conductor paste, it is possible to produce a multilayer ceramic component having a high yield and a very high quality.
  • An object of the present invention is to provide a multilayer ceramic component which can be manufactured with high yield even if the size is further reduced.
  • the internal conductor layer is formed of a conductive material containing silver as a main component, and the ceramic layer is a yttrium iron garnet-based oxide magnetic material.
  • Multilayer ceramic parts made of silver-added materials.
  • the inner conductor layer is made of a conductive material mainly composed of silver, Ga oxide, La oxide, Pr oxide, Sm oxide, Eu oxide, Gd oxide, Dy oxide, Er.
  • the internal conductor layer is formed of a conductive material containing silver as a main component, and the ceramic layer is an yttrium iron garnet-based oxide. Since silver is added to the magnetic material, the action of silver minimizes the formation of voids and the like in the internal conductor layer and improves the production yield of components.
  • FIG. 1 is a partially broken perspective view schematically showing the configuration of a magnetic rotor of a three-terminal circuit.
  • FIG. 2 is an exploded perspective view showing the entire configuration of the three-terminal circuit.
  • FIG. 3 is an equivalent circuit diagram of the three-terminal circuit of FIG.
  • FIG. 4A, FIG. 4B, and FIG. 4C are views illustrating a part of the manufacturing process of the magnetic rotor of FIG.
  • 5A, 5B, and 5C are diagrams for explaining the structure of the non-reciprocal circuit device manufactured in the example.
  • the multilayer ceramic component of the present invention includes an internal conductor layer and a ceramic layer.
  • an internal conductor layer and a ceramic layer are formed by sandwiching a conductor paste between ceramic material layers and firing at a temperature equal to or higher than the melting point and lower than the boiling point of the conductive material.
  • the conductor base is obtained by dispersing a conductive material containing silver as a main component in a vehicle, and it is preferable that a predetermined metal oxide is further dispersed in the vehicle.
  • the conductive material is mainly composed of silver, and may be a mixture of silver and a metal that is dissolved in silver, such as copper, gold, palladium, and platinum, in addition to silver alone. Regardless of the metal added, the silver content in the conductive material should be 70 mol% or more. The reason is that when the amount of the mixture exceeds 30 mol%, the resistivity of the alloy increases as compared with the resistivity of silver. More preferably, the mixing amount is 5 mol% or less (the silver content is 95 mol% or more) in order to suppress an increase in production cost.
  • the content of the metal oxide with respect to 100 parts by weight of the conductive material is less than 0.1 part by weight, a sufficient reaction phase is not generated at the interface, and the wettability of silver becomes poor. If the amount exceeds 20 parts by weight, the metal oxide cannot be diffused completely, the metal oxide remains on the internal conductor, and the conductor resistance increases. Therefore, the content of the metal oxide is preferably 0.1 to 20 parts by weight based on 100 parts by weight of the conductive material.
  • the particle size of the conductive material is not particularly limited, but when the conductor is formed by a screen printing method, the average particle size is preferably 0.1 to 20.
  • the average particle size of the metal oxide is preferably set to 0.1 to 20 / m for the same reason.
  • binders such as ethyl cellulose, nitrocellulose, and acrylic resin, organic solvents such as terbineol, butyl carbitol, and hexyl carbyl], and other dispersants and activators are appropriately added as necessary.
  • the vehicle content of the conductor paste is preferably 5 to 70% by weight.
  • the viscosity of the conductive paste is preferably adjusted to about 300 to 30,000 cps (centiboise).
  • garnet type ferrite for high frequency As the magnetic material for forming the ceramic layer, garnet type ferrite for high frequency is usually used.
  • the high frequency gas one net-type ferrite, those YI G (Germany thorium iron garnet) system, specifically to a basic composition of Y 3 F e 5 ⁇ 12, substituted moth one obtained by adding various elements to Re this Net ferrite is preferred.
  • Is preferably at least one of Ca, Bi and Gd, and at least one of Ho and O 6 as a trace additive for improving properties.
  • the element / 3 that replaces Fe is at least one of V, Al, Ge, Ga, Sn, Zr, Ti, and In.
  • at least one of Mn, Co and Si is used as a trace additive.
  • the replacement amount is preferably
  • the atomic ratio of the above-mentioned trace additive for improving the properties in the above formula is usually 0.2 or less. Further, (Y including the substitution element): (F e including the substitution element): ⁇ ⁇ may deviate from the stoichiometric composition ratio of 3: 5: 12. The average grain size of garnet ferrite is about 1 to 10 xm.
  • the sheet of the magnetic material is formed using a magnetic paste containing the magnetic material and the vehicle.
  • Vehicles include binders such as ethyl cellulose, polyvinyl butyral, methyl methacrylate resin, and butyl methacrylate, terpineol, butyl carbyl, butyl carbitol acetate, acetate, toluene, alcohol, xylene, and the like. Solvents, other dispersants, activators, plasticizers and the like can be mentioned, and any of these can be appropriately selected according to the purpose.
  • the amount of the vehicle added is preferably about 65 to 85% by weight based on 100 parts by weight of the total amount of the oxide aggregate and the glass. According to the present invention, silver is added to the magnetic paste.
  • the content of silver in the magnetic material is preferably 10 wi% or less, particularly 5 wt% or less, more preferably 3 wt% or less, and further preferably 1 wt% or less.
  • the addition of silver has an effect even in a very small amount.
  • the lower limit is not particularly limited as long as it is not 0, but the preferred lower limit is 0.1 wt%, particularly 0.2 wt%.
  • the silver is preferably added to the magnetic paste in a granular form, and the average particle diameter of the silver particles is preferably 2.5 to 4.5 m. After firing, silver is usually present at the grain boundaries.
  • the conductor paste of the present invention and a ceramic material are laminated by a known printing method or a sheet method to form a green laminate, which is fired at a temperature equal to or higher than the melting point of the conductive material and lower than the boiling point.
  • various multilayer ceramic parts can be obtained. For example, chip capacitors, chip inductors, non-reciprocal circuit devices (Circle Yule, Isolen), LC filters, semiconductor capacitors, glass ceramic multilayer substrates, etc. are manufactured.
  • a circulatory circuit will be specifically described.
  • Preferred circuit arrangements to which the present invention is applied are those exemplified in US 08 / 219,917 (USP 5,450,045).
  • This circuit has a magnetic rotor.
  • the magnetic rotor has an inner conductor, has an insulating magnetic body integrally fired so as to surround the inner conductor in close contact with the inner conductor, and furthermore, electrically connects one end of the inner conductor to the inner conductor.
  • It has a plurality of connected terminal electrodes, a plurality of capacitors respectively coupled to the terminal electrodes to resonate with the applied high frequency, and a permanent magnet for excitation for applying a DC magnetic field to the gyromagnetic component. .
  • a permanent magnet for excitation for applying a DC magnetic field to the gyromagnetic component.
  • FIG. 1 is a partially cutaway perspective view schematically showing the configuration of a magnetic rotor of a three-terminal circuit, which is an example of the circuit described above, and FIG. 2 is an exploded view showing the structure of the entire circuit.
  • FIG. 3 is a perspective view, FIG. 3 is an equivalent circuit diagram of the circuit, and FIGS. 4A, 4B, and 4C are diagrams for explaining a part of the manufacturing process of the magnetic rotor of the circuit.
  • the magnetic rotor 20 is formed so that its planar shape is a regular hexagon.
  • the plane shape does not necessarily have to be a regular hexagon. It may be a hexagon other than a polygon, or another polygon.
  • reference numeral 10 denotes an integrally fired magnetic layer, and a predetermined pattern of an inner conductor (center conductor) 11 is formed so as to be surrounded by the magnetic layer 10.
  • the inner conductors 11 are laminated in two layers, and each pair extends in three radiation directions (radiation directions perpendicular to at least one side of the hexagon).
  • a strip-shaped coil pattern is provided for each layer.
  • the strip-shaped coil patterns extending in the same direction on both layers are electrically connected to each other via via-hole conductors.
  • This uses the magnetic layer as an insulator.
  • One end of each coil pattern is electrically connected to a terminal electrode 12 provided on every other side surface of the magnetic layer 10.
  • a ground conductor (ground electrode) 13 is provided on the upper and lower surfaces of the magnetic layer 10 and on each side of the magnetic layer 10 where the terminal electrode 12 is not provided. The other end of each coil pattern is electrically connected to the ground conductor 13 on each side.
  • the three terminal electrodes (12) of the magnetic rotor 20 are electrically connected to the resonance capacitors 21a, 21b, and 21c as shown in Fig. 2. It is connected.
  • These capacities include high-frequency capacities, such as a penetrating type having a high self-resonant frequency as described in Japanese Patent Application Laid-Open No. H5-252512, which has already been proposed and published by the present applicant. It is preferable to use high-frequency capacity.
  • this high-frequency capacity at least one unit of a multilayer body consisting of a ground conductor, a dielectric, an inner conductor, and a dielectric is stacked in this order, and then a ground conductor and a dielectric are stacked in this order. It has a multi-layered triplate and stripline structure.
  • Permanent magnets 22 and 23 for applying a DC magnetic field 14 (see Fig. 1) to the magnetic rotor 20 are mounted above and below the magnetic rotor 20. Have been.
  • an upper sheet 40, an intermediate sheet 41, and a lower sheet 42 made of the same insulating magnetic material are prepared.
  • the thickness of the upper sheet 40 and the lower sheet 42 is about 0.5 to 2 mm, and the thickness is about 100 to 200 m (preferably 160 / i Di). Are laminated and used.
  • the thickness of the intermediate sheet 41 is about 30 to 200 m, and preferably about 160.
  • via holes 43a, 43b and 43c penetrating this sheet are formed.
  • a via hole conductor slightly larger than its diameter is formed by printing or transfer.
  • the same conductive material as that used for the inner conductor may be used, but a material having a higher melting point may be used.
  • each set consists of two strip-shaped patterns that extend in the same radial direction (radial direction perpendicular to at least one side of the hexagon) while avoiding the via hole portion.
  • the upper inner conductors 44a, 44b and 44c and the lower inner conductors 45a, 45b and 45c with three sets of coil patterns are formed by printing or transferring the inner conductor paste, respectively. You. After the upper sheet 40, the intermediate sheet 41, and the lower sheet 42 thus formed are sequentially stacked, they are stacked in a heating and pressurizing step.
  • the three-fold symmetric coil patterns are arranged on both the front and back surfaces of the intermediate sheet 41, and the symmetry makes the propagation characteristics between the terminals of the three-terminal circular circuit coincide with each other.
  • the upper sheet 40, the intermediate sheet 41, and the lower sheet 42 stacked as shown in FIG. 4B are fired at a temperature equal to or higher than the melting point of the conductive material and lower than the boiling point.
  • the firing may be performed once or multiple times. In the case of multiple firings, at least one firing should be performed at the melting point or higher. By this firing, the magnetic materials constituting the upper sheet 40, the intermediate sheet 41, and the lower sheet 42 become continuous and integrated.
  • the upper sheet 40, the intermediate sheet 41, and the lower sheet 42 have already been described as having a regular hexagonal shape, but in the present invention, at a temperature higher than the melting point of the conductive material.
  • cut after firing to prevent the conductive material from flowing out due to melting.
  • one end of the upper inner conductors 44a, 44b, 44c and one end of the lower inner conductors 45a, 45b, 45c are connected to the via holes 43a, 43b, They will be electrically connected via via conductors in 4 3 c, respectively.
  • each magnetic rotor After firing and cutting, each magnetic rotor is barrel polished to expose the inner conductor that appears on the side, and the corners of the sintered body are chamfered. Thereafter, as shown in FIG. It is formed by baking. As a result, the other ends of the upper inner conductors 44a, 44b and 44c exposed on the side of the magnetic rotor are electrically connected to the respective terminal electrodes (46). The other ends of the inner conductors 45a, 45b and 45c exposed on the side surfaces of the magnetic rotor are electrically connected to the ground conductors (47) on the respective side surfaces. Then, as shown in FIG.
  • the resonance capacitors 21a, 21b, 21c are assembled to the respective terminal electrodes (46) of the magnetic rotor, and soldered by a reflow method or the like. Thereafter, the permanent magnet for excitation for applying a DC magnetic field and the metal housing which also serves as the magnetic yoke are assembled to complete the circuit.
  • the above configuration example relates to a three-terminal circuit arrangement.
  • the present invention is also applicable to a circuit having more terminals than the above.
  • a distributed-constant-type circuit that integrates a gyromagnetic element and a capacitance circuit and incorporates an impedance converter in the terminal circuit to extend the operating frequency range. Applicable overnight. Further, by developing such a circulating device, a non-reciprocal circuit device such as an isolating device can be easily manufactured.
  • Yttrium oxide (Y 2 ⁇ 3) and iron oxide (F e 2 0 3) in a molar ratio of 3 were mixed at a ratio of 5.
  • the mixed powder was calcined at 1200 ° C.
  • the obtained calcined powder was pulverized with a pole mill.
  • An organic binder and a solvent were added, and silver powder was added in an amount of 0.2 to 5 wt% as shown in Table 1 to prepare a magnetic slurry.
  • the obtained slurry was formed into a green sheet by a doctor-blade method. Holes for via holes were formed in the green sheet using a punching machine, and then a silver conductor pattern was printed on the green sheet by a thick film printing method.
  • the width of the silver conductor was set to one half of that in International Publication WO985045 (the same applies hereinafter). At this time, via holes were also filled at the same time.
  • the printing paste was used and the paste obtained by dispersing silver only, a G a 2 ⁇ 3 3 mol% added paste silver.
  • the green sheet was thermocompressed to obtain a laminate. Then, after firing at 144 ° C., it was cut into a shape having a predetermined size.
  • a ground electrode was formed by baking silver paste on the upper and lower surfaces of the fired body. Further, electrodes connecting the terminal electrodes and the upper and lower ground electrodes were formed on the side surface of the fired body by baking silver paste.
  • a magnetic rotor in which the magnetic material and the center conductor were integrated was obtained.
  • Comparative Example 1 the same sample as in the example was used except that silver was not added to the magnetic material.
  • Table 1 shows the yield of non-reciprocal circuit device samples.
  • 108 samples were produced.
  • the internal electrodes of the device were observed with a transmission X-ray measuring device, and the device was determined to be defective based on disconnection of the device and occurrence of defects over 23 or more of the device wiring width.
  • the average grain size was 3.2 to 5.4 mm.
  • Example 2 As the oxide magnetic material, yttrium oxide (Y 2 ⁇ 3) and iron oxide (F e 2 0 3) Aluminum oxide (A l 2 ⁇ 3) in a molar ratio of 6: 9: 1 but using a mixing ratio of the non-reciprocal circuit element in the same manner as in Example 1 (Example 2 - :! ⁇ 2-10, Comparative Example 2) was obtained.
  • Table 2 shows the amount of silver added to the magnetic material and the yield of the nonreciprocal circuit device. High frequency characteristics were measured with a network analyzer.
  • an irreversible circuit device was obtained in the same manner as in Example 1, except that a mixture of 11: 2 3: 2: 8 was used.
  • Table 3 shows the amount of silver added to the magnetic material and the yield of nonreciprocal circuit devices. High frequency characteristics were measured with a network analyzer. Table 3

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  • Soft Magnetic Materials (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Ceramic Capacitors (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne des éléments céramiques stratifiés composés d'une couche conductrice interne et d'une couche céramique, agglomérées simultanément l'une à l'autre par frittage. La couche conductrice interne est formée d'un matériau conducteur comprenant de l'argent comme composant principal et la couche céramique est formée d'un matériau obtenu par adjonction d'argent à un matériau magnétique oxyde à base de grenat d'yttrium-fer. Ces éléments présentent des dimensions plus petites que les élément conventionnels, mais peuvent être produits en grandes quantités.
PCT/JP1998/004208 1997-09-22 1998-09-18 Elements ceramiques stratifies WO1999016089A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP98943039A EP0940825B1 (fr) 1997-09-22 1998-09-18 Elements ceramiques stratifies
DE69834098T DE69834098T2 (de) 1997-09-22 1998-09-18 Laminierte keramische teile
US09/315,156 US6235221B1 (en) 1997-09-22 1999-05-20 Multilayer ceramic part

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9/275175 1997-09-22
JP27517597 1997-09-22
JP9/326909 1997-11-12
JP9326909A JPH11154805A (ja) 1997-09-22 1997-11-12 積層セラミック部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US09/315,156 Continuation US6235221B1 (en) 1997-09-22 1999-05-20 Multilayer ceramic part

Publications (1)

Publication Number Publication Date
WO1999016089A1 true WO1999016089A1 (fr) 1999-04-01

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US (1) US6235221B1 (fr)
EP (1) EP0940825B1 (fr)
JP (1) JPH11154805A (fr)
CN (1) CN1111881C (fr)
DE (1) DE69834098T2 (fr)
WO (1) WO1999016089A1 (fr)

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JP3744739B2 (ja) * 1999-07-30 2006-02-15 京セラ株式会社 積層セラミックコンデンサ
GB2370568B (en) * 1999-12-13 2003-01-22 Murata Manufacturing Co Monolithic ceramic electronic component and production process therefor
JP3767362B2 (ja) 1999-12-13 2006-04-19 株式会社村田製作所 積層型セラミック電子部品の製造方法
JP2001345212A (ja) * 2000-05-31 2001-12-14 Tdk Corp 積層電子部品
JP3939622B2 (ja) * 2002-09-20 2007-07-04 アルプス電気株式会社 非可逆回路素子及びアイソレータ並びに非可逆回路素子の製造方法
JP2007234893A (ja) * 2006-03-01 2007-09-13 Tdk Corp コイル部品
CN103649384B (zh) * 2011-06-06 2017-03-22 天工方案公司 稀土减少的石榴石系统和相关的微波应用
JP6812722B2 (ja) * 2016-09-30 2021-01-13 住友金属鉱山株式会社 積層セラミック電子部品の内部電極膜の評価方法、並びに、積層セラミック電子部品の製造方法

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JPH09102410A (ja) * 1995-10-06 1997-04-15 Matsushita Electric Ind Co Ltd 磁性体材料およびこれを用いた高周波回路部品

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Also Published As

Publication number Publication date
EP0940825A4 (fr) 2001-05-23
DE69834098T2 (de) 2006-11-23
US6235221B1 (en) 2001-05-22
JPH11154805A (ja) 1999-06-08
CN1239579A (zh) 1999-12-22
EP0940825A1 (fr) 1999-09-08
CN1111881C (zh) 2003-06-18
DE69834098D1 (de) 2006-05-18
EP0940825B1 (fr) 2006-04-05

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