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WO1998040754A1 - Structure de montage de parties electriques d'une carte de circuit imprime - Google Patents

Structure de montage de parties electriques d'une carte de circuit imprime Download PDF

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Publication number
WO1998040754A1
WO1998040754A1 PCT/JP1998/001014 JP9801014W WO9840754A1 WO 1998040754 A1 WO1998040754 A1 WO 1998040754A1 JP 9801014 W JP9801014 W JP 9801014W WO 9840754 A1 WO9840754 A1 WO 9840754A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
circuit board
electric component
coil
mounting structure
Prior art date
Application number
PCT/JP1998/001014
Other languages
English (en)
Japanese (ja)
Inventor
Mark Raforet
Michiya Hashizume
Teruaki Kawai
Original Assignee
Nippon Lem Co., Ltd.
Maikurojenikkusu Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Lem Co., Ltd., Maikurojenikkusu Co. Ltd. filed Critical Nippon Lem Co., Ltd.
Priority to JP53944198A priority Critical patent/JP3173614B2/ja
Publication of WO1998040754A1 publication Critical patent/WO1998040754A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Definitions

  • the present invention relates to a mounting structure of an electric component on a circuit board having an independent secondary circuit electrically insulated from an electric component constituting a primary circuit, such as a current sensor, a voltage measurement module, and a current control module. Things.
  • a current sensor described in Japanese Patent Application Laid-Open No. 8-26204 is known. According to the publication, a magnetic field generated in a core by a current flowing through a coil, which is an electric component constituting a primary circuit, is detected by a Hall element of a secondary circuit, and a current flowing through the coil is detected.
  • the leg of the coil and the secondary circuit be as close as possible to reduce the area occupied by the mounting substrate.
  • the legs of the coil of this type of sensor are connected to a high voltage power supply.
  • the secondary circuit is used for measurement and is connected to a low-voltage power supply independent of the primary circuit, the secondary circuit is connected to the primary circuit to ensure insulation between the primary circuit and the secondary circuit. The creepage distance with the next circuit must be sufficient.
  • the present invention relates to an insulation between a primary circuit and a secondary circuit when an electric component on the primary circuit side is connected to a power supply having a large or large potential difference with respect to an independent secondary circuit. To reduce the size of this mounting structure while ensuring sufficient performance o
  • the feature of the mounting structure of the electric component on the circuit board according to the present invention includes a circuit board and an electric component having a leg, and the circuit board has an independent circuit electrically insulated from the electric component.
  • An insulating stand is provided to be fixed away from the substrate, and a slit is formed along the circuit board from an end of the insulating stand facing the independent circuit.
  • the slit is formed from the end of the insulating base facing the independent circuit, the creepage distance between the leg of the electric component fixed on the insulating base and the independent circuit is formed. Is the distance at least along the surface of the slit, that is, the total distance between the back surface of the insulating base and the surface of the circuit board corresponding to the depth of the slit. Therefore, even if the linear distance between the electric component and the independent circuit is short, the creepage distance between them can be sufficiently ensured.
  • the creepage distance is spatially secured even at those ends where the creepage distance is easily reduced. Can be.
  • the present invention is desirably implemented as a configuration in which an element that transmits a signal by magnetism or light is provided between the primary circuit on the electric component side and the secondary circuit that is the independent circuit.
  • the electric component is a coil that applies a high voltage to the leg, and the independent circuit detects a current flowing through the coil via a magnetic field generated by the coil.
  • the electric component may be a high voltage-resistant component such as a shunt resistor, a field effect transistor, a power transistor, a thyristor, or a triac.
  • the mounting structure of the electric component on the circuit board according to the present invention even when the linear distance between the electric component and the independent circuit is short, the creepage distance between them can be sufficiently secured.
  • the electrical components such as coils can be arranged relatively close to each other while maintaining the insulation between the independent circuits, and the entire components related to this mounting structure can be made compact using a small circuit board. As a result, it has become possible to reduce the mounting area when mounting the components according to this mounting structure on the mounting target board.
  • the creepage distance is further increased, and the component according to the present mounting structure can be configured more compactly. At the same time, it was possible to prevent a decrease in creepage distance due to the dripping of the adhesive and the like, and to facilitate simplification of production.
  • the filling of the insulating resin by the above-described vacuum filling or the like can prevent the decrease in the creepage distance due to the deformation of the insulating base without increasing the thickness of the slit or the insulating base. Therefore, even if an external force acts on the legs of an electric component such as a coil, insulation from an independent circuit can be sufficiently secured, and the reliability of the component relating to the present mounting structure can be improved.
  • the slit from the end of the insulating stand in the longitudinal direction of each leg the creepage distance between the leg portion corresponding to the end and the independent circuit can be secured. . As a result, an independent circuit can be brought close to the vicinity of the same end, and it is possible to further reduce the size of the components related to the present mounting structure.
  • FIG. 1 is a front view of the current sensor according to the first embodiment of the present invention.
  • FIG. 2 is a rear view of FIG.
  • FIG. 3 is an enlarged side view of a part of FIG.
  • FIG. 4 is a perspective view of the insulating base as viewed from the back side.
  • FIG. 5 is a circuit diagram according to the current sensor of FIG.
  • FIG. 6 is a front view of a current sensor according to the second embodiment of the present invention.
  • FIG. 7 is a side view showing a part of FIG.
  • FIG. 8 is a diagram corresponding to FIG. 7, showing a third embodiment of the present invention.
  • FIG. 9 is a front view showing a current measurement module according to a fourth embodiment of the present invention.
  • ⁇ FIG. 10 is a front view of a current control module according to a fifth embodiment of the present invention.
  • 11A is a circuit diagram of the current measurement module according to FIG. 9, and
  • FIG. 11B is a circuit diagram of the current control module of FIG. 10.
  • This current sensor 1 generally includes a ceramic substrate 2 having a conductive pattern 3a, an electronic component 4 mounted on the conductive pattern 3a, a secondary terminal 5, a coil 6 and a core 7 constituting a primary circuit X. Insulation
  • the table 8 is provided.
  • the pair of legs 6 b and 6 b of the coil 6 are connected to a commercial or industrial power supply of about 100 to 300 V, and the magnetic field H Is generated.
  • the Hall element 4 a of the electronic component 4 arranged between the gap 7 a of the core 7 generates a voltage corresponding to the magnetic field H, and corrects the terminal voltage due to the magnetic field H by the first operation 4 b.
  • the voltage is amplified by the second operational amplifier 4c, and is output as a voltage to one of the secondary terminals 5 UT as an index indicating the input current Ii flowing through the primary circuit X.
  • the primary circuit X composed of the coil 6 and the secondary circuit Y composed of the components 4a to 4c are electrically insulated from each other.
  • the other three secondary terminals 5 are for connecting to a low-voltage power supply consisting of +15 V, 115 V, and GND. Therefore, the primary circuit X is connected to a power supply having a large potential difference with respect to the secondary circuit Y.
  • a plurality of electronic components 4 and secondary terminals 5 are connected to a conductive pattern 3 a which is partially omitted on the ceramic substrate 2.
  • the ground pattern 3b of the conductive pattern 3a is provided between the Hall element 4a and the winding portion 6a of the coil 6 to prevent noise in the secondary circuit Y.
  • An insulating tube 7b and a coil winding 6a are inserted into the core 7 through a gap 7a.
  • the core 7 is formed by stacking a number of thin plates, pressing the fixing pins 7 d and 7 d into the notches 7 c and 7 c at the two right and left places, respectively, and soldering them on the back of the ceramic substrate 2. It is fixed on 2.
  • one of the fixing pins 7d is soldered to the ground pattern 3b, and the core 7 together with the left and right fixing pins 7d forms a part of the secondary circuit Y.
  • a notch 2a for receiving the winding portion 6a is formed in the upper corner of the ceramic substrate 2.
  • an insulating table 8 for attaching and fixing the legs 6b, 6b, which are a part of the coil 6, to the ceramic substrate 2 has a support portion 8a for attachment to the ceramic substrate 2. , Positioning protrusion 8b, a pair of left and right horizontal overhangs 8d and It has a girder overhang 8 f.
  • the insulating table 8 is formed of a hard plastic having an insulating property. Then, the lower surface of the supporting portion 8a is brought into contact with the ceramic substrate 2 and the positioning protrusion 8b is applied to the lower end of the ceramic substrate 2, and an adhesive member (not shown) is poured into the elongated hole 8c, and 8 is fixed to the ceramic substrate 2.
  • the support portion 8a and the left and right lateral overhang portions 8d, 8d make the ceramics from the left and right facing the fixed bins 7d, 7d, which are the secondary circuit Y, at the end of the insulating table 8.
  • Left and right slits S, S parallel to the plane of the substrate 2 are formed.
  • an upper slit S along the plane of the ceramic substrate 2 from the end of the insulating table 8 with respect to the longitudinal direction of the legs 6b, 6b is further formed by the support portion 8a and the overhang portion 8f. .
  • flanges 8e, 8e projecting upward are provided in the longitudinal direction of the legs 6b, 6b. It is provided along.
  • Each leg 6b is fixed by an adhesive 9 in a posture along the supporting portion 8a.
  • the creepage distance between the leg 6b (the secondary circuit X) and the fixing pin 7d (the secondary circuit Y) on each of the right and left sides is such that the provision of the flange 8e and the slit S allows the leg 6b on the ceramic substrate 2 Is increased as compared with the case where a
  • the creepage distance refers to a distance between two conductive portions arranged on the insulator along the surface of the insulator.
  • the first creepage distance between the leg 6b and the fixing pin 7d is the sum of the surface of the laterally extending portion 8d, the height of the elongated hole 8c and the surface of the ceramic substrate 2, and the second creepage distance Is the sum of the upper surface, the side surface of the flange portion 8e, the back surface of the laterally extending portion 8d, the height of the support portion 8a, and the surface of the ceramic substrate 2.
  • the shortest creepage distance between the leg 6b and the fixed bin 7d is the first creepage distance.
  • the second creepage distance can be set to the shortest creepage distance.
  • a slit S is formed at the upper end of the insulating base 8 by the overhang 8f, so that the top surface of the insulating base 8 of the leg 6b and the ground pattern 3b near the hall element 4a are formed.
  • the distance has also been increased.
  • Flange 8 e drops from adhesive 9 Therefore, it is possible to prevent the creepage distance from being shortened.
  • the legs 6b, 6b are connected to a high-voltage power supply, they must be separated from each other. Therefore, by providing the legs 6 b, 6 b in parallel and near both ends of the insulating stand 8, a sufficient creepage distance from the left and right fixing pins 7 d, 7 d can be secured, and the legs 6 b, 6 d can be secured. The insulation between 6b is also sufficiently ensured.
  • the entirety of the current sensor 1 is covered with a resin mold M.
  • the resin of the resin mold M is made of polyurethane resin, epoxy resin or the like having high insulation properties. Then, by dipping the current sensor 1 in the resin and performing vacuum filling or vacuum degassing, the resin is sufficiently filled to the depth of the slit S, and a decrease in creepage distance due to insufficient filling is prevented. The short-circuit between the overhang portions 8 d and 8 f and the ceramic substrate 2 also prevents a decrease in creepage distance.
  • the configurations of the ceramic substrate 12, the coil 16 and the core 17 are different from those of the first embodiment.
  • the core 17 is inserted into the notch 12a of the ceramic substrate 12, and the Hall element 4a is located between the gap 17a together with the ceramic substrate 12.
  • the insulating table 8 of this example is provided with an adhesive poured into the closed recess 8 c ′ on the upper surface. Then, it is fixed on the ceramic substrate 12. Thereby, the second creepage distance becomes the shortest creepage distance, and the creepage distance can be increased by the flange (e).
  • the coil 16 is arranged such that the center of the winding in the winding portion 16 a is orthogonal to the plane of the ceramic substrate 12, and the legs 16 b and 16 b of the coil 16 are Placed on the 'fixed.
  • the core 17 is connected to the ground pattern 3b and belongs to the secondary circuit Y. Therefore, the coil 16 is a secondary circuit Y having the right side in FIG. 7 of the horizontal overhang 8 d and the slit S formed by the upper overhang 8 f and the support 8 a shown in FIG. 6. It is only necessary to increase the creepage distance from the core 17 and ground 3 In this example, there is no secondary circuit Y near the left leg 16b. Therefore, in such a case, as in the third embodiment shown in FIG.
  • a supporting portion 8a is provided at a position on the left side of the insulating table 8 in the same figure, and the laterally extending portion 8d1 is provided rather than the laterally extending portion 8d2.
  • the slit S on the right side can be increased.
  • the present mounting structure is configured as a current measuring module 21 for measuring the current of the primary circuit X.
  • the primary circuit of this current measurement module 21 is connected to a high-voltage power supply for the secondary circuit Y, and is connected to a shunt resistor 26 connected between a pair of measurement lead terminals 26 b and 26 b.
  • the input current I i flowing is measured by the secondary circuit Y.
  • the lower side fixed lead terminal 26b in the primary circuit X is connected to GND
  • the center measurement lead terminal 26b is connected to the input current Ii
  • the uppermost power supply lead terminal 26c is connected to Each is connected to a power supply for driving the primary circuit X.
  • the voltage generated at both ends of the shunt resistor 26 is compared with the resistance divided voltage of the reference voltage generated at both ends of the Zener diode 25a. Since the resistance value of the shunt resistor 26 is known, the input current Ii can be obtained by knowing this voltage. The result of this comparison is amplified by the first operational amplifier 25 b and the transistor 25 c and input to the primary side of the transformer 24.
  • the voltage generated on the secondary side of the transformer 24 is the diode 2
  • the output voltage Vo is rectified by 5 d, amplified by the second operational amplifier 25 e, and output to the secondary terminal 5 at the center terminal as a value representative of the input current I i.
  • the other terminal of the secondary terminal 5 is connected to GND and a power supply for driving the second operational amplifier 25e.
  • the support portions 8a are deviated upward.
  • the overhangs that form the slit S together with the support 8a include left and right overhangs 8d, 8d and a lower overhang 8g.
  • the lower protrusion 8g increases the creeping distance between the lower end of the insulating base 28 along the longitudinal direction of the measurement lead terminal 26b and the secondary circuit Y.
  • the input voltage Vi of the secondary circuit Y causes the current I o between the drain and source of the field effect transistor 36 which is the primary circuit X.
  • the present invention is configured as a current control module 31 for controlling the current. As shown in FIG.
  • the power lead terminal 36c is connected to a commercial power supply of about 100V.
  • the secondary terminal 5 is connected to a low-voltage power supply of several volts to several tens of volts for driving the photo power blur 34, the control circuit 35a, and the transistor 35b, and the low-voltage input voltage Vi. .
  • An input from the input voltage Vi causes the light emitting diode of the photo power bracket 34 to emit light via the control circuit 35a and the transistor 35b.
  • the light of the light-emitting diode is received by the phototransistor of the photopower brush 34, and the gate voltage of the field-effect transistor 36 is adjusted via the transistor group 35c to control the current Io between the legs 36b, 36b.
  • the insulating stand 38 is configured in substantially the same manner as the insulating stand 28, but without the flange 8e on the right side.
  • the power lead terminal 36 c is made of an adhesive 9 Are fixed in the same way as the power lead terminals 26c.
  • the legs 36 b and 36 b are indirectly fixed to the insulating table 38 by bonding the ⁇ field effect transistor 36 on the insulating table 38 at the back surface.
  • the gate terminal 36 d of the field effect transistor 36 is connected to the primary circuit X.
  • the primary circuit X and the secondary circuit Y of the electric component are electrically insulated from each other, and a signal is transmitted between the primary circuit X and the secondary circuit Y by magnetic or light.
  • a Hall element 4a, a transformer 24, or a photo-power bra 34 having a light emitting diode was used.
  • these elements may be of other types, for example, a photocoupler or an isolation amplifier using a light bulb and CdS may be used.
  • the coil 6, the shunt resistor 26, and the field-effect transistor 36 are used as the high-voltage components.
  • a power transistor, a thyristor, a triac, or the like may be used instead. Absent. Note that it is sufficient that the potential difference between the primary circuit X and the secondary circuit Y is large, and the terminal voltage applied to the electrical component from GND in the primary circuit X does not necessarily need to be high.
  • the potential difference between the primary circuit X and the secondary circuit is not only large from the beginning, but usually small, the power supply including the primary circuit is short-circuited or damaged, and the power supply from the motor is reversed.
  • the present invention is also useful in cases where the size can be increased only when the edge is applied.
  • the first embodiment can be applied to a case where the voltage applied to the coil 6 is normally low and becomes high when a problem occurs.
  • slit S is provided from the end of the insulating base 8, but a plurality of horizontal overhangs 8 d and overhangs 8 f or underhangs 8 g are provided on the surface of the ceramic substrate 2.
  • a plurality of these slits may be formed by overlapping in the height direction perpendicular to the slits. Further, a plurality of slits may be formed at the end of the flange 8e along the leg 6b.
  • “Leg I is an example using the coil 6 according to the first embodiment
  • the electric component itself is not limited to the “leg” of the electric component itself, such as the example using the field effect transistor 36 according to the embodiment.
  • the “leg” of the present invention includes a “measurement lead terminal 26 b” for the shunt resistor 26 in the fourth embodiment and a “leg” for the other parts of the primary circuit X in the fourth and fifth embodiments.
  • Power supply lead terminals 26c and 36c are also included.
  • the mounting structure according to the present invention can be used, for example, for a current sensor, a current measurement module, or a current control module using a coil, a shunt resistor, or a field-effect transistor as a component on the primary circuit side.
  • the present invention is not limited to this and may be applied to a configuration using a power transistor, a thyristor, a triac, or the like as a component on the primary circuit side.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)

Abstract

La présente invention concerne une structure de montage dont on peut réduire la taille par fixation de l'isolation entre un premier circuit et un second circuit indépendants lorsque les parties électriques du premier circuit sont connectées à une source d'alimentation ayant une grande différence de potentiel par rapport au second circuit ou sont capables d'augmenter la différence de potentiel. Dans la structure de montage constituée sous la forme d'un détecteur de courant, une carte (2) de circuit imprimé présente un second circuit Y électriquement isolé d'une bobine (6), ladite bobine (6) étant connectée à une source d'alimentation à tension élevée par rapport au second circuit Y. On produit une base d'isolation (8) qui fixe des parties de branche (6b) de la bobine, attachée à la base (8) séparément de la carte de circuit imprimé et on forme une fente S le long de la carte (2) de circuit imprimé depuis la partie terminale de la base (8) tournée vers le circuit Y de façon à augmenter la distance de fuite la plus courte entre les premier et second circuits. On peut également appliquer ladite structure de montage à une construction qui utilise une résistance en parallèle, un transistor à effet de champ, un transistor d'alimentation, un thyristor, un triac, etc., comme parties électriques du côté du premier circuit.
PCT/JP1998/001014 1997-03-12 1998-03-11 Structure de montage de parties electriques d'une carte de circuit imprime WO1998040754A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53944198A JP3173614B2 (ja) 1997-03-12 1998-03-11 回路基板に対する電気部品の実装構造

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7899397 1997-03-12
JP9/78993 1997-03-12

Publications (1)

Publication Number Publication Date
WO1998040754A1 true WO1998040754A1 (fr) 1998-09-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1998/001014 WO1998040754A1 (fr) 1997-03-12 1998-03-11 Structure de montage de parties electriques d'une carte de circuit imprime

Country Status (2)

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JP (1) JP3173614B2 (fr)
WO (1) WO1998040754A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107990177A (zh) * 2017-12-16 2018-05-04 中山市富大照明科技有限公司 一种柔性led灯带

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1298444C (zh) * 2005-05-12 2007-02-07 张挺胜 带冷却装置的热态工作辊
KR200461525Y1 (ko) 2010-09-28 2012-07-23 한상우 드라이버가 일체화된 송풍모터 제어용 파워트랜지스터 모듈 장치
KR101823097B1 (ko) 2016-09-26 2018-01-30 럭키금속 주식회사 가스 그리들
CN110794218B (zh) * 2019-10-08 2021-06-04 上海交通大学 无绝缘线圈匝间电阻测试装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07134146A (ja) * 1993-11-12 1995-05-23 Tokin Corp 電流センサ
JPH08160079A (ja) * 1994-12-09 1996-06-21 Fuji Elelctrochem Co Ltd 電流検出器
JPH08194015A (ja) * 1995-01-13 1996-07-30 Tokin Corp 電流検出器
JPH08327668A (ja) * 1995-06-05 1996-12-13 Toshiba Meter Techno Kk 電気量測定器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07134146A (ja) * 1993-11-12 1995-05-23 Tokin Corp 電流センサ
JPH08160079A (ja) * 1994-12-09 1996-06-21 Fuji Elelctrochem Co Ltd 電流検出器
JPH08194015A (ja) * 1995-01-13 1996-07-30 Tokin Corp 電流検出器
JPH08327668A (ja) * 1995-06-05 1996-12-13 Toshiba Meter Techno Kk 電気量測定器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107990177A (zh) * 2017-12-16 2018-05-04 中山市富大照明科技有限公司 一种柔性led灯带
CN108087745A (zh) * 2017-12-16 2018-05-29 中山市富大照明科技有限公司 一种柔性led线路板组件

Also Published As

Publication number Publication date
JP3173614B2 (ja) 2001-06-04

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