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WO1998034442B1 - Printed circuit assembly with flexible support - Google Patents

Printed circuit assembly with flexible support

Info

Publication number
WO1998034442B1
WO1998034442B1 PCT/US1998/001732 US9801732W WO9834442B1 WO 1998034442 B1 WO1998034442 B1 WO 1998034442B1 US 9801732 W US9801732 W US 9801732W WO 9834442 B1 WO9834442 B1 WO 9834442B1
Authority
WO
WIPO (PCT)
Prior art keywords
assembly
support substrate
conductive layer
tracks
line
Prior art date
Application number
PCT/US1998/001732
Other languages
French (fr)
Other versions
WO1998034442A1 (en
Filing date
Publication date
Priority claimed from ES009700225A external-priority patent/ES2127125B1/en
Application filed filed Critical
Priority to JP53306698A priority Critical patent/JP2001527698A/en
Priority to CA002279949A priority patent/CA2279949A1/en
Publication of WO1998034442A1 publication Critical patent/WO1998034442A1/en
Publication of WO1998034442B1 publication Critical patent/WO1998034442B1/en

Links

Abstract

A printed circuit (10) includes a flexible support (11) on which is adhered a coat of conductive material (12), formed by tracks (13). An adhesive (14) maintains the conductive material in place. The adhesive is able to withstand high temperatures and has to withstand strains due to folding the circuit assembly. In certain embodiments torsion is also a concern since the conductive coat (12) that is folded may be up to 800 microns thick, which could otherwise cause delamination, i.e., the separation of the conductive layer (12) and the substrate (11) due to lack of adherence between both layers.

Claims

6AMENDED CLAIMS[received by the International Bureau on 31 July 1998 (31.07.98); original claims 1-6 replaced by amended claims 1-7 (2 pages)]
1. A printed circuit assembly (10) comprising: a support substrate (11) made from a flexible dielectric material; a conductive layer (12) supported on said support substrate, said conductive layer including a plurality of tracks (13) defining the operation of the circuit; and an adhesive (14) disposed between said support substrate and said conductive layer and maintaining said conductive layer in place on said support substrate; and characterized by said tracks being positioned on said support substrate such that portions (16) of said substrate are not covered by said tracks and wherein said assembly is folded along a line (15) coincident with one of said portions.
2. The assembly of claim 1, wherein said support substrate (11) includes two edges (17) and further characterized by said tracks (13) having a general pattern of being aligned generally perpendicular to said edges (17) and generally parallel to said line (15).
3. The assembly of claim 2, further characterized by said portions (16) including at least one portion on either side of said line (15) providing a void zone that renders said circuit assembly more easily folded along said line (15) by hand.
4. The assembly of claim 1 , wherein said support substrate (11) comprises a polyester material. 7
5. The assembly of claim 1, wherein said support substrate (11) comprises a polyamide material.
6. The assembly of claim 1, wherein said conductive layer (12) has a thickness in a range from about 35 microns to about 800 microns.
7. The assembly of claim 1, wherein said conductive layer (12) has a thickness that is approximately 800 microns.
PCT/US1998/001732 1997-02-05 1998-01-29 Printed circuit assembly with flexible support WO1998034442A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP53306698A JP2001527698A (en) 1997-02-05 1998-01-29 Printed circuit assembly with flexible support
CA002279949A CA2279949A1 (en) 1997-02-05 1998-01-29 Printed circuit assembly with flexible support

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ES009700225A ES2127125B1 (en) 1997-02-05 1997-02-05 SOME IMPROVEMENTS INTRODUCED IN THE MANUFACTURE OF PRINTED CIRCUITS.
ESP9700225 1997-02-05

Publications (2)

Publication Number Publication Date
WO1998034442A1 WO1998034442A1 (en) 1998-08-06
WO1998034442B1 true WO1998034442B1 (en) 1998-09-17

Family

ID=8298111

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/001732 WO1998034442A1 (en) 1997-02-05 1998-01-29 Printed circuit assembly with flexible support

Country Status (6)

Country Link
US (1) US6353188B1 (en)
EP (1) EP0858250A1 (en)
JP (1) JP2001527698A (en)
CA (1) CA2279949A1 (en)
ES (1) ES2127125B1 (en)
WO (1) WO1998034442A1 (en)

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ES2187285B1 (en) * 2001-08-24 2004-08-16 Lear Automotive (Eeds) Spain, S.L. MULTIFRESADO PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS AND PRINTED CIRCUIT SO OBTAINED.
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US7465678B2 (en) * 2003-03-28 2008-12-16 The Trustees Of Princeton University Deformable organic devices
US20070209830A1 (en) * 2006-03-13 2007-09-13 Walton Advanced Engineering, Inc. Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
TW201039200A (en) * 2009-04-23 2010-11-01 Waltop Int Corp Soft digital tablet
JP2011018873A (en) * 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc Electromagnetic shielding method and electromagnetic shielding film
WO2011008459A2 (en) * 2009-06-29 2011-01-20 Infinite Corridor Technology, Llc Structured material substrates for flexible, stretchable electronics
US9862594B2 (en) 2013-03-15 2018-01-09 Versana Micro Inc. Wearable device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
US9778772B2 (en) 2015-09-16 2017-10-03 Microsoft Technology Licensing, Llc Bendable device with display in movable connection with body

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US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3168617A (en) * 1962-08-27 1965-02-02 Tape Cable Electronics Inc Electric cables and method of making the same
EP0048220B1 (en) * 1980-09-15 1986-10-22 Ciba-Geigy Ag Use of flexible materials in printed circuits
JPS594096A (en) * 1982-06-30 1984-01-10 日本メクトロン株式会社 Method of connecting different type circuit boards to each other
JPH046218Y2 (en) * 1985-02-01 1992-02-20
DE3684307D1 (en) * 1985-10-31 1992-04-16 Mitsui Toatsu Chemicals FLEXIBLE LAMINATE FOR BOARD FOR PRINTED CIRCUITS AND METHOD FOR THE PRODUCTION THEREOF.
US4945029A (en) * 1988-05-06 1990-07-31 Rogers Corporation Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
US5084124A (en) * 1989-04-28 1992-01-28 Nikkan Industries Co., Ltd. Flexible printed circuit board and coverlay film and method of manufacturing same
JPH069165U (en) * 1992-07-08 1994-02-04 旭光学工業株式会社 Flexible printed circuit board
US5257718A (en) * 1993-03-26 1993-11-02 Chiu Ming T Method of bending and soldering corners of a folding printed-circuit board
US5375321A (en) * 1993-03-30 1994-12-27 United States Department Of Energy Method for fabricating fan-fold shielded electrical leads
JPH08125342A (en) * 1994-10-21 1996-05-17 Nec Corp Flexible multilayered wiring board and its manufacture
JP3435245B2 (en) * 1995-02-21 2003-08-11 ペンタックス株式会社 Flexible printed wiring board
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US5903440A (en) * 1998-01-30 1999-05-11 Delco Electronics Corporaiton Method of forming assemblies of circuit boards in different planes

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