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WO1997012714A3 - Device for the selective, contactless soldering and unsoldering of components - Google Patents

Device for the selective, contactless soldering and unsoldering of components Download PDF

Info

Publication number
WO1997012714A3
WO1997012714A3 PCT/DE1996/001820 DE9601820W WO9712714A3 WO 1997012714 A3 WO1997012714 A3 WO 1997012714A3 DE 9601820 W DE9601820 W DE 9601820W WO 9712714 A3 WO9712714 A3 WO 9712714A3
Authority
WO
WIPO (PCT)
Prior art keywords
infrared radiator
soldering
halogen infrared
components
quartz glass
Prior art date
Application number
PCT/DE1996/001820
Other languages
German (de)
French (fr)
Other versions
WO1997012714A2 (en
Inventor
Ulrich Gerloff
Original Assignee
Hahn Meitner Kernforsch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hahn Meitner Kernforsch filed Critical Hahn Meitner Kernforsch
Priority to EP96945466A priority Critical patent/EP0958089A2/en
Publication of WO1997012714A2 publication Critical patent/WO1997012714A2/en
Publication of WO1997012714A3 publication Critical patent/WO1997012714A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A device for the selective, contactless soldering or unsoldering of selected components has a soldering and precision positioning head for further processing, mounting or repairing boards with a high packing density of electronic components. The soldering and precision positioning head has as heating unit a halogen infrared radiator (HS) in a support (SH) for transmitting energy from the halogen infrared radiator (HS) to the component (BE) to be soldered or unsoldered, as well as a quartz glass capillary tube (QK) united with means for depositing and lifting a selected component. The top face of the quartz glass capillary tube (QK) is arranged in the focal point of the halogen infrared radiator (HS), inside a closed chamber (K) provided with a vacuum connection (VA). The top surface of the closed chamber (K) is a quartz glass pane (QS) arranged away from the focal point of the halogen infrared radiator (HS). The halogen infrared radiator (HS) is driven by a thermoelement (TE) connected to a temperature regulator (RT). This device may be used for processing very diverse components and is suitable as hand tool, in particular for servicing and repairing. It may be built as a compact arrangement into already known equipment with little mechanical outlay.
PCT/DE1996/001820 1995-09-18 1996-09-18 Device for the selective, contactless soldering and unsoldering of components WO1997012714A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP96945466A EP0958089A2 (en) 1995-09-18 1996-09-18 Device for the selective, contactless soldering and unsoldering of components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19535858 1995-09-18
DE19535858.9 1995-09-18

Publications (2)

Publication Number Publication Date
WO1997012714A2 WO1997012714A2 (en) 1997-04-10
WO1997012714A3 true WO1997012714A3 (en) 1997-05-15

Family

ID=7773269

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001820 WO1997012714A2 (en) 1995-09-18 1996-09-18 Device for the selective, contactless soldering and unsoldering of components

Country Status (3)

Country Link
EP (1) EP0958089A2 (en)
DE (1) DE19639993C2 (en)
WO (1) WO1997012714A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998057774A1 (en) * 1997-06-13 1998-12-23 Pac Tech - Packaging Technologies Gmbh Method and device for repairing defective soldered joints
DE19832887A1 (en) * 1998-07-22 2000-01-27 Innotronic Vertriebs Gmbh Setting parameter values for a soldering station, with the target soldering temperature set by entering of a code via a code reader directly connected to the temperature control unit of the soldering tool
DE19901623B4 (en) 1999-01-18 2007-08-23 Pac Tech-Packaging Technologies Gmbh Method and device for thermal connection of pads of two substrates
DE19913813C2 (en) * 1999-03-26 2003-04-10 Atn Automatisierungstechnik Ni Device for the contactless, localized heating of material by means of radiation
US6268991B1 (en) * 1999-06-25 2001-07-31 General Electric Company Method and arrangement for customizing electronic circuit interrupters
DE10146652A1 (en) * 2001-09-21 2003-04-10 Ikarus Solar Ag Connecting two metal parts used in the production of solar collectors comprises directly or indirectly liquefying a solder using an IR radiation source, and connecting the parts at a solder site
DE102005017839A1 (en) * 2005-04-18 2006-10-19 Martin Gmbh Under heater operating method for heating printed circuit boards, involves heating heater to target temperature for board, measuring temperature profile, and storing profile in memory of calculation unit for profile characteristics value
DE202008017450U1 (en) * 2008-01-29 2009-12-17 Few Fahrzeugelektrik Werk Gmbh & Co. Kg film connection
US10160053B1 (en) 2017-09-23 2018-12-25 John Jerome Kusnierek Cold gas blast jet for micro-electronic solder repair
US11996384B2 (en) * 2020-12-15 2024-05-28 Pulseforge, Inc. Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3742181A (en) * 1971-02-25 1973-06-26 Argus Eng Co Method and apparatus for heatbonding in a local area using combined heating techniques
EP0521178A1 (en) * 1991-07-02 1993-01-07 Matsushita Electric Industrial Co., Ltd. Light beam heater

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522407A (en) * 1968-03-05 1970-08-04 Argus Eng Co Heating method
DE2735231A1 (en) * 1977-08-04 1979-02-15 Siemens Ag Laser beam soldering of electronic components - which are preheated to reduce laser energy required in multiple soldering operations
JPS61140368A (en) * 1984-12-14 1986-06-27 Japan Ranpu Kk Non-contact type soldering device
EP0309665B1 (en) * 1987-08-31 1993-06-09 Siemens Aktiengesellschaft Soldering head for soldering and unsoldering components using hot gas, particularly for surface-mounted components (smd)
DD286314A5 (en) * 1988-04-07 1991-01-24 Kombnat Veb Eaw Berlin-Treptow,Zft,De DEVICE FOR LOOSING WITH INFRARED RADIATORS
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
US5060288A (en) * 1990-08-27 1991-10-22 Sierra Research And Technology, Inc. Infrared heater array for IC soldering
DE9113986U1 (en) * 1991-11-11 1992-04-16 Zevac Auslötsysteme GmbH, 3548 Arolsen Soldering device for soldering and desoldering electrical components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3742181A (en) * 1971-02-25 1973-06-26 Argus Eng Co Method and apparatus for heatbonding in a local area using combined heating techniques
EP0521178A1 (en) * 1991-07-02 1993-01-07 Matsushita Electric Industrial Co., Ltd. Light beam heater

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Sensor-based laser scanner links solder joint integrity to production line performance", DESIGN ENGINEERING, June 1987 (1987-06-01), LONDON ( GB ), pages 25, XP002028832 *

Also Published As

Publication number Publication date
DE19639993A1 (en) 1997-03-20
DE19639993C2 (en) 2000-10-05
WO1997012714A2 (en) 1997-04-10
EP0958089A2 (en) 1999-11-24

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