WO1995011788A1 - Process for the manufacture of polyamide resin composition - Google Patents
Process for the manufacture of polyamide resin composition Download PDFInfo
- Publication number
- WO1995011788A1 WO1995011788A1 PCT/US1993/010454 US9310454W WO9511788A1 WO 1995011788 A1 WO1995011788 A1 WO 1995011788A1 US 9310454 W US9310454 W US 9310454W WO 9511788 A1 WO9511788 A1 WO 9511788A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyamide
- heat stabilizer
- masterbatch
- pellets
- dilution
- Prior art date
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 230000008569 process Effects 0.000 title claims abstract description 9
- 239000011342 resin composition Substances 0.000 title description 3
- 229920002647 polyamide Polymers 0.000 claims abstract description 63
- 239000004952 Polyamide Substances 0.000 claims abstract description 61
- 239000000203 mixture Substances 0.000 claims abstract description 47
- 239000012760 heat stabilizer Substances 0.000 claims abstract description 43
- 239000004594 Masterbatch (MB) Substances 0.000 claims abstract description 34
- 239000012895 dilution Substances 0.000 claims abstract description 29
- 238000010790 dilution Methods 0.000 claims abstract description 29
- 239000008188 pellet Substances 0.000 claims abstract description 28
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims description 14
- 238000013329 compounding Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000005453 pelletization Methods 0.000 claims description 2
- 230000006641 stabilisation Effects 0.000 claims description 2
- 238000011105 stabilization Methods 0.000 claims description 2
- 238000007865 diluting Methods 0.000 abstract 1
- 238000002845 discoloration Methods 0.000 abstract 1
- 238000004383 yellowing Methods 0.000 description 14
- 229920002302 Nylon 6,6 Polymers 0.000 description 12
- 239000000654 additive Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000003086 colorant Substances 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 238000007792 addition Methods 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- -1 amine salts Chemical class 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000005749 Copper compound Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 150000001880 copper compounds Chemical class 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004610 Internal Lubricant Substances 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000012963 UV stabilizer Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011369 resultant mixture Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- FUSNPOOETKRESL-ZPHPHTNESA-N (z)-n-octadecyldocos-13-enamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCC\C=C/CCCCCCCC FUSNPOOETKRESL-ZPHPHTNESA-N 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- KRPRVQWGKLEFKN-UHFFFAOYSA-N 3-(3-aminopropoxy)propan-1-amine Chemical compound NCCCOCCCN KRPRVQWGKLEFKN-UHFFFAOYSA-N 0.000 description 1
- PPKRHKAXRRVXBQ-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine;dodecanamide Chemical compound CCCCCCCCCCCC(N)=O.C1CC(N)CCC1CC1CCC(N)CC1 PPKRHKAXRRVXBQ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229940083916 aluminum distearate Drugs 0.000 description 1
- RDIVANOKKPKCTO-UHFFFAOYSA-K aluminum;octadecanoate;hydroxide Chemical compound [OH-].[Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O RDIVANOKKPKCTO-UHFFFAOYSA-K 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Chemical class 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 150000003842 bromide salts Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- ZHDTXTDHBRADLM-UHFFFAOYSA-N hydron;2,3,4,5-tetrahydropyridin-6-amine;chloride Chemical compound Cl.NC1=NCCCC1 ZHDTXTDHBRADLM-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- FJXWKBZRTWEWBJ-UHFFFAOYSA-N nonanediamide Chemical compound NC(=O)CCCCCCCC(N)=O FJXWKBZRTWEWBJ-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003873 salicylate salts Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
Definitions
- the present invention relates to a process for manufacturing a polyamide resin composition. Specifically, it relates to a manufacturing process which comprises adding a heat stabilizer to improve the heat stability and the weathering resistance of a polyamide and, at the same time, to suppress any significant change in color of the polyamide. Incorporating an effective copper compound into a polyamide composition for improving the heat resistance and weathering resistance of the polyamide composition is a well-known method for preventing thermal oxidative degradation of said composition. Additives can be added to polyamide compositions at any stage before molding the polyamide composition into molded article.
- one of the methods used to incorporate an additive into a polyamide composition involves dry blending the polyamide with the additive, followed by melt mixing and extruding the dry-blended product into pellets.
- Another known method for compounding an additive into a polyamide composition is to prepare master polyamide pellets, followed by blending these master pellets with dilution polyamide pellets.
- a copper-type heat stabilizer may be incorporated into a polyamide composition by adding the heat stabilizer to a polyamide containing no heat stabilizer via an extruder or by adding the heat stabilizer to the polyamide during its polymerization.
- a comparison of the two methods shows that the latter provides a product with better color compared to the former so that heat stabilizers are, in general, added to polyamides during the polymerization thereof.
- yellowing it is meant the extent of yellowing experienced by a molded polyamide article, said yellowing being expressed by the value YI-C.
- the YI-C is measured on a sample of pellets or plates with an area of at least 5 cm x 5 cm. Pellets in a glass cup are used for measurement. The measurement is possible with an area less than this range, but precision drops. The measurement is made by a differential color meter.
- the relationship between YI-C and color in terms of the absolute coordinates (X, Y, Z coordinates) is given for the following formula:
- a pigment or coloring agent is normally added for coloring the molded article.
- coloring the molded article to the desired color will require greater amounts of pigments or coloring agents. If a colored resin as obtained is to be colored in a different color, an inorganic pigment, such as titanium oxide, must be incorporated in large amounts.
- the present invention relates to a process for manufacturing a polyamide composition molded article comprising the steps of (a) preparing a polyamide composition masterbatch containing a high content of a heat stabilizer by compounding a polyamide resin with a heat stabilizer, (b) melt-mixing, extruding, and pelletizing the masterbatch with heating into master pellets, (c) mixing these master pellets with a dilution polyamide resin so as to generate a mixture with a heat stabilizer content falling within a range of which is needed for heat stabilization of a polyamide composition, and (d) melt molding into articles under required heating.
- the process of this invention permits the manufacture of a polyamide composition molded article with much less yellowing than would be expected from the content of the heat stabilizer in the polyamide composition molded article.
- the polyamide composition molded article obtained by the process of this invention has a much lower degree of coloration (or yellowing) than the degree of coloration which would be expected from the amount of heat stabilizer present in the composition.
- Such considerable improvement in terms of coloration may be rationalized by the fact that the yellowing capability of the heat stabilizer towards the polyamide resin is completely or mostly consumed during the preparation of master pellets, so that by the time it is compounded with a dilution polyamide, the heat stabilizer no longer has any remaining yellowing capability toward the dilution polyamide resin.
- a coloration mechanism is based on simple speculation and this coloring mechanism should in no way give a limiting interpretation to the present invention.
- the polyamides used in the present invention are well known in the art and are commercially available.
- the polyamide is a high molecular weight material in which hydrocarbon groups or hydrocarbon groups interrupted by oxygen or sulfur are hnked together by amide bonds. It has a molecular weight of at least 5,000 in order to exhibit any moldability. It includes a material generally called "nylon".
- polyamide useful herein may be one prepared from a linear diamine represented by the formula
- these polyamides may be prepared also from said amines and amide-forming derivatives of these acids, such as esters, acid chlorides, amine salts, and the like.
- dicarboxyhc acids used for manufacturing these polyamides include adipic acid, pimelic acid, suberic acid, sebacic acid, and dodecane dicarboxyhc acid, while typical diamines include hexamethylene diamine and octamethylene diamine.
- Other polyamide types useful herein include those prepared by condensing an omega-amino carboxylic acid represented by the formula
- x is an integer of 3-12, or intramolecular amides thereof.
- polyamides which may be useful herein are polyamides in which part of the diamine components are replaced by any of bis(3-aminopropyl)ether, bis(aminomethyl)cyclohexane, metaphenylene diamine, metaxylylene diamine, and 4,4-diaminodiphenylether, with part of the dicarboxyhc acid components being replaced by any of isophthalic acid, terephthalic acid, and the like.
- polyamides useful herein include polyhexamethylene adipamide (Nylon 66), polyhexamethylene azelamide (Nylon 69), polyhexamethylene sebacamide (Nylon 610), polyhexamethylene dodecanoamide (nylon 612), polycaprolactam (Nylon 6), polylauryl lactam, poly-11-amino-undecanomide, and bis-(paraamino-cyclohexyl) methane dodecanoamide.
- polyamides which can be used are those copolymers from two types selected from the above polymers or those obtained by terpolymerization of the above polymers or their components (for example, polymers prepared from adipic acid and isophthalic acid and hexamethylene diamine).
- Typical heat stabilizers useful in the present invention include, for example, Group I metal halides (such as halides of sodium, potassium, lithium, and cuprous copper, for example), chlorides, bromides, iodides, sterically-hindered phenols, hydroquinones, derivatives of the compounds of these groups, and mixtures thereof.
- Group I metal halides such as halides of sodium, potassium, lithium, and cuprous copper, for example
- chlorides bromides, iodides, sterically-hindered phenols, hydroquinones, derivatives of the compounds of these groups, and mixtures thereof.
- the present invention may also incorporate a combination of UV stabilizers with these heat stabilizers where the typical UV stabilizers include various substituted resorcinols, salicylates, benzotriazoles, benzophenones, and the like.
- the heat stabilizer is first compounded with a polyamide composition, then melt mixed, extruded, and pelletized into master pellets.
- the amount of heat stabilizer used for incorporation into the polyamide composition should be adjusted so that when these master pellets are mixed with a dilution polyamide resin, the resultant mixture has a heat stabilizer content within the range typically necessary for heat stabilizing the mixture.
- the amount of copper ions in the mixture of master pellets and dilution polyamide resin is preferably in the range of 30-200 ppm.
- the heat stabilized masterbatch (master pellets) can be diluted to any extent with the polyamide dilution resin where the effect of decreasing yellowing in a resultant molded article is greater with a higher dilution ratio.
- An advantageous effect is particularly recognized where the masterbatch is diluted by at least 50% with the dilution polyamide resin (see Figure 2).
- the masterbatch is diluted too much (for example, wherein the amount of the masterbatch in the final mixture is 1% or less)
- a dilution ratio of about 2 Le. . 50% of the masterbatch in the final mixture) will increase the cost of production.
- the preferred dilution ratios are from 4 to not more than 100 (1% to 25% in terms of the amount of the masterbatch in the final mixture).
- compositions of this invention may contain, in addition to stabilizers against oxidation, heat, and UV-degradation, common additives, such as inhibitors, lubricants, mold release agents, coloring agents (including dyes and pigments), fibrous or granular filler, reinforcing agent, plasticizer, and the like. These additives are normally added commonly in the mixing stages.
- the heat stabilizer (HS) used in this example was a mixture of copper iodide and potassium iodide. The mixing ratio of the heat stabilizer used in the test was kept constant.
- the master chips had compositions as given in Table 1. below.
- the nylon 66 master chips prepared in the above step i) were used to prepare test pieces. Test pieces where extruded from the same twin screw extruder as that used in the preparation of these master chips, with no dilution for master chip 1-1 (100% masterbatch content); by mixing with the same amount of additive-free nylon 66 pellets (dilution ratio 2) (50% masterbatch content) for master chip 1-2; mixing with three times the amount of additive-free nylon 66 pellets (dilution ratio of 3) (25% masterbatch content) for master chip 1-3; mixing with nine times the amount of additive-free nylon 66 pellets (dilution ratio 9) (10% masterbatch content) for master chip 1-4; and mixing with 19 parts by weight of additive- free nylon 66 pellets (dilution ratio of 19) (5% masterbatch content) for master chip 1-5, followed by measuring YI-C for these samples. The content of copper ions in each sample was held at a constant level of 150 ppm by
- YI-C measurement are given in Figure 2 and Table 2. below.
- Figure 2 shows that for the masterbatch content of 100%, a molded test piece from a master chip 1-1 alone had a YI-C value of 28.
- the test piece At a masterbatch content of 50% (that is, a molded test piece obtained from master chip 1-2 diluted at a dilution ratio of 2), the test piece had a YI-C value of 26.
- a masterbatch content of 25% that is, a molded test piece obtained from master chip 1-3 diluted at a dilution ratio of 3
- the test piece had a YI-C value of 18.
- the test piece had a YI-C value of 16.
- the test piece had a YI-C value as low as 15, which is about half the value of the 100% masterbatch content.
- Example 2 Master chip 1-1 of Example 1, without dilution, and master chip 1-4 mixed with nine times the amount of additive-free nylon 66 chips (dilution ratio of 9) were melt extruded. The change in time of the tensile strength was measured on the extrudates for these two samples and is reported in Figure 3.
- Figure 4 shows that the incorporation of the additive in the form of a master chip to a nylon resulted in only a slight decrease in elongation. Although there is a drop in elongation with the passage of time, the tendency for reduction is identical to that obtained with a molded article from master chip 1-1 alone.
- Figure 1 A graph which shows a relationship between the amount of a copper compound added to a polyamide and the yellowing of the polyamide, in terms of YI-C values.
- FIG. 2 A figure which shows the relationship between the masterbatch content and the YI-C value, with the copper ion content as the heat stabilizer held at a constant level of 150 ppm.
- Figure 3 A figure which shows a relationship between tensile strength and a change with time for a sample containing 100% masterbatch and a sample containing 10% masterbatch.
- Figure 4 A figure showing elongation of a 100% masterbatch sample and a 10% masterbatch sample and the change with the passage of time.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4068143A JPH05295129A (en) | 1992-03-26 | 1992-03-26 | Production of polyamide resin composition |
EP94900465A EP0746453A1 (en) | 1993-10-29 | 1993-10-29 | Process for the manufacture of polyamide resin composition |
PCT/US1993/010454 WO1995011788A1 (en) | 1992-03-26 | 1993-10-29 | Process for the manufacture of polyamide resin composition |
US08/632,493 US5726278A (en) | 1992-03-26 | 1993-10-29 | Process for the manufacture of polyamide resin composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4068143A JPH05295129A (en) | 1992-03-26 | 1992-03-26 | Production of polyamide resin composition |
PCT/US1993/010454 WO1995011788A1 (en) | 1992-03-26 | 1993-10-29 | Process for the manufacture of polyamide resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1995011788A1 true WO1995011788A1 (en) | 1995-05-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US1993/010454 WO1995011788A1 (en) | 1992-03-26 | 1993-10-29 | Process for the manufacture of polyamide resin composition |
Country Status (1)
Country | Link |
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WO (1) | WO1995011788A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20020060783A (en) * | 2001-01-12 | 2002-07-19 | 서관호 | A process of preparing for the polyamide master batch |
EP4310147A4 (en) * | 2021-03-18 | 2025-04-16 | Mitsui Chemicals, Inc. | Polyamide resin composition and polyamide molded article |
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KR20020060783A (en) * | 2001-01-12 | 2002-07-19 | 서관호 | A process of preparing for the polyamide master batch |
EP4310147A4 (en) * | 2021-03-18 | 2025-04-16 | Mitsui Chemicals, Inc. | Polyamide resin composition and polyamide molded article |
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