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WO1989008529A1 - Process for ablation of polymer plastics using ultra-short laser pulses - Google Patents

Process for ablation of polymer plastics using ultra-short laser pulses Download PDF

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Publication number
WO1989008529A1
WO1989008529A1 PCT/EP1989/000283 EP8900283W WO8908529A1 WO 1989008529 A1 WO1989008529 A1 WO 1989008529A1 EP 8900283 W EP8900283 W EP 8900283W WO 8908529 A1 WO8908529 A1 WO 8908529A1
Authority
WO
WIPO (PCT)
Prior art keywords
ablation
laser radiation
radiation pulses
duration
ultra
Prior art date
Application number
PCT/EP1989/000283
Other languages
German (de)
French (fr)
Inventor
Stephan KÜPER
Michael Stuke
Original Assignee
Max-Planck-Gesellschaft Zur Förderung Der Wissensc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Max-Planck-Gesellschaft Zur Förderung Der Wissensc filed Critical Max-Planck-Gesellschaft Zur Förderung Der Wissensc
Publication of WO1989008529A1 publication Critical patent/WO1989008529A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • fluoroplastics such as polytetrafluoroethylene (PTFE)
  • PTFE polytetrafluoroethylene
  • Excimer laser pulses with a duration of 300 fs and one
  • Body made of essentially pure PTFE is used.
  • Pulse rate was 1 Hz to exclude thermal effects.
  • the radiation from a femtosecond KrF excimer laser was passed through a metal mask and through a spherical quartz crystal.
  • the ablation rate rises rapidly from a threshold fluence of about 300 mJ / cm 2 to about 1 J / cm2 and then saturates at higher fluence values.
  • the Fluence threshold is three times that of PMMA under the same conditions, which shows that PTFE can withstand a higher photon load without affecting its chemical structure.
  • the depth of ablation is an essentially linear function of the number of laser radiation
  • laser radiation pulses with a duration of less than 1 picosecond, preferably less than 500 femto seconds, will be used.
  • Laser radiation with a wavelength of 248 nm has proven itself well for PTFE.
  • acceptable results will also be seen with UV radiation of other wavelengths, e.g. B. between 150 and
  • DDieie FFlluueennzz can be up to 10 J / cm, possibly more.
  • the method and device described above can also be used to ablate solid non-metallic inorganic materials, e.g. B. alkali halide crystals, such as KBr, and teeth, especially tooth enamel.
  • solid non-metallic inorganic materials e.g. B. alkali halide crystals, such as KBr, and teeth, especially tooth enamel.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

Fluoroplastics, for example PTFE, are ablated using laser pulses with a duration of 300 fs, a wavelength of 248 nm and a fluence between approximately 0.5 and 1 J/cm2. Under these conditions, the ablation rate is of the order of 1 micrometre per laser pulse.

Description

Verfahren zur Ablation von polymeren Kunststoffen mittels ultrakurzer Laserstrahlungsimpulse Process for the ablation of polymer plastics using ultrashort laser radiation pulses
Es ist bekannt, daß eine saubere Ablation von Polymethyl- methacrylat (PMMA) mit ultrakurzen UV-Laserstrahlungsimpulsen (Dauer 300 fs, Wellenlänge 248 nm) bewirkt werden kann (Appl. Phys. B 44, 199-204 (1987)) .It is known that clean ablation of polymethyl methacrylate (PMMA) with ultra-short UV laser radiation pulses (duration 300 fs, wavelength 248 nm) can be effected (Appl. Phys. B 44, 199-204 (1987)).
Es hat sich überraschenderweise gezeigt, daß mit ähnlichen Verfahrensparametern auch eine saubere Ablation von Fluorkunst¬ stoffen, wie Polytetrafluorethylen (PTFE), erreicht werden kann, obwohl dieser Polymertyp eine ganz andere chemische Konstitution hat und im Molekül wesentlich stärkere und stabilere Bindungen aufweist als PMMA.It has surprisingly been found that clean process ablation of fluoroplastics, such as polytetrafluoroethylene (PTFE), can also be achieved with similar process parameters, although this type of polymer has a completely different chemical constitution and has significantly stronger and more stable bonds in the molecule than PMMA.
Bei einer bevorzugten Ausführungsform der Erfindung wurdenIn a preferred embodiment of the invention
Excimerlaserimpulse mit einer Dauer von 300 fs und einerExcimer laser pulses with a duration of 300 fs and one
Wellenlänge von 248 nm mit einer Fluenz bis herunter zuWavelength of 248 nm with a fluence down to
2 500 mJ/cm zum Abtragen (Ablatieren, Fotoätzen) einer vorher mit Methanol gereinigten und polierten Oberfläche eines2 500 mJ / cm for removing (ablating, photo-etching) a surface previously cleaned and polished with methanol
Körpers aus im wesentlichen reinem PTFE verwendet. DieBody made of essentially pure PTFE is used. The
Impulsrate betrug 1 Hz, um thermische Effekte auszuschließen.Pulse rate was 1 Hz to exclude thermal effects.
Höhere Impulsraten (Wiederholungsfrequenzen), z. B. 25Hz oder bis zu etwa 1 kHz und mehr sind ebenfalls möglich.Higher pulse rates (repetition frequencies), e.g. B. 25Hz or up to about 1 kHz and more are also possible.
Bei der Durchführung des oben beschriebenen Verfahrens wurde die Strahlung eines Femtosekunden-KrF-Excimer-Lasers durch eine Metallmaske und durch eine sphärische Quarz-When performing the method described above, the radiation from a femtosecond KrF excimer laser was passed through a metal mask and through a spherical quartz crystal.
Fokussierungslinse (f = 200mm) auf die Oberfläche desFocusing lens (f = 200mm) on the surface of the
PTFE-Körpers gerichtet. Die Bestrahlung erfolgte in 'Luft.PTFE body directed. Irradiation was in 'air.
Die Ablationsrate steigt von einer Schwellenwert-Fluenz von etwa 300 mJ/cm 2 bis etwa 1 J/cm2 rasch an und geht dann bei höheren Fluenzwerten in die Sättigung über. Der Fluenzschwellenwert ist dreimal so hoch wie bei PMMA unter den gleichen Bedingungen, was zeigt, daß PTFE eine höhere Photonenbelastung ohne Beeinträchtigung seiner chemischen Struktur aushält.The ablation rate rises rapidly from a threshold fluence of about 300 mJ / cm 2 to about 1 J / cm2 and then saturates at higher fluence values. The Fluence threshold is three times that of PMMA under the same conditions, which shows that PTFE can withstand a higher photon load without affecting its chemical structure.
Die Abtragungstiefe ist eine im wesentlichen lineare Funktion der Anzahl der zur Einwirkung gebrachten Laserstrahlungs-The depth of ablation is an essentially linear function of the number of laser radiation
2 i Imppuulse und beträgt bei ca. 2 J/cm etwa 1 μm pro Strahlu puls2 i Imppuulse and is approx. 1 μm per beam pulse at approx. 2 J / cm
Die einzige Figur der Zeichnung zeigt die Abtragungsrate iinn MMiikkrroommeetteerr pprroo LLäassee:rstrahlungsimpuls in Abhängigkeit von der Fluenz in J/cm 2The only figure in the drawing shows the rate of ablation in the microscopic proro LLassee: radiation pulse as a function of the fluence in J / cm 2
Unter den angegebenen Bedingungen ergeben sich scharf definierte Vertiefungen mit relativ glattem Boden, der praktisch frei von festen Rückständen an den Rändern ist.Under the specified conditions, there are sharply defined depressions with a relatively smooth bottom that is practically free of solid residues at the edges.
Das oben beschriebene bevorzugte Ausführungsbeispiel läßt sich selbstverständlich abwandlen, ohne den Rahmen der Erfindung zu überschreiten. Im allgemeinen wird man jedoch Laserstrahlungsimpulse mit einer Dauer unter 1 Picosekunde, vorzugsweise unter 500 FemtoSekunden verwenden. Für PTFE hat sich Laserstrahlung mit einer Wellenlänge von 248 nm gut bewährt. Annehmbare Ergebnisse werden sich jedoch auch mit UV-Strahlung anderer Wellenlängen, z. B. zwischen 150 undThe preferred embodiment described above can of course be modified without exceeding the scope of the invention. In general, however, laser radiation pulses with a duration of less than 1 picosecond, preferably less than 500 femto seconds, will be used. Laser radiation with a wavelength of 248 nm has proven itself well for PTFE. However, acceptable results will also be seen with UV radiation of other wavelengths, e.g. B. between 150 and
2 3 35500 nnmm,, eerrzziieelleenn llaasssseenn.. DDiiee FFlluueennzz kann bis zu 10 J/cm , gegebenenfalls auch mehr, betragen.2 3 35500 nnmm ,, eerrzziieelleenn llaasssseenn .. DDieie FFlluueennzz can be up to 10 J / cm, possibly more.
Das oben beschriebene Verfahren und die oben beschriebene Einrichtung lassen sich auch zur Ablation von festen nichtmetallischen anorganischen Materialien, z. B. Alkalihalogenid-Kristallen, wie KBr, und von Zähnen, insbesondere Zahnschmelz verwenden. The method and device described above can also be used to ablate solid non-metallic inorganic materials, e.g. B. alkali halide crystals, such as KBr, and teeth, especially tooth enamel.

Claims

PATENTANSPRÜCHE PATENT CLAIMS
1. Verfahren zur Ablation nichtmetallischer Materialien mittels ultrakurzer UV-Laserstrahlungsimpulse, dadurch gekennzeichnet, daß zur Ablation von Fluorkunststoffen, wie PTFE, Laserstrahlungsimpulse mit einer Dauer unter 1 ps und einer Wellenlänge unter 350 nm verwendet werden.1. A method for ablation of non-metallic materials by means of ultrashort UV laser radiation pulses, characterized in that laser radiation pulses with a duration of less than 1 ps and a wavelength of less than 350 nm are used for the ablation of fluoroplastics, such as PTFE.
2. Verfahren gemäß dem Oberbegriff des Anspruchs 1, dadurch gekennzeichnet, daß zur Ablation von anorganischen, nichtmetallischen Materialien, wie Zähnen und Alkali- halogenid-Kristallen, Laserstrahlungsimpulse mit einer Dauer unter 1 ps und einer Wellenlänge unter 350 nm verwen¬ det werden.2. The method according to the preamble of claim 1, characterized in that for the ablation of inorganic, non-metallic materials, such as teeth and alkali halide crystals, laser radiation pulses with a duration of less than 1 ps and a wavelength of less than 350 nm are used.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Dauer unter 500 fs verwendet werden.3. The method according to claim 1 or 2, characterized in that laser radiation pulses with a duration of less than 500 fs are used.
4. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Dauer von etwa 300 fs verwendet werden.4. The method according to claim 1 or 2, characterized in that laser radiation pulses with a duration of about 300 fs are used.
5. Verfahren nach Anspruch 1, 2 3, oder 4, dadurch gekenn¬ zeichnet, daß Laserstrahlungsimpulse mit einer Wellenlänge von etwa 250 nm verwendet werden.5. The method according to claim 1, 2 3, or 4, characterized gekenn¬ characterized in that laser radiation pulses with a wavelength of about 250 nm are used.
6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Fluenz über 300 mJ/cm 2 verw 'endet werden.6. The method according to any one of claims 1 to 5, characterized in that laser radiation pulses with a fluence over 300 mJ / cm 2 verw 'ends.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Fluenz bis etwa7. The method according to claim 6, characterized in that laser radiation pulses with a fluence up to about
2 10 J/cm verwendet werden.2 10 J / cm can be used.
8. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Pulsrate bis etwas 1 kHz verwendet werden. 8. The method according to any one of the preceding claims, characterized in that laser radiation pulses with a pulse rate of up to about 1 kHz are used.
PCT/EP1989/000283 1988-03-18 1989-03-17 Process for ablation of polymer plastics using ultra-short laser pulses WO1989008529A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3809211.5 1988-03-18
DE3809211A DE3809211A1 (en) 1988-03-18 1988-03-18 METHOD FOR ABLATION OF POLYMERIC PLASTICS BY MEANS OF ULTRA-SHORT LASER RADIATION PULSES

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WO1989008529A1 true WO1989008529A1 (en) 1989-09-21

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0380634A1 (en) * 1988-08-12 1990-08-08 Rogers Corp Method of laser drilling fluoropolymer materials.
DE4018135A1 (en) * 1989-06-06 1990-12-13 Dainippon Printing Co Ltd Emulsion mask defect repair - by applying contoured UV beam of excimer laser
DE4202074A1 (en) * 1992-01-25 1993-07-29 Audi Ag Removing lacquer from parts - by bombarding with laser beam
US5243589A (en) * 1991-06-05 1993-09-07 Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. Method for recording information in an optically readable data memory
WO1994007640A1 (en) * 1992-09-29 1994-04-14 Bausch & Lomb Incorporated Scanning technique for laser ablation
WO1994007638A1 (en) * 1992-09-29 1994-04-14 Bausch & Lomb Incorporated Method of cleaning laser ablation debris
US5359173A (en) * 1992-09-29 1994-10-25 Bausch & Lomb Incorporated Scanning technique for laser ablation
EP0670195A1 (en) * 1994-03-04 1995-09-06 SMALTIRIVA S.p.A. A process for removing fluorocarbon resin-based coatings.
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
DE19745294A1 (en) * 1997-10-14 1999-04-15 Biotronik Mess & Therapieg Process for the production of fine-structured medical technology implants
US6489589B1 (en) * 1994-02-07 2002-12-03 Board Of Regents, University Of Nebraska-Lincoln Femtosecond laser utilization methods and apparatus and method for producing nanoparticles
EP2430649A1 (en) * 2009-05-15 2012-03-21 Translith Systems, LLC Method and apparatus for controlled laser ablation of material

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4041884A1 (en) * 1990-12-27 1992-07-02 Abb Patent Gmbh METHOD FOR TREATING SURFACES
DE4219636A1 (en) * 1992-06-16 1993-12-23 Lsg Loet Und Schweisgeraete Gm Activating PTFE surfaces to enable adhesive bonding - by treatment with high energy ion beam
US5730924A (en) * 1994-12-28 1998-03-24 Sumitomo Heavy Industries, Ltd. Micromachining of polytetrafluoroethylene using radiation
DE10029110B4 (en) * 1999-06-15 2006-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for material processing and use thereof
KR20060114710A (en) * 2004-01-23 2006-11-07 스미토모덴키고교가부시키가이샤 Stretched polytetrafluoroethylene porous article having fine pores formed therein and method for production thereof, and method of ablation machining

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DE3501839A1 (en) * 1985-01-22 1986-07-24 Lambda Physik GmbH, 3400 Göttingen Method and device for stripping insulation off wires

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DE3501839A1 (en) * 1985-01-22 1986-07-24 Lambda Physik GmbH, 3400 Göttingen Method and device for stripping insulation off wires

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
I.B.M. TECHNICAL DISCLOSURE BULLETIN vol. 30, no. 4, September 1987, New York Seite 1797 - 1798; "Tefzel removal from flat wire bus via UV laser" siehe Seite 1797, Absatz 1,2; Figur 1 *

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0380634A1 (en) * 1988-08-12 1990-08-08 Rogers Corp Method of laser drilling fluoropolymer materials.
EP0380634A4 (en) * 1988-08-12 1991-12-27 Rogers Corporation Method of laser drilling fluoropolymer materials
DE4018135A1 (en) * 1989-06-06 1990-12-13 Dainippon Printing Co Ltd Emulsion mask defect repair - by applying contoured UV beam of excimer laser
DE4018135B4 (en) * 1989-06-06 2004-07-29 Dai Nippon Insatsu K.K. Method and device for repairing defects in emulsion masks
US5243589A (en) * 1991-06-05 1993-09-07 Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. Method for recording information in an optically readable data memory
DE4202074A1 (en) * 1992-01-25 1993-07-29 Audi Ag Removing lacquer from parts - by bombarding with laser beam
WO1994007640A1 (en) * 1992-09-29 1994-04-14 Bausch & Lomb Incorporated Scanning technique for laser ablation
WO1994007638A1 (en) * 1992-09-29 1994-04-14 Bausch & Lomb Incorporated Method of cleaning laser ablation debris
US5331131A (en) * 1992-09-29 1994-07-19 Bausch & Lomb Incorporated Scanning technique for laser ablation
US5359173A (en) * 1992-09-29 1994-10-25 Bausch & Lomb Incorporated Scanning technique for laser ablation
WO1995000284A1 (en) * 1993-06-22 1995-01-05 Bausch & Lomb Incorporated Scanning technique for laser ablation
US6489589B1 (en) * 1994-02-07 2002-12-03 Board Of Regents, University Of Nebraska-Lincoln Femtosecond laser utilization methods and apparatus and method for producing nanoparticles
EP0670195A1 (en) * 1994-03-04 1995-09-06 SMALTIRIVA S.p.A. A process for removing fluorocarbon resin-based coatings.
USRE37585E1 (en) * 1994-04-08 2002-03-19 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
DE19745294A1 (en) * 1997-10-14 1999-04-15 Biotronik Mess & Therapieg Process for the production of fine-structured medical technology implants
US6160240A (en) * 1997-10-14 2000-12-12 Biotronik Mess-und Therapiegerate GmbH & Co Ingenieurburo Berlin Method of producing microstructural medical implants
EP2430649A1 (en) * 2009-05-15 2012-03-21 Translith Systems, LLC Method and apparatus for controlled laser ablation of material
EP2430649A4 (en) * 2009-05-15 2014-07-16 Translith Systems Llc Method and apparatus for controlled laser ablation of material
US9254536B2 (en) 2009-05-15 2016-02-09 Paul Hoff Method and apparatus for controlled laser ablation of material

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