USRE20638E - Alloy - Google Patents
Alloy Download PDFInfo
- Publication number
- USRE20638E USRE20638E US20638DE USRE20638E US RE20638 E USRE20638 E US RE20638E US 20638D E US20638D E US 20638DE US RE20638 E USRE20638 E US RE20638E
- Authority
- US
- United States
- Prior art keywords
- alloy
- zinc
- ranging
- silver
- cadmium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 title description 23
- 239000000956 alloy Substances 0.000 title description 23
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 17
- 229910052725 zinc Inorganic materials 0.000 description 17
- 239000011701 zinc Substances 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 229910052793 cadmium Inorganic materials 0.000 description 12
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 12
- 229910052698 phosphorus Inorganic materials 0.000 description 12
- 235000014786 phosphorus Nutrition 0.000 description 12
- 239000011574 phosphorus Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 230000008018 melting Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- PSFDQSOCUJVVGF-UHFFFAOYSA-N harman Chemical compound C12=CC=CC=C2NC2=C1C=CN=C2C PSFDQSOCUJVVGF-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
Definitions
- This invention relates to alloys used for soldering and (analogous purposes, and is concerned more particularly with a novel alloy which has relatively low melting and flow-points, and can be used without flux or with less flux than would otherwise be required Ior producing excellent joints.
- the new alloy includes silver, copper, zinc and phosphorus, and may for some purposes also include cadmium.
- the use oi zinc and cadmium in combination produces a more ductile alloy than is obtainable by employing either metal alone, although in some instances it may be:desirable to omit the cadmium. Accordingly, by using no cadmium or by varying the amount of cadmium, examples of the new alloy diil'ering in physical properties may be obtained to suit particular needs.
- the presence of zinc or cadmium or' both these metals aflects the melting point of the alloy, and in general the higher the proportion of zinc, or cadmium, or both, the lower is the melting point.
- the incorporation oi phosphorus in the alloy serves a number of purposes.
- the phosphorus prevents oxidation and permits use of the alloy without a flux or with less flux than would otherwise be required. In addition, it lowers the melting point of the alloy, and improves its'flowing properties, so that it enters crevices and seams and produces joints of high tensile strength.
- the new alloy consists of the following constituents in the approximate proportions given:
- Zinc to 40 Zinc to 40
- the amount of zinc should preferably be within the range of 10% to 30%, approximately, and the amount of cadmium within the range oi 1% to 20%, approximately.
- the alloy having the composition of Example No. 1 has a melting point 01' 1200 F. and a flow point of 1245 F., but it cadmium is added for an equivalent amount of zinc, the melting and flow points will be 1100 F. and 1108 F., respectively.
- the alloy in Example No. 2 has a melting point of 1130 F. and a flow point of 1195 F. and the alloy in Example No. 3 has a melting point of 1340 F. and a flow point of 1385 F.
- the melting and flow points increase with the percentage of silver, but there is greater ductility and these factors would control the selection of the most desirable composition for a specific application.
- An alloy for soldering and 'simiiar'p'urposes which consists of silver ranging from about 30% to about 70%, copper ranging from about 19% to about 35%, phosphorus ranging from about Example No. 1 Per cent Silver 30 Copper 30 Zinc 38 Phosphorus. 2
- Example No. 2 g Per cent .Silver ;.t...i 50 Copper i 27 Zinc 1 22 Phosphorus 1
- Example No. 3 Example No. 2 g Per cent .Silver ;.t...i 50 Copper i 27 Zinc 1 22 Phosphorus 1
- Example No. 3 Example No. 2 g Per cent .Silver ;.t...i 50 Copper i 27 Zinc 1 22 Phosphorus 1
- An alloy for soldering and similar purposes which consists of silver ranging from about 30% to about 50%, copper ranging from about 19% to about 35%, nc ranging from about 10% to about 40%, and phosphorus ranging from about 0.5 v to about 5%.
- An alloy i'or soldering and similar purposes which consists of about 30% silver, about 30% copper, about 38% zinc, and about 2% phosphorus.
- An alloy for soldering and similar purposes wh ch consists of about 50% silver, copper ranging from about 27% to about 34%,, zinc ranging from about 16% to about 22% and about 1% hosphorus.
- An alloy tor soidering-and'similar purposes 5 which consists of about 70% silver, about 19% copper, ,about 10% zinc. and about 1% phos phorus.
- An alloy for soldering and similar purposes which consists of silver ranging from about 50% to about 70%, copper ranging from about 19% to about 35%, zinc ranging from about 10% to about 40%, and phosphorus ranging from about 0,57, 5
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Reiuued Jan; 25, 1938 UNITED STATES PATENT OFFICE I ALLOY Robert H. Leach, Fairfleld, =onn.,
assignor to Handy a Harman, New York, N. Y., a corporation of New'Yol-k;
No Drawing. Original No. 2,019,984, dated November 5, 1935, Serial No. 29, 1934. Application for 746,273, September reissue December 8,
1937, Serial No. 178,007
6 Claim.
This invention relates to alloys used for soldering and (analogous purposes, and is concerned more particularly with a novel alloy which has relatively low melting and flow-points, and can be used without flux or with less flux than would otherwise be required Ior producing excellent joints.
The new alloy includes silver, copper, zinc and phosphorus, and may for some purposes also include cadmium. The use oi zinc and cadmium in combination produces a more ductile alloy than is obtainable by employing either metal alone, although in some instances it may be:desirable to omit the cadmium. Accordingly, by using no cadmium or by varying the amount of cadmium, examples of the new alloy diil'ering in physical properties may be obtained to suit particular needs. The presence of zinc or cadmium or' both these metals aflects the melting point of the alloy, and in general the higher the proportion of zinc, or cadmium, or both, the lower is the melting point. There is a limit, however, to the extent to which these metals can be employed, while still obtaining an alloy suitable for brazing purposes and giving high strength joints, and I have io'und that it is not desirable to use an aggregate amount greater than aboutv 40% and for most purposes, a less amount is to be preferred.
The incorporation oi phosphorus in the alloy serves a number of purposes. The phosphorus prevents oxidation and permits use of the alloy without a flux or with less flux than would otherwise be required. In addition, it lowers the melting point of the alloy, and improves its'flowing properties, so that it enters crevices and seams and produces joints of high tensile strength.
In general, the new alloy consists of the following constituents in the approximate proportions given:
Per cent Silver 30 to 70 Copper 19 to 35 Phosphorus 0.5 to
' Zinc to 40 In the above analysis, it is to be understood that cadmium may be substituted wholly or in part for the zinc. When both zinc and cadmium are present, the amount of zinc should preferably be within the range of 10% to 30%, approximately, and the amount of cadmium within the range oi 1% to 20%, approximately.
Specific examples of the new alloy may be given as follows, the proportions being app ox mate.
Of the specific examples the alloy having the composition of Example No. 1 has a melting point 01' 1200 F. and a flow point of 1245 F., but it cadmium is added for an equivalent amount of zinc, the melting and flow points will be 1100 F. and 1108 F., respectively. The alloy in Example No. 2 has a melting point of 1130 F. and a flow point of 1195 F. and the alloy in Example No. 3 has a melting point of 1340 F. and a flow point of 1385 F. In alloys containing over 50% silver and no cadmium, the melting and flow points increase with the percentage of silver, but there is greater ductility and these factors would control the selection of the most desirable composition for a specific application.
What I claim is:
1. An alloy for soldering and 'simiiar'p'urposes which consists of silver ranging from about 30% to about 70%, copper ranging from about 19% to about 35%, phosphorus ranging from about Example No. 1 Per cent Silver 30 Copper 30 Zinc 38 Phosphorus. 2
Example No. 2 g Per cent .Silver ;.t...i 50 Copper i 27 Zinc 1 22 Phosphorus 1 Example No. 3
' Per cent Silver '70 Copper... 1 18 Zinc 10 Phosphorus a 1 0.5% to about 5%, and zinc ranging from about 10% to about 40%.
2. An alloy for soldering and similar purposes which consists of silver ranging from about 30% to about 50%, copper ranging from about 19% to about 35%, nc ranging from about 10% to about 40%, and phosphorus ranging from about 0.5 v to about 5%.
3. An alloy i'or soldering and similar purposes which consists of about 30% silver, about 30% copper, about 38% zinc, and about 2% phosphorus.
4. An alloy for soldering and similar purposes wh ch consists of about 50% silver, copper ranging from about 27% to about 34%,, zinc ranging from about 16% to about 22% and about 1% hosphorus.
5. An alloy tor soidering-and'similar purposes 5 which consists of about 70% silver, about 19% copper, ,about 10% zinc. and about 1% phos phorus.
moss
6: An alloy for soldering and similar purposes which consists of silver ranging from about 50% to about 70%, copper ranging from about 19% to about 35%, zinc ranging from about 10% to about 40%, and phosphorus ranging from about 0,57, 5
to about 5%.
. ROBERT E. LEACH.
Publications (1)
Publication Number | Publication Date |
---|---|
USRE20638E true USRE20638E (en) | 1938-01-25 |
Family
ID=2085737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US20638D Expired USRE20638E (en) | Alloy |
Country Status (1)
Country | Link |
---|---|
US (1) | USRE20638E (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2487453A (en) * | 1945-08-14 | 1949-11-08 | Handy & Harman | Silver-copper-zinc-cadmium alloy |
US2487452A (en) * | 1945-08-14 | 1949-11-08 | Handy & Harman | Silver-copper-zinc-cadmium alloy |
US20140030139A1 (en) * | 2012-07-30 | 2014-01-30 | Alcoma Metal Co., Ltd. | Cu-P-Ag-Zn BRAZING ALLOY |
US8783544B2 (en) * | 2012-03-20 | 2014-07-22 | Joseph W. Harris | Brazing alloys and methods of brazing |
-
0
- US US20638D patent/USRE20638E/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2487453A (en) * | 1945-08-14 | 1949-11-08 | Handy & Harman | Silver-copper-zinc-cadmium alloy |
US2487452A (en) * | 1945-08-14 | 1949-11-08 | Handy & Harman | Silver-copper-zinc-cadmium alloy |
US8783544B2 (en) * | 2012-03-20 | 2014-07-22 | Joseph W. Harris | Brazing alloys and methods of brazing |
US20140030139A1 (en) * | 2012-07-30 | 2014-01-30 | Alcoma Metal Co., Ltd. | Cu-P-Ag-Zn BRAZING ALLOY |
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