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USD984397S1 - Circuit board - Google Patents

Circuit board Download PDF

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Publication number
USD984397S1
USD984397S1 US29/774,287 US202129774287F USD984397S US D984397 S1 USD984397 S1 US D984397S1 US 202129774287 F US202129774287 F US 202129774287F US D984397 S USD984397 S US D984397S
Authority
US
United States
Prior art keywords
circuit board
view
elevational view
ornamental design
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/774,287
Inventor
Yidong Cai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/774,287 priority Critical patent/USD984397S1/en
Application granted granted Critical
Publication of USD984397S1 publication Critical patent/USD984397S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a circuit board showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines and lightened areas within the broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a circuit board, as shown and described.
US29/774,287 2021-03-16 2021-03-16 Circuit board Active USD984397S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/774,287 USD984397S1 (en) 2021-03-16 2021-03-16 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/774,287 USD984397S1 (en) 2021-03-16 2021-03-16 Circuit board

Publications (1)

Publication Number Publication Date
USD984397S1 true USD984397S1 (en) 2023-04-25

Family

ID=86008041

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/774,287 Active USD984397S1 (en) 2021-03-16 2021-03-16 Circuit board

Country Status (1)

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US (1) USD984397S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012050S1 (en) * 2019-06-21 2024-01-23 Raspberry Pi (Trading) Limited Computer
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4575747A (en) * 1982-09-20 1986-03-11 Siemens Aktiengesellschaft Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges
US20110156225A1 (en) * 2008-09-10 2011-06-30 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same
US20130329384A1 (en) * 2011-03-01 2013-12-12 Hitachi Automotive Systems, Ltd. Transmission Control Device and Electronic Circuit Device
US9645163B2 (en) * 2011-08-24 2017-05-09 Continental Teves Ag & Co. Ohg Sensor with a single electrical carrier means
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
US10015882B1 (en) * 2015-01-05 2018-07-03 Qorvo Us, Inc. Modular semiconductor package
US10271448B2 (en) * 2012-08-06 2019-04-23 Investar Corporation Thin leadframe QFN package design of RF front-ends for mobile wireless communication
US10375816B2 (en) * 2015-05-08 2019-08-06 Canon Kabushiki Kaisha Printed-circuit board, printed-wiring board, and electronic apparatus
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
US10980131B2 (en) * 2017-01-26 2021-04-13 Nano Dimension Technologies, Ltd. Chip embedded printed circuit boards and methods of fabrication
US11508646B2 (en) * 2018-04-12 2022-11-22 Mitsubishi Electric Corporation Semiconductor device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4575747A (en) * 1982-09-20 1986-03-11 Siemens Aktiengesellschaft Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges
US20110156225A1 (en) * 2008-09-10 2011-06-30 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same
US20130329384A1 (en) * 2011-03-01 2013-12-12 Hitachi Automotive Systems, Ltd. Transmission Control Device and Electronic Circuit Device
US9645163B2 (en) * 2011-08-24 2017-05-09 Continental Teves Ag & Co. Ohg Sensor with a single electrical carrier means
US10271448B2 (en) * 2012-08-06 2019-04-23 Investar Corporation Thin leadframe QFN package design of RF front-ends for mobile wireless communication
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
US10015882B1 (en) * 2015-01-05 2018-07-03 Qorvo Us, Inc. Modular semiconductor package
US10375816B2 (en) * 2015-05-08 2019-08-06 Canon Kabushiki Kaisha Printed-circuit board, printed-wiring board, and electronic apparatus
US10980131B2 (en) * 2017-01-26 2021-04-13 Nano Dimension Technologies, Ltd. Chip embedded printed circuit boards and methods of fabrication
US11508646B2 (en) * 2018-04-12 2022-11-22 Mitsubishi Electric Corporation Semiconductor device
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012050S1 (en) * 2019-06-21 2024-01-23 Raspberry Pi (Trading) Limited Computer
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device

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