USD973030S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD973030S1 USD973030S1 US29/772,126 US202129772126F USD973030S US D973030 S1 USD973030 S1 US D973030S1 US 202129772126 F US202129772126 F US 202129772126F US D973030 S USD973030 S US D973030S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- ornamental design
- semiconductor
- new design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR30-2021-0008923 | 2021-02-23 | ||
KR20210008923 | 2021-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD973030S1 true USD973030S1 (en) | 2022-12-20 |
Family
ID=78604409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/772,126 Active USD973030S1 (en) | 2021-02-23 | 2021-02-26 | Semiconductor device |
Country Status (2)
Country | Link |
---|---|
US (1) | USD973030S1 (en) |
JP (1) | JP1700006S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD989013S1 (en) * | 2021-06-18 | 2023-06-13 | Dong Woon Anatech Co., Ltd | Semiconductor device |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD523403S1 (en) * | 2004-09-09 | 2006-06-20 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor device |
US20080061415A1 (en) * | 2006-09-11 | 2008-03-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, method for manufacturing semiconductor device, and electric equipment system |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
USD916039S1 (en) * | 2020-03-20 | 2021-04-13 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor device |
JP1684023S (en) * | 2020-04-01 | 2021-04-26 | ||
USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
JP1712327S (en) * | 2021-06-18 | 2022-04-12 | Semiconductor element | |
USD949807S1 (en) * | 2020-03-13 | 2022-04-26 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
-
2021
- 2021-02-26 US US29/772,126 patent/USD973030S1/en active Active
- 2021-02-26 JP JPD2021-4172F patent/JP1700006S/ja active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD523403S1 (en) * | 2004-09-09 | 2006-06-20 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor device |
US20080061415A1 (en) * | 2006-09-11 | 2008-03-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, method for manufacturing semiconductor device, and electric equipment system |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD827591S1 (en) * | 2016-10-31 | 2018-09-04 | Fuji Electric Co., Ltd. | Semiconductor module |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
US10557191B2 (en) * | 2017-01-31 | 2020-02-11 | Sakai Display Products Corporation | Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device |
US10605828B2 (en) * | 2017-03-30 | 2020-03-31 | Advanced Semiconductor Engineering, Inc. | Device for attaching a semiconductor device to a circuit board |
USD851612S1 (en) * | 2017-06-30 | 2019-06-18 | Microduino Inc. | Electrical module |
US10651050B2 (en) * | 2017-12-01 | 2020-05-12 | Micron Technology, Inc. | Semiconductor device packages and structures |
US10672878B2 (en) * | 2018-02-08 | 2020-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Silicon carbide semiconductor device |
USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
USD949807S1 (en) * | 2020-03-13 | 2022-04-26 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD916039S1 (en) * | 2020-03-20 | 2021-04-13 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor device |
JP1684023S (en) * | 2020-04-01 | 2021-04-26 | ||
JP1712327S (en) * | 2021-06-18 | 2022-04-12 | Semiconductor element |
Non-Patent Citations (3)
Title |
---|
Audio Xpress, Announced on May 28, 2020 [online], retrieved on Sep. 9, 2022, retrieved from online, https://audioxpress.com/news/cirrus-logic-launches-advanced-haptic-and-sensing-ic-solutions-for-richer-immersive-user-experiences (Year: 2020). * |
Dongwoon, Announced on May 23, 2020 [online], retrieved on Sep. 9, 2022, retrieved from online, https://web.archive.org/web/20200523183258/ https://www.immersion.com/use_cases/dongwoon-haptic-ic/ (Year: 2020). * |
J-Quad, Announced on Apr. 12, 2018 [online], retrieved on Sep. 9, 2022, retrieved from online, https://www.amazon.com/dp/B07C55B8LB/ref=emc_b_5_t (Year: 2018). * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD989013S1 (en) * | 2021-06-18 | 2023-06-13 | Dong Woon Anatech Co., Ltd | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP1700006S (en) | 2021-11-22 |
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FEPP | Fee payment procedure |
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