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USD973030S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD973030S1
USD973030S1 US29/772,126 US202129772126F USD973030S US D973030 S1 USD973030 S1 US D973030S1 US 202129772126 F US202129772126 F US 202129772126F US D973030 S USD973030 S US D973030S
Authority
US
United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
new design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/772,126
Inventor
Yu-Hwang Lee
Jung-Hyun EUM
Ho-cheol Jang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dong Woon Anatech Co Ltd
Original Assignee
Dong Woon Anatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dong Woon Anatech Co Ltd filed Critical Dong Woon Anatech Co Ltd
Assigned to DONG WOON ANATECH CO., LTD reassignment DONG WOON ANATECH CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EUM, Jung-Hyun, JANG, HO-CHEOL, LEE, YU-HWANG
Application granted granted Critical
Publication of USD973030S1 publication Critical patent/USD973030S1/en
Active legal-status Critical Current
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Description

FIG. 1 is a front, top, and right-side perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/772,126 2021-02-23 2021-02-26 Semiconductor device Active USD973030S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2021-0008923 2021-02-23
KR20210008923 2021-02-23

Publications (1)

Publication Number Publication Date
USD973030S1 true USD973030S1 (en) 2022-12-20

Family

ID=78604409

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/772,126 Active USD973030S1 (en) 2021-02-23 2021-02-26 Semiconductor device

Country Status (2)

Country Link
US (1) USD973030S1 (en)
JP (1) JP1700006S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD989013S1 (en) * 2021-06-18 2023-06-13 Dong Woon Anatech Co., Ltd Semiconductor device

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
US20080061415A1 (en) * 2006-09-11 2008-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
US10557191B2 (en) * 2017-01-31 2020-02-11 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
US10651050B2 (en) * 2017-12-01 2020-05-12 Micron Technology, Inc. Semiconductor device packages and structures
US10672878B2 (en) * 2018-02-08 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Silicon carbide semiconductor device
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
JP1684023S (en) * 2020-04-01 2021-04-26
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
JP1712327S (en) * 2021-06-18 2022-04-12 Semiconductor element
USD949807S1 (en) * 2020-03-13 2022-04-26 Sansha Electric Manufacturing Company, Limited Semiconductor module

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
US20080061415A1 (en) * 2006-09-11 2008-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
US10557191B2 (en) * 2017-01-31 2020-02-11 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
US10651050B2 (en) * 2017-12-01 2020-05-12 Micron Technology, Inc. Semiconductor device packages and structures
US10672878B2 (en) * 2018-02-08 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Silicon carbide semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD949807S1 (en) * 2020-03-13 2022-04-26 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
JP1684023S (en) * 2020-04-01 2021-04-26
JP1712327S (en) * 2021-06-18 2022-04-12 Semiconductor element

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Audio Xpress, Announced on May 28, 2020 [online], retrieved on Sep. 9, 2022, retrieved from online, https://audioxpress.com/news/cirrus-logic-launches-advanced-haptic-and-sensing-ic-solutions-for-richer-immersive-user-experiences (Year: 2020). *
Dongwoon, Announced on May 23, 2020 [online], retrieved on Sep. 9, 2022, retrieved from online, https://web.archive.org/web/20200523183258/ https://www.immersion.com/use_cases/dongwoon-haptic-ic/ (Year: 2020). *
J-Quad, Announced on Apr. 12, 2018 [online], retrieved on Sep. 9, 2022, retrieved from online, https://www.amazon.com/dp/B07C55B8LB/ref=emc_b_5_t (Year: 2018). *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD989013S1 (en) * 2021-06-18 2023-06-13 Dong Woon Anatech Co., Ltd Semiconductor device

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