USD956833S1 - Plunger unit - Google Patents
Plunger unit Download PDFInfo
- Publication number
- USD956833S1 USD956833S1 US35/355,092 US35509241F USD956833S US D956833 S1 USD956833 S1 US D956833S1 US 35509241 F US35509241 F US 35509241F US D956833 S USD956833 S US D956833S
- Authority
- US
- United States
- Prior art keywords
- plunger unit
- plunger
- unit
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
2. Plunger unit
The broken lines shown in the drawings represent portions of the plunger unit that form no part of the claimed design. Fig.2.1 is a front view of the plunger unit; fig.2.2 is a back view thereof; fig.2.3 is a top view thereof; fig.2.4 is a bottom view thereof; fig.2.5 is a right view thereof; fig.2.6 is a left view thereof; and fig.2.7 is a perspective view thereof.
Claims (1)
- The ornamental design for a plunger unit, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35/355,092 USD956833S1 (en) | 2019-10-31 | 2019-10-31 | Plunger unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35/355,092 USD956833S1 (en) | 2019-10-31 | 2019-10-31 | Plunger unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD956833S1 true USD956833S1 (en) | 2022-07-05 |
Family
ID=82199782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US35/355,092 Active USD956833S1 (en) | 2019-10-31 | 2019-10-31 | Plunger unit |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD956833S1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5851941A (en) * | 1996-03-01 | 1998-12-22 | Ngk Insulators, Ltd. | Si/SiC-based sintered material having excellent corrosion resistance and kiln furniture |
| US7794408B2 (en) * | 2003-03-28 | 2010-09-14 | Ethicon, Inc. | Tissue collection device and methods |
| USD714368S1 (en) * | 2013-06-17 | 2014-09-30 | Husky Injection Molding Systems Ltd. | Mold |
| USD730416S1 (en) * | 2010-11-12 | 2015-05-26 | Husky Injection Molding Systems Ltd. | Lock ring for use in a mold stack |
| US20150311095A1 (en) * | 2014-04-24 | 2015-10-29 | Towa Corporation | Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member |
| US20160020187A1 (en) * | 2014-07-18 | 2016-01-21 | Towa Corporation | Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member |
| US10170346B2 (en) * | 2015-03-23 | 2019-01-01 | Towa Corporation | Resin sealing apparatus and resin sealing method |
-
2019
- 2019-10-31 US US35/355,092 patent/USD956833S1/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5851941A (en) * | 1996-03-01 | 1998-12-22 | Ngk Insulators, Ltd. | Si/SiC-based sintered material having excellent corrosion resistance and kiln furniture |
| US7794408B2 (en) * | 2003-03-28 | 2010-09-14 | Ethicon, Inc. | Tissue collection device and methods |
| USD730416S1 (en) * | 2010-11-12 | 2015-05-26 | Husky Injection Molding Systems Ltd. | Lock ring for use in a mold stack |
| USD714368S1 (en) * | 2013-06-17 | 2014-09-30 | Husky Injection Molding Systems Ltd. | Mold |
| US20150311095A1 (en) * | 2014-04-24 | 2015-10-29 | Towa Corporation | Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member |
| US20160020187A1 (en) * | 2014-07-18 | 2016-01-21 | Towa Corporation | Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member |
| US10170346B2 (en) * | 2015-03-23 | 2019-01-01 | Towa Corporation | Resin sealing apparatus and resin sealing method |
Non-Patent Citations (2)
| Title |
|---|
| Taiwanese Office Action corresponding to Taiwanese Application No. 109302259, dated Sep. 30, 2020, 5 pages. |
| Taiwanese Office Action corresponding to Taiwanese Application No. 109302269, dated Sep. 29, 2020, 4 pages. |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |