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USD938373S1 - Substrate transfer structure - Google Patents

Substrate transfer structure Download PDF

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Publication number
USD938373S1
USD938373S1 US29/710,816 US201929710816F USD938373S US D938373 S1 USD938373 S1 US D938373S1 US 201929710816 F US201929710816 F US 201929710816F US D938373 S USD938373 S US D938373S
Authority
US
United States
Prior art keywords
substrate transfer
transfer structure
view
substrate
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/710,816
Inventor
Jason M. Schaller
Benjamin Riordon
Mitchell DiSanto
Paul Forderhase
Gary Wyka
Jeffrey Hudgens
Paul Z. Wirth
Charles T. Carlson
Siva Chandrasekar
Michael Carrell
Venkata Raghavaiah Chowdhary Kode
Dmitry A. Dzilno
Juan Carlos Rocha-Alvarez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/710,816 priority Critical patent/USD938373S1/en
Priority to TW109301874F priority patent/TWD211400S/en
Priority to JPD2020-8330F priority patent/JP1694395S/ja
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DZILNO, DMITRY A., ROCHA-ALVAREZ, JUAN CARLOS, CARLSON, CHARLES T., CHANDRASEKAR, SIVA, CARRELL, MICHAEL, FORDERHASE, Paul, RIORDON, BENJAMIN, WYKA, GARY, DISANTO, MITCHELL, HUDGENS, JEFFREY, KODE, VENKATA RAGHAVAIAH CHOWDHARY, SCHALLER, JASON M., WIRTH, PAUL Z.
Application granted granted Critical
Publication of USD938373S1 publication Critical patent/USD938373S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top view of a substrate transfer structure showing our new design;
FIG. 2 is a top angled view of the substrate transfer structure;
FIG. 3 is a perspective view of the substrate transfer structure;
FIG. 4 is a left side view of the substrate transfer structure, with the right side and back side views being identical images thereof; and,
FIG. 5 is a front side view of the substrate transfer structure.
The broken lines are for the purpose of showing environmental structure, and form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a substrate transfer structure, substantially as shown and described.
US29/710,816 2019-10-25 2019-10-25 Substrate transfer structure Active USD938373S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/710,816 USD938373S1 (en) 2019-10-25 2019-10-25 Substrate transfer structure
TW109301874F TWD211400S (en) 2019-10-25 2020-04-08 Substrate transfer structure
JPD2020-8330F JP1694395S (en) 2019-10-25 2020-04-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/710,816 USD938373S1 (en) 2019-10-25 2019-10-25 Substrate transfer structure

Publications (1)

Publication Number Publication Date
USD938373S1 true USD938373S1 (en) 2021-12-14

Family

ID=77550235

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/710,816 Active USD938373S1 (en) 2019-10-25 2019-10-25 Substrate transfer structure

Country Status (3)

Country Link
US (1) USD938373S1 (en)
JP (1) JP1694395S (en)
TW (1) TWD211400S (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD436609S1 (en) * 1999-11-30 2001-01-23 Applied Materials, Inc. Transfer chamber
USD441348S1 (en) * 1999-11-30 2001-05-01 Applied Materials, Inc. Process chamber lid
USD470457S1 (en) * 2001-12-12 2003-02-18 Reese Products, Inc. Support arm for transformer table
USD541217S1 (en) * 2005-12-21 2007-04-24 Johnson Electric S.A. Lamination for an electric motor
TW200811985A (en) 2006-08-30 2008-03-01 Asm Japan Kk Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
USD614152S1 (en) * 2008-07-21 2010-04-20 Asm Genitech Korea, Ltd. Substrate transfer device for semiconductor deposition apparatus
USD665759S1 (en) * 2010-12-14 2012-08-21 Tokyo Electron Limited Substrate transfer holder
USD666979S1 (en) * 2010-12-14 2012-09-11 Tokyo Electron Limited Substrate holder
USD674365S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701329S1 (en) * 2012-02-17 2014-03-18 Applied Materials, Inc. Substrate support
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
USD811334S1 (en) * 2016-03-18 2018-02-27 Gogoro Inc. Connector
USD866469S1 (en) * 2015-11-23 2019-11-12 Microduino Inc. Electrical module

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD436609S1 (en) * 1999-11-30 2001-01-23 Applied Materials, Inc. Transfer chamber
USD441348S1 (en) * 1999-11-30 2001-05-01 Applied Materials, Inc. Process chamber lid
USD470457S1 (en) * 2001-12-12 2003-02-18 Reese Products, Inc. Support arm for transformer table
USD541217S1 (en) * 2005-12-21 2007-04-24 Johnson Electric S.A. Lamination for an electric motor
TW200811985A (en) 2006-08-30 2008-03-01 Asm Japan Kk Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
USD614152S1 (en) * 2008-07-21 2010-04-20 Asm Genitech Korea, Ltd. Substrate transfer device for semiconductor deposition apparatus
USD665759S1 (en) * 2010-12-14 2012-08-21 Tokyo Electron Limited Substrate transfer holder
USD666979S1 (en) * 2010-12-14 2012-09-11 Tokyo Electron Limited Substrate holder
USD674365S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701329S1 (en) * 2012-02-17 2014-03-18 Applied Materials, Inc. Substrate support
USD866469S1 (en) * 2015-11-23 2019-11-12 Microduino Inc. Electrical module
USD811334S1 (en) * 2016-03-18 2018-02-27 Gogoro Inc. Connector
USD811335S1 (en) * 2016-03-18 2018-02-27 Gogoro Inc. Connector
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
TWD211400S (en) 2021-05-11
JP1694395S (en) 2021-09-06

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