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USD929534S1 - Liquid discharge nozzle for semiconductor substrate processing apparatus - Google Patents

Liquid discharge nozzle for semiconductor substrate processing apparatus Download PDF

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Publication number
USD929534S1
USD929534S1 US29/710,426 US201929710426F USD929534S US D929534 S1 USD929534 S1 US D929534S1 US 201929710426 F US201929710426 F US 201929710426F US D929534 S USD929534 S US D929534S
Authority
US
United States
Prior art keywords
processing apparatus
semiconductor substrate
substrate processing
liquid discharge
discharge nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/710,426
Inventor
Yoshifumi Amano
Kazuhiro Aiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AIURA, KAZUHIRO, AMANO, YOSHIFUMI
Application granted granted Critical
Publication of USD929534S1 publication Critical patent/USD929534S1/en
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Description

FIG. 1 a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described herein.
US29/710,426 2019-04-25 2019-10-23 Liquid discharge nozzle for semiconductor substrate processing apparatus Active USD929534S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-9324F JP1646388S (en) 2019-04-25 2019-04-25
JP2019-009324 2019-04-25

Publications (1)

Publication Number Publication Date
USD929534S1 true USD929534S1 (en) 2021-08-31

Family

ID=68610921

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/710,426 Active USD929534S1 (en) 2019-04-25 2019-10-23 Liquid discharge nozzle for semiconductor substrate processing apparatus

Country Status (3)

Country Link
US (1) USD929534S1 (en)
JP (1) JP1646388S (en)
TW (1) TWD213830S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD960300S1 (en) * 2019-09-18 2022-08-09 P. Bekkers Holding B.V. Nozzle for fluid distribution

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD341418S (en) * 1991-02-22 1993-11-16 Tokyo Electron Limited Supply nozzle for applying liquid resist to a semiconductor wafer
USD636845S1 (en) * 2010-01-27 2011-04-26 Sintokogio, Ltd. Nozzle for an air blast process
USD637267S1 (en) * 2010-01-27 2011-05-03 Sintokogio, Ltd. Nozzle for an air blast process
USD823906S1 (en) * 2017-04-13 2018-07-24 Oerlikon Metco (Us) Inc. Powder injector
USD824966S1 (en) * 2016-10-14 2018-08-07 Oerlikon Metco (Us) Inc. Powder injector
USD903836S1 (en) * 2019-05-29 2020-12-01 Carefusion 303, Inc. Y-spigot body
USD906485S1 (en) * 2017-09-27 2020-12-29 Natural Gas Solutions North America, Llc Shaft seal
USD907744S1 (en) * 2018-08-01 2021-01-12 Lutz Pumpen Gmbh Dispenser nozzle

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD469790S1 (en) 2001-05-18 2003-02-04 Oy Trial Ab Nozzle
JP5638768B2 (en) 2009-04-24 2014-12-10 武蔵エンジニアリング株式会社 Nozzle rotation mechanism and coating apparatus having the same
USD774908S1 (en) 2014-04-10 2016-12-27 3M Innovative Properties Company Nozzle for syringe
USD771248S1 (en) 2014-10-01 2016-11-08 Adhezion Biomedical, Llc Dispensing applicator having a curved elongated nozzle
USD783784S1 (en) 2015-01-30 2017-04-11 Criser, S.A. De C.V. Nozzle for a drain hose

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD341418S (en) * 1991-02-22 1993-11-16 Tokyo Electron Limited Supply nozzle for applying liquid resist to a semiconductor wafer
USD636845S1 (en) * 2010-01-27 2011-04-26 Sintokogio, Ltd. Nozzle for an air blast process
USD637267S1 (en) * 2010-01-27 2011-05-03 Sintokogio, Ltd. Nozzle for an air blast process
USD824966S1 (en) * 2016-10-14 2018-08-07 Oerlikon Metco (Us) Inc. Powder injector
USD823906S1 (en) * 2017-04-13 2018-07-24 Oerlikon Metco (Us) Inc. Powder injector
USD906485S1 (en) * 2017-09-27 2020-12-29 Natural Gas Solutions North America, Llc Shaft seal
USD907744S1 (en) * 2018-08-01 2021-01-12 Lutz Pumpen Gmbh Dispenser nozzle
USD903836S1 (en) * 2019-05-29 2020-12-01 Carefusion 303, Inc. Y-spigot body

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Liquid Paste Filling Machine Filling Nozzle Head, Dec. 10, 2020, Amazon.com, May 5, 2021.URL: https://www.amazon.com/WINUS-Filling-Nozzle-1000ml-Machine/dp/B08G8KPF43 (Year: 2020). *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD960300S1 (en) * 2019-09-18 2022-08-09 P. Bekkers Holding B.V. Nozzle for fluid distribution

Also Published As

Publication number Publication date
TWD213830S (en) 2021-09-11
JP1646388S (en) 2021-11-15

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