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USD868013S1 - Cassette receiving tool for semiconductor manufacturing apparatus - Google Patents

Cassette receiving tool for semiconductor manufacturing apparatus Download PDF

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Publication number
USD868013S1
USD868013S1 US29/610,856 US201729610856F USD868013S US D868013 S1 USD868013 S1 US D868013S1 US 201729610856 F US201729610856 F US 201729610856F US D868013 S USD868013 S US D868013S
Authority
US
United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
cassette receiving
receiving tool
cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/610,856
Inventor
Tadayoshi Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KARASAWA, TADAYOSHI
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
Application granted granted Critical
Publication of USD868013S1 publication Critical patent/USD868013S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top, and left side perspective view of a cassette receiving tool for semiconductor manufacturing apparatus, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2; and,
FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 2.
The broken lines shown in the drawings represent portions of the cassette receiving tool for semiconductor manufacturing apparatus that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a cassette receiving tool for semiconductor manufacturing apparatus, as shown and described.
US29/610,856 2017-01-18 2017-07-17 Cassette receiving tool for semiconductor manufacturing apparatus Active USD868013S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-000730 2017-01-05
JPD2017-730F JP1584067S (en) 2017-01-18 2017-01-18

Publications (1)

Publication Number Publication Date
USD868013S1 true USD868013S1 (en) 2019-11-26

Family

ID=59593334

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/610,856 Active USD868013S1 (en) 2017-01-18 2017-07-17 Cassette receiving tool for semiconductor manufacturing apparatus

Country Status (3)

Country Link
US (1) USD868013S1 (en)
JP (1) JP1584067S (en)
TW (1) TWD191016S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5947677A (en) * 1996-11-20 1999-09-07 Tokyo Electron Limited Cassette transfer mechanism
US5947675A (en) * 1996-11-13 1999-09-07 Tokyo Electron Limited Cassette transfer mechanism
US6152680A (en) * 1997-08-26 2000-11-28 Daitron, Inc. Wafer cassette rotation mechanism
US6270307B1 (en) * 1999-01-25 2001-08-07 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
US6595841B2 (en) * 2001-12-20 2003-07-22 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for holding wafer cassettes in a cassette tub during a chemical mechanical polishing process
USD665759S1 (en) * 2010-12-14 2012-08-21 Tokyo Electron Limited Substrate transfer holder
USD674365S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
US8676375B2 (en) * 2012-02-27 2014-03-18 Veeco Instruments Inc. Automated cassette-to-cassette substrate handling system
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM418159U (en) 2011-07-01 2011-12-11 Qun-Jing Kong Improved stopper structure of window

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5947675A (en) * 1996-11-13 1999-09-07 Tokyo Electron Limited Cassette transfer mechanism
US5947677A (en) * 1996-11-20 1999-09-07 Tokyo Electron Limited Cassette transfer mechanism
US6152680A (en) * 1997-08-26 2000-11-28 Daitron, Inc. Wafer cassette rotation mechanism
US6270307B1 (en) * 1999-01-25 2001-08-07 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
US6595841B2 (en) * 2001-12-20 2003-07-22 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for holding wafer cassettes in a cassette tub during a chemical mechanical polishing process
USD665759S1 (en) * 2010-12-14 2012-08-21 Tokyo Electron Limited Substrate transfer holder
USD674365S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
US8676375B2 (en) * 2012-02-27 2014-03-18 Veeco Instruments Inc. Automated cassette-to-cassette substrate handling system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Also Published As

Publication number Publication date
TWD191016S (en) 2018-06-11
JP1584067S (en) 2017-08-21

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