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USD798250S1 - Heater - Google Patents

Heater Download PDF

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Publication number
USD798250S1
USD798250S1 US29/566,273 US201629566273F USD798250S US D798250 S1 USD798250 S1 US D798250S1 US 201629566273 F US201629566273 F US 201629566273F US D798250 S USD798250 S US D798250S
Authority
US
United States
Prior art keywords
heater
elevation view
view
ornamental design
side elevation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/566,273
Inventor
Hiroshi Furutani
Yuusuke Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuflare Technology Inc
Original Assignee
Nuflare Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nuflare Technology Inc filed Critical Nuflare Technology Inc
Assigned to NUFLARE TECHNOLOGY, INC. reassignment NUFLARE TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FURUTANI, HIROSHI, SATO, YUUSUKE
Application granted granted Critical
Publication of USD798250S1 publication Critical patent/USD798250S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top plan view of a heater showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a back elevation view thereof;
FIG. 5 is a left side elevation view thereof; and,
FIG. 6 is a right side elevation view thereof.
The broken lines in the drawings illustrate subject matter that forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heater, as shown and described.
US29/566,273 2015-12-01 2016-05-27 Heater Active USD798250S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-026892 2015-12-01
JPD2015-26892F JP1560719S (en) 2015-12-01 2015-12-01

Publications (1)

Publication Number Publication Date
USD798250S1 true USD798250S1 (en) 2017-09-26

Family

ID=57048113

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/566,273 Active USD798250S1 (en) 2015-12-01 2016-05-27 Heater

Country Status (2)

Country Link
US (1) USD798250S1 (en)
JP (1) JP1560719S (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
USD839221S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839223S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839222S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD841605S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD841606S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD842260S1 (en) * 2017-05-30 2019-03-05 TinyPCB, Inc. Modular circuit board
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD875057S1 (en) * 2017-05-26 2020-02-11 Tiny PCB, Inc. Modular circuit board
USD887358S1 (en) * 2018-12-06 2020-06-16 Lofelt Gmbh Motor membrane
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD959393S1 (en) * 2020-09-24 2022-08-02 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5540782A (en) * 1992-10-15 1996-07-30 Tokyo Electron Kabushiki Kaisha Heat treating apparatus having heat transmission-preventing plates
USD404016S (en) * 1997-01-31 1999-01-12 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD404375S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Heat retaining tube base for use in a semiconductor wafer head processing apparatus
USD405427S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD405428S (en) * 1997-01-31 1999-02-09 Tokyo Electron Ltd. Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
US6037574A (en) * 1997-11-06 2000-03-14 Watlow Electric Manufacturing Quartz substrate heater
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
US20020190051A1 (en) * 2001-06-15 2002-12-19 Applied Materials, Inc. Low profile thick film heaters in multi-slot bake chamber
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US6616767B2 (en) * 1997-02-12 2003-09-09 Applied Materials, Inc. High temperature ceramic heater assembly with RF capability
US20050217583A1 (en) * 2000-07-10 2005-10-06 Temptronic Corporation Wafer chuck having thermal plate with interleaved heating and cooling elements
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD604257S1 (en) * 2005-10-27 2009-11-17 Tokyo Electron Limited Heater for semiconductor manufacturing
US7645342B2 (en) * 2004-11-15 2010-01-12 Cree, Inc. Restricted radiated heating assembly for high temperature processing
USD614153S1 (en) * 2006-10-10 2010-04-20 Asm America, Inc. Reactant source vessel
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US8933375B2 (en) * 2012-06-27 2015-01-13 Asm Ip Holding B.V. Susceptor heater and method of heating a substrate
US8986456B2 (en) * 2006-10-10 2015-03-24 Asm America, Inc. Precursor delivery system

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5540782A (en) * 1992-10-15 1996-07-30 Tokyo Electron Kabushiki Kaisha Heat treating apparatus having heat transmission-preventing plates
USD404016S (en) * 1997-01-31 1999-01-12 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD405427S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD405428S (en) * 1997-01-31 1999-02-09 Tokyo Electron Ltd. Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
US6616767B2 (en) * 1997-02-12 2003-09-09 Applied Materials, Inc. High temperature ceramic heater assembly with RF capability
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
USD404375S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Heat retaining tube base for use in a semiconductor wafer head processing apparatus
US6037574A (en) * 1997-11-06 2000-03-14 Watlow Electric Manufacturing Quartz substrate heater
US20050217583A1 (en) * 2000-07-10 2005-10-06 Temptronic Corporation Wafer chuck having thermal plate with interleaved heating and cooling elements
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US20020190051A1 (en) * 2001-06-15 2002-12-19 Applied Materials, Inc. Low profile thick film heaters in multi-slot bake chamber
US7645342B2 (en) * 2004-11-15 2010-01-12 Cree, Inc. Restricted radiated heating assembly for high temperature processing
USD604257S1 (en) * 2005-10-27 2009-11-17 Tokyo Electron Limited Heater for semiconductor manufacturing
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD614153S1 (en) * 2006-10-10 2010-04-20 Asm America, Inc. Reactant source vessel
US8986456B2 (en) * 2006-10-10 2015-03-24 Asm America, Inc. Precursor delivery system
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US8933375B2 (en) * 2012-06-27 2015-01-13 Asm Ip Holding B.V. Susceptor heater and method of heating a substrate

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
USD875057S1 (en) * 2017-05-26 2020-02-11 Tiny PCB, Inc. Modular circuit board
USD842260S1 (en) * 2017-05-30 2019-03-05 TinyPCB, Inc. Modular circuit board
USD841605S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD841606S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD839222S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839223S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839221S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD887358S1 (en) * 2018-12-06 2020-06-16 Lofelt Gmbh Motor membrane
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD959393S1 (en) * 2020-09-24 2022-08-02 Kokusai Electric Corporation Ceiling heater for substrate processing apparatus

Also Published As

Publication number Publication date
JP1560719S (en) 2016-10-11

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