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USD769832S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD769832S1
USD769832S1 US29/461,551 US201329461551F USD769832S US D769832 S1 USD769832 S1 US D769832S1 US 201329461551 F US201329461551 F US 201329461551F US D769832 S USD769832 S US D769832S
Authority
US
United States
Prior art keywords
semiconductor device
design
lines
right perspective
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/461,551
Inventor
Hitoshi Domon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Assigned to SONY CORPORATION reassignment SONY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DOMON, HITOSHI
Priority to US29/577,913 priority Critical patent/USD839220S1/en
Application granted granted Critical
Publication of USD769832S1 publication Critical patent/USD769832S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

FIG. 1 is a front, top, right perspective view of a semiconductor device showing my new design;
FIG. 2 is a front, bottom, right perspective view thereof; and,
FIG. 3 is a front elevational view thereof.
FIG. 4 is an enlarged front, top, right perspective view taken along lines 4-4 in FIG. 1; and,
FIG. 5 is an enlarged front elevational view taken along lines 5-5 in FIG. 3.
The shaded surfaces areas on the semiconductor device define the claimed design. The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design. The dashed-dot-dashed lines form the boundary lines of the claimed design and form no part of the claimed design. All surfaces not shown form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/461,551 2013-02-19 2013-07-24 Semiconductor device Active USD769832S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/577,913 USD839220S1 (en) 2013-02-19 2016-09-16 Semiconductor device

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
JPD2013-003383 2013-02-19
JPD2013-003385 2013-02-19
JP2013003385 2013-02-19
JP2013003383 2013-02-19
JP2013003387 2013-02-19
JPD2013-003378 2013-02-19
JP2013003378 2013-02-19
JPD2013-003386 2013-02-19
JP2013003384 2013-02-19
JP2013003380 2013-02-19
JPD2013-003380 2013-02-19
JPD2013-003384 2013-02-19
JP2013003388 2013-02-19
JP2013003381 2013-02-19
JP2013003379 2013-02-19
JPD2013-003388 2013-02-19
JPD2013-003387 2013-02-19
JPD2013-003381 2013-02-19
JPD2013-003382 2013-02-19
JP2013003386 2013-02-19
JPD2013-003379 2013-02-19
JP2013003382 2013-02-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/577,913 Continuation USD839220S1 (en) 2013-02-19 2016-09-16 Semiconductor device

Publications (1)

Publication Number Publication Date
USD769832S1 true USD769832S1 (en) 2016-10-25

Family

ID=57136395

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/461,551 Active USD769832S1 (en) 2013-02-19 2013-07-24 Semiconductor device
US29/577,913 Active USD839220S1 (en) 2013-02-19 2016-09-16 Semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/577,913 Active USD839220S1 (en) 2013-02-19 2016-09-16 Semiconductor device

Country Status (1)

Country Link
US (2) USD769832S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD922970S1 (en) 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
US11244774B2 (en) * 2018-05-25 2022-02-08 Koa Corporation Resistor

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD856948S1 (en) * 2018-05-07 2019-08-20 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD933618S1 (en) 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
JP1665773S (en) * 2018-11-07 2020-08-11
JP1633578S (en) * 2018-11-07 2019-06-10
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card

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USD444953S1 (en) * 1997-10-31 2001-07-17 3M Innovative Properties Company Glittering cube-corner retroreflective sheeting
USD446946S1 (en) * 1997-10-31 2001-08-28 3M Innovative Properties Company Glittering retroreflective sheeting
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
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USD528658S1 (en) * 2004-02-06 2006-09-19 Mueller Sports Medicine, Inc. Pair of light absorbing strips
USD547371S1 (en) * 2005-10-22 2007-07-24 Karl Frederick Miller Reminder form
US20080049392A1 (en) * 2003-07-17 2008-02-28 Sandisk Corporation Peripheral card with hidden test pins
US20080132091A1 (en) * 2006-12-04 2008-06-05 Sung-Up Choi Memory card with improved communication speed and memory card system including the same
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USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD652809S1 (en) * 2007-01-19 2012-01-24 Imaging Systems Technology Electrode for a plasma shell
USD655256S1 (en) * 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
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USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD695552S1 (en) * 2012-07-31 2013-12-17 Tempur-Pedic Management, Llc Pillow
US20140057091A1 (en) * 2012-07-23 2014-02-27 Tesa Se Foamed adhesive tape for bonding to non-polar surfaces
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD718812S1 (en) * 2012-03-26 2014-12-02 Tuvshinjargal Sukhbaatar Adhesive tape having non-linear side edges
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD730911S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card

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USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4085314A (en) * 1976-02-09 1978-04-18 Minnesota Mining And Manufacturing Company Encodable retroreflective sheeting
US5237164A (en) * 1989-05-12 1993-08-17 Sony Corporation Card having retroreflective bar codes and a magnetic stripe
US5401910A (en) * 1992-12-03 1995-03-28 Murata Manufacturing Co. Ltd. Electronic component
US5994772A (en) * 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
USD444953S1 (en) * 1997-10-31 2001-07-17 3M Innovative Properties Company Glittering cube-corner retroreflective sheeting
USD446946S1 (en) * 1997-10-31 2001-08-28 3M Innovative Properties Company Glittering retroreflective sheeting
USD436947S1 (en) 1998-04-24 2001-01-30 Sony Corporation Pickup for an optical disc player or recorder
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
US20080049392A1 (en) * 2003-07-17 2008-02-28 Sandisk Corporation Peripheral card with hidden test pins
USD528658S1 (en) * 2004-02-06 2006-09-19 Mueller Sports Medicine, Inc. Pair of light absorbing strips
US20060097374A1 (en) * 2004-11-10 2006-05-11 Yoshimi Egawa Multi chip package
USD580553S1 (en) * 2005-05-19 2008-11-11 Nash Alan E Bandage
USD547371S1 (en) * 2005-10-22 2007-07-24 Karl Frederick Miller Reminder form
USD587907S1 (en) * 2006-08-02 2009-03-10 3M Innovative Properties Company Retroreflective article
USD594663S1 (en) * 2006-08-02 2009-06-23 3M Innovative Properties Company Retroreflective article
US20080132091A1 (en) * 2006-12-04 2008-06-05 Sung-Up Choi Memory card with improved communication speed and memory card system including the same
USD652809S1 (en) * 2007-01-19 2012-01-24 Imaging Systems Technology Electrode for a plasma shell
US20080305136A1 (en) * 2007-06-05 2008-12-11 Chih-Cheng Yang Disinfective adhesive tape
USD600284S1 (en) * 2009-03-26 2009-09-15 Plus Stationery Corp. Correction type tape with a security pattern
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD655256S1 (en) * 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD678227S1 (en) * 2011-03-07 2013-03-19 Ricoh Company, Ltd. Tag for removable part
USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD718812S1 (en) * 2012-03-26 2014-12-02 Tuvshinjargal Sukhbaatar Adhesive tape having non-linear side edges
US20140057091A1 (en) * 2012-07-23 2014-02-27 Tesa Se Foamed adhesive tape for bonding to non-polar surfaces
USD695552S1 (en) * 2012-07-31 2013-12-17 Tempur-Pedic Management, Llc Pillow
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD730911S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
US11244774B2 (en) * 2018-05-25 2022-02-08 Koa Corporation Resistor
USD922970S1 (en) 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device

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