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USD753739S1 - Wire bonding wedge tool - Google Patents

Wire bonding wedge tool Download PDF

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Publication number
USD753739S1
USD753739S1 US29/524,165 US201529524165F USD753739S US D753739 S1 USD753739 S1 US D753739S1 US 201529524165 F US201529524165 F US 201529524165F US D753739 S USD753739 S US D753739S
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US
United States
Prior art keywords
wire bonding
wedge tool
bonding wedge
tool
depicts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/524,165
Inventor
Russell Bell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek Inc
Original Assignee
Coorstek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coorstek Inc filed Critical Coorstek Inc
Priority to US29/524,165 priority Critical patent/USD753739S1/en
Assigned to COORSTEK, INC. reassignment COORSTEK, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BELL, RUSSELL
Priority to TW104305492F priority patent/TWD177555S/en
Priority to JPD2015-21935F priority patent/JP1545849S/ja
Application granted granted Critical
Publication of USD753739S1 publication Critical patent/USD753739S1/en
Assigned to WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COORSTEK, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 depicts a perspective view of a wire bonding wedge tool.
FIG. 2 depicts a second perspective view of the wire bonding wedge tool of FIG. 1, wherein FIG. 2 is rotated axially 90 degrees relative to FIG. 1.
FIG. 3 depicts a front side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 4 depicts a right side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 5 depicts a left side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 6 depicts a rear side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 7 depicts a top plan view of the wire bonding wedge tool of FIG. 6; and,
FIG. 8 depicts a bottom plan view of the wire bonding wedge tool of FIG. 6.
The broken lines in the figures depict portions of the wire bonding wedge tool that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a wire bonding wedge tool, as shown and described.
US29/524,165 2015-04-17 2015-04-17 Wire bonding wedge tool Active USD753739S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/524,165 USD753739S1 (en) 2015-04-17 2015-04-17 Wire bonding wedge tool
TW104305492F TWD177555S (en) 2015-04-17 2015-10-02 Portion of wire bonding wedge tool
JPD2015-21935F JP1545849S (en) 2015-04-17 2015-10-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/524,165 USD753739S1 (en) 2015-04-17 2015-04-17 Wire bonding wedge tool

Publications (1)

Publication Number Publication Date
USD753739S1 true USD753739S1 (en) 2016-04-12

Family

ID=55484619

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/524,165 Active USD753739S1 (en) 2015-04-17 2015-04-17 Wire bonding wedge tool

Country Status (3)

Country Link
US (1) USD753739S1 (en)
JP (1) JP1545849S (en)
TW (1) TWD177555S (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD771168S1 (en) * 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD779566S1 (en) * 2015-10-02 2017-02-21 Pearson Engineering Limited Plowing tine replacement section
USD797171S1 (en) * 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) * 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) * 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD815168S1 (en) * 2017-05-23 2018-04-10 Rpm Wood Finishes Group, Inc. Cartridge for heat pump dispenser
US20180361421A1 (en) * 2017-06-16 2018-12-20 Fenghua Weilder Electric Appliance Co., Ltd. Heating device for hot melt glue gun
USD855755S1 (en) 2016-10-22 2019-08-06 Master Spas, Inc. Filter
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
US11697945B2 (en) 2016-10-22 2023-07-11 Masterspas, Llc Filter assembly having an outer filter element and an inner filter element removably installed within the outer filter element

Citations (36)

* Cited by examiner, † Cited by third party
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US3690538A (en) * 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US4030657A (en) * 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
US4415115A (en) 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
USD271741S (en) * 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) * 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5683603A (en) * 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US5954260A (en) * 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
USD431434S (en) * 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
US6646228B2 (en) * 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD549255S1 (en) * 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method of same
USD598721S1 (en) * 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US8056794B2 (en) * 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
TW201412448A (en) 2012-09-26 2014-04-01 Toto Ltd Soldering iron tip
TW201429601A (en) 2013-01-25 2014-08-01 Toto Ltd Bonding capillary
TW201429600A (en) 2013-01-25 2014-08-01 Toto Ltd Solder pin

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3690538A (en) * 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US4030657A (en) * 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD271741S (en) * 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4415115A (en) 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) * 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5683603A (en) * 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US5954260A (en) * 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
USD431434S (en) * 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
US6646228B2 (en) * 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
USD549255S1 (en) * 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US8056794B2 (en) * 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method of same
USD598721S1 (en) * 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
TW201412448A (en) 2012-09-26 2014-04-01 Toto Ltd Soldering iron tip
TW201429601A (en) 2013-01-25 2014-08-01 Toto Ltd Bonding capillary
TW201429600A (en) 2013-01-25 2014-08-01 Toto Ltd Solder pin

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935.
Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731.
Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided).

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD771168S1 (en) * 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD824969S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) * 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) * 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD821468S1 (en) 2015-02-03 2018-06-26 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) * 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824970S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD779566S1 (en) * 2015-10-02 2017-02-21 Pearson Engineering Limited Plowing tine replacement section
USD880656S1 (en) 2016-10-22 2020-04-07 Master Spas, Inc. Inner filter element
US11697945B2 (en) 2016-10-22 2023-07-11 Masterspas, Llc Filter assembly having an outer filter element and an inner filter element removably installed within the outer filter element
USD916238S1 (en) 2016-10-22 2021-04-13 Masterspas, Llc Outer filter element
USD855755S1 (en) 2016-10-22 2019-08-06 Master Spas, Inc. Filter
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
USD815168S1 (en) * 2017-05-23 2018-04-10 Rpm Wood Finishes Group, Inc. Cartridge for heat pump dispenser
US20180361421A1 (en) * 2017-06-16 2018-12-20 Fenghua Weilder Electric Appliance Co., Ltd. Heating device for hot melt glue gun
US11813638B2 (en) * 2017-06-16 2023-11-14 Ningbo Weilder Electric Appliance Co., Ltd. Heating device for hot melt glue gun

Also Published As

Publication number Publication date
JP1545849S (en) 2016-03-14
TWD177555S (en) 2016-08-11

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