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USD700173S1 - Cover of an electronic device having surface ornamentation - Google Patents

Cover of an electronic device having surface ornamentation Download PDF

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Publication number
USD700173S1
USD700173S1 US29/418,365 US201229418365F USD700173S US D700173 S1 USD700173 S1 US D700173S1 US 201229418365 F US201229418365 F US 201229418365F US D700173 S USD700173 S US D700173S
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United States
Prior art keywords
cover
electronic device
surface ornamentation
ornamentation
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/418,365
Inventor
Bin Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FIH Hong Kong Ltd
Original Assignee
FIH Hong Kong Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FIH Hong Kong Ltd filed Critical FIH Hong Kong Ltd
Priority to US29/418,365 priority Critical patent/USD700173S1/en
Assigned to FIH (HONG KONG) LIMITED reassignment FIH (HONG KONG) LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, BIN
Application granted granted Critical
Publication of USD700173S1 publication Critical patent/USD700173S1/en
Active legal-status Critical Current
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The present application is related to co-pending U.S. patent applications Ser. Nos. 29/418,361, 29/418,363, 29/418,364, 29/418,368, 29/418,370, 29/418,371, 29/418,372, 29/418,373, 29/418,375, and 29/418,377, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a side elevational view thereof; and,
FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.
In FIG. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
US29/418,365 2012-04-16 2012-04-16 Cover of an electronic device having surface ornamentation Active USD700173S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/418,365 USD700173S1 (en) 2012-04-16 2012-04-16 Cover of an electronic device having surface ornamentation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/418,365 USD700173S1 (en) 2012-04-16 2012-04-16 Cover of an electronic device having surface ornamentation

Publications (1)

Publication Number Publication Date
USD700173S1 true USD700173S1 (en) 2014-02-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/418,365 Active USD700173S1 (en) 2012-04-16 2012-04-16 Cover of an electronic device having surface ornamentation

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US (1) USD700173S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD843736S1 (en) * 2017-09-25 2019-03-26 Sung Joo D&D, Inc. Fabric

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD843736S1 (en) * 2017-09-25 2019-03-26 Sung Joo D&D, Inc. Fabric

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