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USD685751S1 - Substrate for light emitting diode - Google Patents

Substrate for light emitting diode Download PDF

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Publication number
USD685751S1
USD685751S1 US29/427,324 US201229427324F USD685751S US D685751 S1 USD685751 S1 US D685751S1 US 201229427324 F US201229427324 F US 201229427324F US D685751 S USD685751 S US D685751S
Authority
US
United States
Prior art keywords
substrate
light emitting
emitting diode
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/427,324
Inventor
Chun-Te Wu
Chia-Tsen Huang
Hsiu-Ju Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Walsin Lihwa Corp
Original Assignee
Walsin Lihwa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walsin Lihwa Corp filed Critical Walsin Lihwa Corp
Assigned to WALSIN LIHWA CORPORATION reassignment WALSIN LIHWA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, HSIU-JU, HUANG, CHIA-TSEN, WU, CHUN-TE
Application granted granted Critical
Publication of USD685751S1 publication Critical patent/USD685751S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a substrate for the light emitting diode showing the claimed design;
FIG. 2 is an another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate for the light emitting diode, as shown and described herein.
US29/427,324 2012-03-14 2012-07-17 Substrate for light emitting diode Active USD685751S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101301382F TWD152515S (en) 2012-03-14 2012-03-14 Substrate for light emitting diode
TW101301382 2012-03-14

Publications (1)

Publication Number Publication Date
USD685751S1 true USD685751S1 (en) 2013-07-09

Family

ID=48701749

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/427,324 Active USD685751S1 (en) 2012-03-14 2012-07-17 Substrate for light emitting diode

Country Status (2)

Country Link
US (1) USD685751S1 (en)
TW (1) TWD152515S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD770988S1 (en) * 2015-02-06 2016-11-08 Seoul Viosys Co., Ltd. Light emitting diode
USD776629S1 (en) * 2015-02-06 2017-01-17 Seoul Viosys Co., Ltd. Light emitting diode
USD989011S1 (en) * 2021-01-26 2023-06-13 Citizen Electronics Co., Ltd. Light emitting diode

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050135105A1 (en) * 2003-12-19 2005-06-23 Lumileds Lighting U.S., Llc LED package assembly
US7030423B2 (en) * 2002-11-21 2006-04-18 Epistar Corporation Package structure for light emitting diode and method thereof
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US7335522B2 (en) * 2003-03-18 2008-02-26 Epistar Corporation Package structure for light emitting diode and method thereof
US7901993B2 (en) * 2008-03-25 2011-03-08 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
US7939375B2 (en) * 2008-03-25 2011-05-10 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
US20110121323A1 (en) * 2009-11-26 2011-05-26 Cheng Ju Wu Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity
US8030676B2 (en) * 2008-03-31 2011-10-04 Yuan Lin Substrate structrue for light-emitting diode
US20120037939A1 (en) * 2009-04-13 2012-02-16 Youji Urano Light emitting diode

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7030423B2 (en) * 2002-11-21 2006-04-18 Epistar Corporation Package structure for light emitting diode and method thereof
US7335522B2 (en) * 2003-03-18 2008-02-26 Epistar Corporation Package structure for light emitting diode and method thereof
US20050135105A1 (en) * 2003-12-19 2005-06-23 Lumileds Lighting U.S., Llc LED package assembly
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US7901993B2 (en) * 2008-03-25 2011-03-08 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
US7939375B2 (en) * 2008-03-25 2011-05-10 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
US8030676B2 (en) * 2008-03-31 2011-10-04 Yuan Lin Substrate structrue for light-emitting diode
US20120037939A1 (en) * 2009-04-13 2012-02-16 Youji Urano Light emitting diode
US20110121323A1 (en) * 2009-11-26 2011-05-26 Cheng Ju Wu Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD770988S1 (en) * 2015-02-06 2016-11-08 Seoul Viosys Co., Ltd. Light emitting diode
USD776629S1 (en) * 2015-02-06 2017-01-17 Seoul Viosys Co., Ltd. Light emitting diode
USD989011S1 (en) * 2021-01-26 2023-06-13 Citizen Electronics Co., Ltd. Light emitting diode

Also Published As

Publication number Publication date
TWD152515S (en) 2013-03-21

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