USD600219S1 - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- USD600219S1 USD600219S1 US29/267,898 US26789806F USD600219S US D600219 S1 USD600219 S1 US D600219S1 US 26789806 F US26789806 F US 26789806F US D600219 S USD600219 S US D600219S
- Authority
- US
- United States
- Prior art keywords
- view
- lead frame
- taken along
- lines
- enlarged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a lead frame, as shown and described.
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-018021 | 2006-01-26 | ||
JP2006-010833 | 2006-04-26 | ||
JP2006-010831 | 2006-04-26 | ||
JP2006010832 | 2006-04-26 | ||
JP2006-010830 | 2006-04-26 | ||
JP2006010831 | 2006-04-26 | ||
JP2006010830 | 2006-04-26 | ||
JP2006-010832 | 2006-04-26 | ||
JP2006010833 | 2006-04-26 | ||
JP2006018020 | 2006-07-07 | ||
JP2006-018020 | 2006-07-07 | ||
JP2006018021 | 2006-07-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD600219S1 true USD600219S1 (en) | 2009-09-15 |
Family
ID=41059233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/267,898 Expired - Lifetime USD600219S1 (en) | 2006-04-26 | 2006-10-24 | Lead frame |
Country Status (1)
Country | Link |
---|---|
US (1) | USD600219S1 (en) |
Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05291483A (en) | 1992-04-10 | 1993-11-05 | Toshiba Corp | Semiconductor device |
US5300815A (en) * | 1992-07-17 | 1994-04-05 | Lsi Logic Corporation | Technique of increasing bond pad density on a semiconductor die |
JPH0685145B2 (en) | 1990-11-28 | 1994-10-26 | インターナショナル・ビジネス・マシーンズ・コーポレイション | How to display the position of multiple selected objects |
JPH07307428A (en) | 1994-05-11 | 1995-11-21 | Toppan Printing Co Ltd | Lead frame |
JPH09283690A (en) | 1996-04-08 | 1997-10-31 | Murata Mfg Co Ltd | Lead frame for semiconductor integrated circuit |
US5905639A (en) * | 1997-09-29 | 1999-05-18 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
US5925935A (en) * | 1996-10-01 | 1999-07-20 | Samsung Electronics Co., Ltd. | Semiconductor chip with shaped bonding pads |
US6400004B1 (en) * | 2000-08-17 | 2002-06-04 | Advanced Semiconductor Engineering, Inc. | Leadless semiconductor package |
US20020079560A1 (en) * | 2000-12-18 | 2002-06-27 | Georg Ernst | Method of producing an integrated circuit and an integrated circuit |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
US6777800B2 (en) * | 2002-09-30 | 2004-08-17 | Fairchild Semiconductor Corporation | Semiconductor die package including drain clip |
US6809409B2 (en) * | 2001-12-27 | 2004-10-26 | Mitsui High-Tec, Inc. | Lead frame and semiconductor device made using the lead frame |
US6940301B2 (en) * | 2003-12-12 | 2005-09-06 | Au Optronics Corporation | Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel |
US6958532B1 (en) * | 1999-06-18 | 2005-10-25 | Nec Electronics Corporation | Semiconductor storage device |
US20060105501A1 (en) * | 2004-05-05 | 2006-05-18 | Asm Technology Singapore Pte Ltd. | Electronic device with high lead density |
US7067904B2 (en) * | 2003-10-31 | 2006-06-27 | Advanced Semiconductor Engineering, Inc. | Flip-chip type quad flat package and leadframe |
US20070029647A1 (en) * | 2005-08-02 | 2007-02-08 | U.S. Monolithics, L.L.C. | Radio frequency over-molded leadframe package |
US7199478B2 (en) * | 2001-07-11 | 2007-04-03 | Samsung Electronics Co., Ltd. | Printed circuit board having an improved land structure |
USD540273S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
US7211879B1 (en) * | 2003-11-12 | 2007-05-01 | Amkor Technology, Inc. | Semiconductor package with chamfered corners and method of manufacturing the same |
US20070099349A1 (en) * | 2002-07-29 | 2007-05-03 | Yamaha Corporation | Manufacturing method for magnetic sensor and lead frame therefor |
US20070126093A1 (en) * | 2005-12-06 | 2007-06-07 | Subtron Technology Co., Ltd. | High thermal conducting circuit substrate and manufacturing process thereof |
US20070132077A1 (en) * | 2005-12-08 | 2007-06-14 | Choi Seung-Yong | Flip chip MLP with conductive ink |
US7256482B2 (en) * | 2004-08-12 | 2007-08-14 | Texas Instruments Incorporated | Integrated circuit chip packaging assembly |
US7265804B2 (en) * | 2003-10-16 | 2007-09-04 | Au Optronics Corp. | Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix |
US20070281392A1 (en) * | 2006-06-05 | 2007-12-06 | Carsem (M) Sdn. Bhd. | Multiple row exposed leads for mlp high density packages |
-
2006
- 2006-10-24 US US29/267,898 patent/USD600219S1/en not_active Expired - Lifetime
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685145B2 (en) | 1990-11-28 | 1994-10-26 | インターナショナル・ビジネス・マシーンズ・コーポレイション | How to display the position of multiple selected objects |
JPH05291483A (en) | 1992-04-10 | 1993-11-05 | Toshiba Corp | Semiconductor device |
US5300815A (en) * | 1992-07-17 | 1994-04-05 | Lsi Logic Corporation | Technique of increasing bond pad density on a semiconductor die |
JPH07307428A (en) | 1994-05-11 | 1995-11-21 | Toppan Printing Co Ltd | Lead frame |
JPH09283690A (en) | 1996-04-08 | 1997-10-31 | Murata Mfg Co Ltd | Lead frame for semiconductor integrated circuit |
US5925935A (en) * | 1996-10-01 | 1999-07-20 | Samsung Electronics Co., Ltd. | Semiconductor chip with shaped bonding pads |
US5905639A (en) * | 1997-09-29 | 1999-05-18 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
US6958532B1 (en) * | 1999-06-18 | 2005-10-25 | Nec Electronics Corporation | Semiconductor storage device |
US6400004B1 (en) * | 2000-08-17 | 2002-06-04 | Advanced Semiconductor Engineering, Inc. | Leadless semiconductor package |
US20020079560A1 (en) * | 2000-12-18 | 2002-06-27 | Georg Ernst | Method of producing an integrated circuit and an integrated circuit |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD471167S1 (en) * | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
US7199478B2 (en) * | 2001-07-11 | 2007-04-03 | Samsung Electronics Co., Ltd. | Printed circuit board having an improved land structure |
US6809409B2 (en) * | 2001-12-27 | 2004-10-26 | Mitsui High-Tec, Inc. | Lead frame and semiconductor device made using the lead frame |
US20070099349A1 (en) * | 2002-07-29 | 2007-05-03 | Yamaha Corporation | Manufacturing method for magnetic sensor and lead frame therefor |
US6777800B2 (en) * | 2002-09-30 | 2004-08-17 | Fairchild Semiconductor Corporation | Semiconductor die package including drain clip |
US7265804B2 (en) * | 2003-10-16 | 2007-09-04 | Au Optronics Corp. | Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix |
US7067904B2 (en) * | 2003-10-31 | 2006-06-27 | Advanced Semiconductor Engineering, Inc. | Flip-chip type quad flat package and leadframe |
US7211879B1 (en) * | 2003-11-12 | 2007-05-01 | Amkor Technology, Inc. | Semiconductor package with chamfered corners and method of manufacturing the same |
US6940301B2 (en) * | 2003-12-12 | 2005-09-06 | Au Optronics Corporation | Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel |
US20060105501A1 (en) * | 2004-05-05 | 2006-05-18 | Asm Technology Singapore Pte Ltd. | Electronic device with high lead density |
US7256482B2 (en) * | 2004-08-12 | 2007-08-14 | Texas Instruments Incorporated | Integrated circuit chip packaging assembly |
USD540273S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
US20070029647A1 (en) * | 2005-08-02 | 2007-02-08 | U.S. Monolithics, L.L.C. | Radio frequency over-molded leadframe package |
US20070126093A1 (en) * | 2005-12-06 | 2007-06-07 | Subtron Technology Co., Ltd. | High thermal conducting circuit substrate and manufacturing process thereof |
US20070132077A1 (en) * | 2005-12-08 | 2007-06-14 | Choi Seung-Yong | Flip chip MLP with conductive ink |
US20070281392A1 (en) * | 2006-06-05 | 2007-12-06 | Carsem (M) Sdn. Bhd. | Multiple row exposed leads for mlp high density packages |
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