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USD600219S1 - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
USD600219S1
USD600219S1 US29/267,898 US26789806F USD600219S US D600219 S1 USD600219 S1 US D600219S1 US 26789806 F US26789806 F US 26789806F US D600219 S USD600219 S US D600219S
Authority
US
United States
Prior art keywords
view
lead frame
taken along
lines
enlarged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/267,898
Inventor
Akira Oga
Shuichi Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuvoton Technology Corp Japan
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OGA, AKIRA, OGATA, SHUICHI
Assigned to PANASONIC CORPORATION reassignment PANASONIC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Application granted granted Critical
Publication of USD600219S1 publication Critical patent/USD600219S1/en
Assigned to PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. reassignment PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PANASONIC CORPORATION
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of a first embodiment of a lead frame of the present invention;
FIG. 2 is a rear view thereof;
FIG. 3 is a first side view thereof with the opposite side being a mirror image thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a cross-section view taken along the line 66 of FIG. 1;
FIG. 7 is a cross-section view taken along the line 77 of FIG. 1;
FIG. 8 is an enlarged second side view thereof taken along the lines 8 of FIG. 43;
FIG. 9 is an enlarged top view thereof taken along the lines 99 of FIG. 4;
FIG. 10 is an enlarged bottom view thereof taken along the lines 1010 of FIG. 5;
FIG. 11 is a front view of a second embodiment of a lead frame of the present invention;
FIG. 12 is a rear view thereof;
FIG. 13 is a first side view thereof with the opposite side being a mirror image thereof;
FIG. 14 is a top view thereof;
FIG. 15 is a bottom view thereof;
FIG. 16 is a cross-section view taken along the line 1616 of FIG. 11;
FIG. 17 is a cross-section view taken along the line 1919 of FIG. 11;
FIG. 18 is an enlarged second side view thereof taken along the lines 1818 of FIG. 13;
FIG. 19 is an enlarged top view thereof taken along the lines 1919 of FIG. 14;
FIG. 20 is an enlarged bottom view thereof taken along the lines 2020 of FIG. 15;
FIG. 21 is a front view of a third embodiment of a lead frame of the present invention;
FIG. 22 is a rear view thereof;
FIG. 23 is a first side view thereof with the opposite side being a mirror image thereof;
FIG. 24 is a top view thereof;
FIG. 25 is a bottom view thereof;
FIG. 26 is a cross-section view taken along the line 2626 of FIG. 21;
FIG. 27 is a cross-section view taken along the line 2727 of FIG. 21;
FIG. 28 is an enlarged second side view thereof taken along the lines 2828 of FIG. 23;
FIG. 29 is an enlarged top view thereof taken along the lines 2929 of FIG. 24;
FIG. 30 is an enlarged bottom view thereof taken along the lines 3030 of FIG. 25;
FIG. 31 is a front view of a fourth embodiment of a lead frame of the present invention;
FIG. 32 is a rear view thereof;
FIG. 33 is a first side view thereof with the opposite side being a mirror image thereof;
FIG. 34 is a top view thereof;
FIG. 35 is a bottom view thereof;
FIG. 36 is a cross-section view taken along the line 3636 of FIG. 31;
FIG. 37 is a cross-section view taken along the line 3737 of FIG. 31;
FIG. 38 is an enlarged second side view thereof taken along the lines 4242 of FIG. 33;
FIG. 39 is an enlarged top view thereof taken along the lines 3939 of FIG. 34; and,
FIG. 40 is an enlarged bottom view thereof taken along the lines 4444 of of FIG. 35.
The ornamental design which is claimed is shown in solid lines in the drawings. Any broken lines in the drawings are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lead frame, as shown and described.
US29/267,898 2006-04-26 2006-10-24 Lead frame Expired - Lifetime USD600219S1 (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2006-018021 2006-01-26
JP2006-010833 2006-04-26
JP2006-010831 2006-04-26
JP2006010832 2006-04-26
JP2006-010830 2006-04-26
JP2006010831 2006-04-26
JP2006010830 2006-04-26
JP2006-010832 2006-04-26
JP2006010833 2006-04-26
JP2006018020 2006-07-07
JP2006-018020 2006-07-07
JP2006018021 2006-07-07

Publications (1)

Publication Number Publication Date
USD600219S1 true USD600219S1 (en) 2009-09-15

Family

ID=41059233

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/267,898 Expired - Lifetime USD600219S1 (en) 2006-04-26 2006-10-24 Lead frame

Country Status (1)

Country Link
US (1) USD600219S1 (en)

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291483A (en) 1992-04-10 1993-11-05 Toshiba Corp Semiconductor device
US5300815A (en) * 1992-07-17 1994-04-05 Lsi Logic Corporation Technique of increasing bond pad density on a semiconductor die
JPH0685145B2 (en) 1990-11-28 1994-10-26 インターナショナル・ビジネス・マシーンズ・コーポレイション How to display the position of multiple selected objects
JPH07307428A (en) 1994-05-11 1995-11-21 Toppan Printing Co Ltd Lead frame
JPH09283690A (en) 1996-04-08 1997-10-31 Murata Mfg Co Ltd Lead frame for semiconductor integrated circuit
US5905639A (en) * 1997-09-29 1999-05-18 Raytheon Company Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
US5925935A (en) * 1996-10-01 1999-07-20 Samsung Electronics Co., Ltd. Semiconductor chip with shaped bonding pads
US6400004B1 (en) * 2000-08-17 2002-06-04 Advanced Semiconductor Engineering, Inc. Leadless semiconductor package
US20020079560A1 (en) * 2000-12-18 2002-06-27 Georg Ernst Method of producing an integrated circuit and an integrated circuit
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
US6777800B2 (en) * 2002-09-30 2004-08-17 Fairchild Semiconductor Corporation Semiconductor die package including drain clip
US6809409B2 (en) * 2001-12-27 2004-10-26 Mitsui High-Tec, Inc. Lead frame and semiconductor device made using the lead frame
US6940301B2 (en) * 2003-12-12 2005-09-06 Au Optronics Corporation Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel
US6958532B1 (en) * 1999-06-18 2005-10-25 Nec Electronics Corporation Semiconductor storage device
US20060105501A1 (en) * 2004-05-05 2006-05-18 Asm Technology Singapore Pte Ltd. Electronic device with high lead density
US7067904B2 (en) * 2003-10-31 2006-06-27 Advanced Semiconductor Engineering, Inc. Flip-chip type quad flat package and leadframe
US20070029647A1 (en) * 2005-08-02 2007-02-08 U.S. Monolithics, L.L.C. Radio frequency over-molded leadframe package
US7199478B2 (en) * 2001-07-11 2007-04-03 Samsung Electronics Co., Ltd. Printed circuit board having an improved land structure
USD540273S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
US7211879B1 (en) * 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US20070099349A1 (en) * 2002-07-29 2007-05-03 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
US20070126093A1 (en) * 2005-12-06 2007-06-07 Subtron Technology Co., Ltd. High thermal conducting circuit substrate and manufacturing process thereof
US20070132077A1 (en) * 2005-12-08 2007-06-14 Choi Seung-Yong Flip chip MLP with conductive ink
US7256482B2 (en) * 2004-08-12 2007-08-14 Texas Instruments Incorporated Integrated circuit chip packaging assembly
US7265804B2 (en) * 2003-10-16 2007-09-04 Au Optronics Corp. Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix
US20070281392A1 (en) * 2006-06-05 2007-12-06 Carsem (M) Sdn. Bhd. Multiple row exposed leads for mlp high density packages

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685145B2 (en) 1990-11-28 1994-10-26 インターナショナル・ビジネス・マシーンズ・コーポレイション How to display the position of multiple selected objects
JPH05291483A (en) 1992-04-10 1993-11-05 Toshiba Corp Semiconductor device
US5300815A (en) * 1992-07-17 1994-04-05 Lsi Logic Corporation Technique of increasing bond pad density on a semiconductor die
JPH07307428A (en) 1994-05-11 1995-11-21 Toppan Printing Co Ltd Lead frame
JPH09283690A (en) 1996-04-08 1997-10-31 Murata Mfg Co Ltd Lead frame for semiconductor integrated circuit
US5925935A (en) * 1996-10-01 1999-07-20 Samsung Electronics Co., Ltd. Semiconductor chip with shaped bonding pads
US5905639A (en) * 1997-09-29 1999-05-18 Raytheon Company Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
US6958532B1 (en) * 1999-06-18 2005-10-25 Nec Electronics Corporation Semiconductor storage device
US6400004B1 (en) * 2000-08-17 2002-06-04 Advanced Semiconductor Engineering, Inc. Leadless semiconductor package
US20020079560A1 (en) * 2000-12-18 2002-06-27 Georg Ernst Method of producing an integrated circuit and an integrated circuit
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
US7199478B2 (en) * 2001-07-11 2007-04-03 Samsung Electronics Co., Ltd. Printed circuit board having an improved land structure
US6809409B2 (en) * 2001-12-27 2004-10-26 Mitsui High-Tec, Inc. Lead frame and semiconductor device made using the lead frame
US20070099349A1 (en) * 2002-07-29 2007-05-03 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
US6777800B2 (en) * 2002-09-30 2004-08-17 Fairchild Semiconductor Corporation Semiconductor die package including drain clip
US7265804B2 (en) * 2003-10-16 2007-09-04 Au Optronics Corp. Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix
US7067904B2 (en) * 2003-10-31 2006-06-27 Advanced Semiconductor Engineering, Inc. Flip-chip type quad flat package and leadframe
US7211879B1 (en) * 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US6940301B2 (en) * 2003-12-12 2005-09-06 Au Optronics Corporation Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel
US20060105501A1 (en) * 2004-05-05 2006-05-18 Asm Technology Singapore Pte Ltd. Electronic device with high lead density
US7256482B2 (en) * 2004-08-12 2007-08-14 Texas Instruments Incorporated Integrated circuit chip packaging assembly
USD540273S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
US20070029647A1 (en) * 2005-08-02 2007-02-08 U.S. Monolithics, L.L.C. Radio frequency over-molded leadframe package
US20070126093A1 (en) * 2005-12-06 2007-06-07 Subtron Technology Co., Ltd. High thermal conducting circuit substrate and manufacturing process thereof
US20070132077A1 (en) * 2005-12-08 2007-06-14 Choi Seung-Yong Flip chip MLP with conductive ink
US20070281392A1 (en) * 2006-06-05 2007-12-06 Carsem (M) Sdn. Bhd. Multiple row exposed leads for mlp high density packages

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