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USD588080S1 - 2021-8J matrix leadframe - Google Patents

2021-8J matrix leadframe Download PDF

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Publication number
USD588080S1
USD588080S1 US29/292,066 US29206607F USD588080S US D588080 S1 USD588080 S1 US D588080S1 US 29206607 F US29206607 F US 29206607F US D588080 S USD588080 S US D588080S
Authority
US
United States
Prior art keywords
matrix
matrix leadframe
leadframe
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/292,066
Inventor
James Harnden
Anthony Chia
Hongbo Yang
Teng Hui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/292,066 priority Critical patent/USD588080S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAMDEN, JAMES, CHIA, ANTHONY, TENG, Hui, YANG, HONGBO
Application granted granted Critical
Publication of USD588080S1 publication Critical patent/USD588080S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of 2021-8J matrix leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the 2021-8J matrix leadframe shown in FIG. 1 for ease of illustration; and,
FIG. 3 is a perspective view of FIG. 1.

Claims (1)

  1. The ornamental design for 2021-8J matrix leadframe, as shown and described.
US29/292,066 2007-09-26 2007-09-26 2021-8J matrix leadframe Expired - Lifetime USD588080S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/292,066 USD588080S1 (en) 2007-09-26 2007-09-26 2021-8J matrix leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/292,066 USD588080S1 (en) 2007-09-26 2007-09-26 2021-8J matrix leadframe

Publications (1)

Publication Number Publication Date
USD588080S1 true USD588080S1 (en) 2009-03-10

Family

ID=40417371

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/292,066 Expired - Lifetime USD588080S1 (en) 2007-09-26 2007-09-26 2021-8J matrix leadframe

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US (1) USD588080S1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130292811A1 (en) * 2012-05-02 2013-11-07 Texas Instruments Incorporated Leadframe having selective planishing
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9006038B2 (en) * 2012-05-02 2015-04-14 Texas Instruments Incorporated Selective leadframe planishing
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
US8963300B2 (en) 2012-05-02 2015-02-24 Texas Instruments Incorporation Semiconductor device with selective planished leadframe
US20130292811A1 (en) * 2012-05-02 2013-11-07 Texas Instruments Incorporated Leadframe having selective planishing
US20150221526A1 (en) * 2012-05-02 2015-08-06 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
US9972506B2 (en) * 2012-05-02 2018-05-15 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
US10438816B2 (en) 2012-05-02 2019-10-08 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

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