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USD580376S1 - Lead frame for a four-pin light-emitting diode device - Google Patents

Lead frame for a four-pin light-emitting diode device Download PDF

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Publication number
USD580376S1
USD580376S1 US29/249,576 US24957606F USD580376S US D580376 S1 USD580376 S1 US D580376S1 US 24957606 F US24957606 F US 24957606F US D580376 S USD580376 S US D580376S
Authority
US
United States
Prior art keywords
emitting diode
lead frame
diode device
pin light
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/249,576
Inventor
Jui-Kang Yen
Yung-Wei Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semi Photonics Co Ltd
Original Assignee
Semi Photonics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semi Photonics Co Ltd filed Critical Semi Photonics Co Ltd
Priority to US29/249,576 priority Critical patent/USD580376S1/en
Priority to TW096301978F priority patent/TWD122073S/en
Assigned to SEMI-PHOTONICS CO., LTD. reassignment SEMI-PHOTONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, YUNG-WEI, YEN, JUI-KANG
Application granted granted Critical
Publication of USD580376S1 publication Critical patent/USD580376S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the lead frame for a four-pin light emitting diode device showing our new design.
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevation view thereof; and,
FIG. 7 is a right side elevation view thereof.
It will be understood that the dashed lines presented in the drawings represent optional features, some of which are described and represented in the different embodiments illustrated in the accompanying figures.

Claims (1)

    CLAIM
  1. The ornamental design for a lead frame for a four-pin light emitting diode device, as shown.
US29/249,576 2006-10-12 2006-10-12 Lead frame for a four-pin light-emitting diode device Expired - Lifetime USD580376S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/249,576 USD580376S1 (en) 2006-10-12 2006-10-12 Lead frame for a four-pin light-emitting diode device
TW096301978F TWD122073S (en) 2006-10-12 2007-04-11 Four pins light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/249,576 USD580376S1 (en) 2006-10-12 2006-10-12 Lead frame for a four-pin light-emitting diode device

Publications (1)

Publication Number Publication Date
USD580376S1 true USD580376S1 (en) 2008-11-11

Family

ID=39941186

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/249,576 Expired - Lifetime USD580376S1 (en) 2006-10-12 2006-10-12 Lead frame for a four-pin light-emitting diode device

Country Status (2)

Country Link
US (1) USD580376S1 (en)
TW (1) TWD122073S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD690276S1 (en) * 2012-10-03 2013-09-24 Hewlett-Packard Development Company, L.P. Electromagnetic interference shield

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
US6559379B2 (en) * 1995-02-24 2003-05-06 Novasensor, Inc. Pressure sensor with transducer mounted on a metal base
US6569764B1 (en) * 1999-08-25 2003-05-27 Hitachi, Ltd. Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
US20030116769A1 (en) * 2001-12-24 2003-06-26 Samsung Electro-Mechanics Co., Ltd. Light emission diode package
US6891256B2 (en) * 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US6919625B2 (en) * 2003-07-10 2005-07-19 General Semiconductor, Inc. Surface mount multichip devices
US6943433B2 (en) * 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
USD520965S1 (en) * 2003-01-10 2006-05-16 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
USD532383S1 (en) * 2005-06-08 2006-11-21 Matsushita Electric Industrial Co., Ltd. Light emitting diode module
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US7211882B2 (en) * 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6559379B2 (en) * 1995-02-24 2003-05-06 Novasensor, Inc. Pressure sensor with transducer mounted on a metal base
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
US6569764B1 (en) * 1999-08-25 2003-05-27 Hitachi, Ltd. Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
US6891256B2 (en) * 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US20050127483A1 (en) * 2001-10-22 2005-06-16 Rajeev Joshi Thin, thermally enhanced flip chip in a leaded molded package
US20030116769A1 (en) * 2001-12-24 2003-06-26 Samsung Electro-Mechanics Co., Ltd. Light emission diode package
US6943433B2 (en) * 2002-03-06 2005-09-13 Nichia Corporation Semiconductor device and manufacturing method for same
USD520965S1 (en) * 2003-01-10 2006-05-16 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
US6919625B2 (en) * 2003-07-10 2005-07-19 General Semiconductor, Inc. Surface mount multichip devices
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US7211882B2 (en) * 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
USD532383S1 (en) * 2005-06-08 2006-11-21 Matsushita Electric Industrial Co., Ltd. Light emitting diode module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD690276S1 (en) * 2012-10-03 2013-09-24 Hewlett-Packard Development Company, L.P. Electromagnetic interference shield

Also Published As

Publication number Publication date
TWD122073S (en) 2008-03-21

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