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USD571315S1 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
USD571315S1
USD571315S1 US29/261,775 US26177506F USD571315S US D571315 S1 USD571315 S1 US D571315S1 US 26177506 F US26177506 F US 26177506F US D571315 S USD571315 S US D571315S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
design
forming
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/261,775
Inventor
Su Lin Oon
Eng Chuan Ong
Klan Shin Lee
Meng Ee Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies ECBU IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies ECBU IP Singapore Pte Ltd filed Critical Avago Technologies ECBU IP Singapore Pte Ltd
Priority to US29/261,775 priority Critical patent/USD571315S1/en
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, KIAN SHIN, LEE, MENG EE, ONG, ENG CHUAN, OON, SU LIN
Assigned to AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Application granted granted Critical
Publication of USD571315S1 publication Critical patent/USD571315S1/en
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the front, top, and left side of a light emitting diode showing the new design, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design.
FIG. 2 is a perspective view of the bottom and right side of the light emitting diode shown in FIG. 1, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design.
FIG. 3 is a bottom view of the light emitting diode shown in FIG. 1, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design.
FIG. 4 is a top view of the light emitting diode shown in FIG. 1, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design.
FIG. 5 is view of the backside of the light emitting diode shown in FIG. 1, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design.
FIG. 6 is view of the right side of the light emitting diode shown in FIG. 1, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design.
FIG. 7 is view of the front side of the light emitting diode shown in FIG. 1, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design; and,
FIG. 8 is view of the left side of the light emitting diode shown in FIG. 1, the features shown in broken lines being for illustrative purpose only and forming no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode, as shown and described.
US29/261,775 2006-06-19 2006-06-19 Light emitting diode Expired - Lifetime USD571315S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/261,775 USD571315S1 (en) 2006-06-19 2006-06-19 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/261,775 USD571315S1 (en) 2006-06-19 2006-06-19 Light emitting diode

Publications (1)

Publication Number Publication Date
USD571315S1 true USD571315S1 (en) 2008-06-17

Family

ID=39510793

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/261,775 Expired - Lifetime USD571315S1 (en) 2006-06-19 2006-06-19 Light emitting diode

Country Status (1)

Country Link
US (1) USD571315S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD580379S1 (en) * 2007-06-14 2008-11-11 Panasonic Corporation Light source of light emitting diode
USD581885S1 (en) * 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
USD622899S1 (en) * 2010-01-05 2010-08-31 Foxconn Technology Co., Ltd. LED lens
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD764097S1 (en) 2012-05-03 2016-08-16 Lumenpulse Lighting, Inc. Shroud for LED (light emitting diode) projection fixture

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5951152A (en) 1997-06-17 1999-09-14 Lumex, Inc. Light source housing apparatus and method of manufacture
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
USD491899S1 (en) 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
USD494550S1 (en) 2003-08-26 2004-08-17 Nichia Corporation Light emitting diode
USD495304S1 (en) 2003-11-10 2004-08-31 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20040201987A1 (en) * 2003-04-09 2004-10-14 Citizen Electronics Co., Ltd. LED lamp
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD505396S1 (en) 2003-03-03 2005-05-24 Nichia Corporation Light emitting diode
US20050127816A1 (en) 2003-12-16 2005-06-16 Naofumi Sumitani Light emitting device and method of manufacturing the same
USD510912S1 (en) * 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
USD512029S1 (en) 2004-06-28 2005-11-29 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD517025S1 (en) * 2003-03-17 2006-03-14 Nichia Corporation Light emitting diode
USD520965S1 (en) * 2003-01-10 2006-05-16 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
US20060102917A1 (en) * 2002-06-19 2006-05-18 Toshihiko Oyama Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
USD522468S1 (en) 2004-12-27 2006-06-06 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
USD528515S1 (en) 2003-09-09 2006-09-19 Nichia Corporation Light emitting diode
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
US20070029569A1 (en) * 2005-08-04 2007-02-08 Peter Andrews Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5951152A (en) 1997-06-17 1999-09-14 Lumex, Inc. Light source housing apparatus and method of manufacture
USD491899S1 (en) 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
US20060102917A1 (en) * 2002-06-19 2006-05-18 Toshihiko Oyama Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
USD520965S1 (en) * 2003-01-10 2006-05-16 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
USD505396S1 (en) 2003-03-03 2005-05-24 Nichia Corporation Light emitting diode
USD517025S1 (en) * 2003-03-17 2006-03-14 Nichia Corporation Light emitting diode
US20040201987A1 (en) * 2003-04-09 2004-10-14 Citizen Electronics Co., Ltd. LED lamp
USD494550S1 (en) 2003-08-26 2004-08-17 Nichia Corporation Light emitting diode
USD528515S1 (en) 2003-09-09 2006-09-19 Nichia Corporation Light emitting diode
US20050051789A1 (en) * 2003-09-09 2005-03-10 Negley Gerald H. Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD510912S1 (en) * 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD495304S1 (en) 2003-11-10 2004-08-31 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20050127816A1 (en) 2003-12-16 2005-06-16 Naofumi Sumitani Light emitting device and method of manufacturing the same
USD512029S1 (en) 2004-06-28 2005-11-29 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD522468S1 (en) 2004-12-27 2006-06-06 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
USD528997S1 (en) * 2005-03-13 2006-09-26 Seoul Semiconductor Co. Ltd. Light emitting diode (LED)
US20070029569A1 (en) * 2005-08-04 2007-02-08 Peter Andrews Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD580379S1 (en) * 2007-06-14 2008-11-11 Panasonic Corporation Light source of light emitting diode
USD581885S1 (en) * 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
USD597502S1 (en) 2007-06-14 2009-08-04 Panasonic Corporation Light source of light emitting diode
USD622899S1 (en) * 2010-01-05 2010-08-31 Foxconn Technology Co., Ltd. LED lens
USD764097S1 (en) 2012-05-03 2016-08-16 Lumenpulse Lighting, Inc. Shroud for LED (light emitting diode) projection fixture
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode

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