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USD570795S1 - Mini blower heat sink module - Google Patents

Mini blower heat sink module Download PDF

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Publication number
USD570795S1
USD570795S1 US29/274,496 US27449607F USD570795S US D570795 S1 USD570795 S1 US D570795S1 US 27449607 F US27449607 F US 27449607F US D570795 S USD570795 S US D570795S
Authority
US
United States
Prior art keywords
heat sink
sink module
blower heat
mini blower
mini
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/274,496
Inventor
Alex Horng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunonwealth Electric Machine Industry Co Ltd
Original Assignee
Sunonwealth Electric Machine Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunonwealth Electric Machine Industry Co Ltd filed Critical Sunonwealth Electric Machine Industry Co Ltd
Assigned to SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. reassignment SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HORNG, ALEX
Application granted granted Critical
Publication of USD570795S1 publication Critical patent/USD570795S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the mini blower heat sink module in accordance with the claimed design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof, drawn at a larger scale for ease of illustration, wherein the broken lines represent unclaimed subject matter;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for mini blower heat sink module, as shown and described.
US29/274,496 2007-02-16 2007-04-27 Mini blower heat sink module Expired - Lifetime USD570795S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW30113602 2007-02-16
TW96301136U02 2007-02-16

Publications (1)

Publication Number Publication Date
USD570795S1 true USD570795S1 (en) 2008-06-10

Family

ID=39484812

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/274,496 Expired - Lifetime USD570795S1 (en) 2007-02-16 2007-04-27 Mini blower heat sink module

Country Status (1)

Country Link
US (1) USD570795S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD936622S1 (en) * 2019-01-17 2021-11-23 Telefonaktiebolaget Lm Ericsson (Publ) Baffle for heat sink
USD986901S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device
USD986898S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device
USD997161S1 (en) * 2020-09-10 2023-08-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD998612S1 (en) * 2020-06-09 2023-09-12 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1042778S1 (en) * 2023-04-14 2024-09-17 Acer Incorporated Heat dissipation module
USD1051864S1 (en) * 2022-02-08 2024-11-19 Acer Incorporated Heat dissipation module

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396276S (en) * 1997-10-07 1998-07-21 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
US6062301A (en) * 1998-06-23 2000-05-16 Foxconn Precision Components, Co., Ltd. Knockdown CPU heat dissipater
US6076594A (en) * 1998-10-13 2000-06-20 Kuo; Ching-Sung Heat dissipating device
US6104609A (en) * 1999-02-03 2000-08-15 Chen; A-Chiang Structure computer central processing unit heat dissipater
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
USD450044S1 (en) * 2000-06-14 2001-11-06 Christer E. Lindstrom Cooler for heat dissipation
US20030039545A1 (en) * 2001-08-27 2003-02-27 Masahiko Hirata Small cooling fan
US20030128514A1 (en) * 2000-03-31 2003-07-10 Fujitsu Limited Radiator mechanism and electronic apparatus having same
US20050286231A1 (en) * 2004-06-24 2005-12-29 Kazuma Kishi Heat sink with step fin
US20070047211A1 (en) * 2005-08-31 2007-03-01 Ati Technologies, Inc. Variable spring rate thermal management apparatus attachment mechanism
US20070131387A1 (en) * 2003-09-12 2007-06-14 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396276S (en) * 1997-10-07 1998-07-21 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipation fan
US6062301A (en) * 1998-06-23 2000-05-16 Foxconn Precision Components, Co., Ltd. Knockdown CPU heat dissipater
US6076594A (en) * 1998-10-13 2000-06-20 Kuo; Ching-Sung Heat dissipating device
US6104609A (en) * 1999-02-03 2000-08-15 Chen; A-Chiang Structure computer central processing unit heat dissipater
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US20030128514A1 (en) * 2000-03-31 2003-07-10 Fujitsu Limited Radiator mechanism and electronic apparatus having same
USD450044S1 (en) * 2000-06-14 2001-11-06 Christer E. Lindstrom Cooler for heat dissipation
US20030039545A1 (en) * 2001-08-27 2003-02-27 Masahiko Hirata Small cooling fan
US20070131387A1 (en) * 2003-09-12 2007-06-14 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same
US20050286231A1 (en) * 2004-06-24 2005-12-29 Kazuma Kishi Heat sink with step fin
US20070047211A1 (en) * 2005-08-31 2007-03-01 Ati Technologies, Inc. Variable spring rate thermal management apparatus attachment mechanism

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD936622S1 (en) * 2019-01-17 2021-11-23 Telefonaktiebolaget Lm Ericsson (Publ) Baffle for heat sink
USD998612S1 (en) * 2020-06-09 2023-09-12 Samsung Electronics Co., Ltd. Solid state drive memory device
US11979996B2 (en) 2020-06-09 2024-05-07 Samsung Electronics Co., Ltd. Memory device and electronic device including the same
US12219721B2 (en) 2020-06-09 2025-02-04 Samsung Electronics Co., Ltd. Memory device and electronic device including the same
USD997161S1 (en) * 2020-09-10 2023-08-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD986901S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device
USD986898S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1051864S1 (en) * 2022-02-08 2024-11-19 Acer Incorporated Heat dissipation module
USD1042778S1 (en) * 2023-04-14 2024-09-17 Acer Incorporated Heat dissipation module

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