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USD559806S1 - Pair of stage arms for a semiconductor wafer delivery apparatus - Google Patents

Pair of stage arms for a semiconductor wafer delivery apparatus Download PDF

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Publication number
USD559806S1
USD559806S1 US29/242,545 US24254505F USD559806S US D559806 S1 USD559806 S1 US D559806S1 US 24254505 F US24254505 F US 24254505F US D559806 S USD559806 S US D559806S
Authority
US
United States
Prior art keywords
pair
semiconductor wafer
delivery apparatus
wafer delivery
stage arms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/242,545
Inventor
Hiroki Hosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOSAKA, HIROKI
Application granted granted Critical
Publication of USD559806S1 publication Critical patent/USD559806S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a pair of stage arms for a semiconductor wafer delivery apparatus showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a cross-sectional view thereof taken along line 4—4 in FIG. 1;
FIG. 5 is a cross-sectional view thereof taken along line 5—5 in FIG. 4; and,
FIG. 6 is a perspective view thereof in use.
The broken line showing represents unclaimed subject matter.

Claims (1)

    CLAIM
  1. The ornamental design for a pair of stage arms for a semiconductor wafer delivery apparatus, as shown and described.
US29/242,545 2005-08-12 2005-11-14 Pair of stage arms for a semiconductor wafer delivery apparatus Expired - Lifetime USD559806S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005023559 2005-08-12
JP2005-023559 2005-08-12

Publications (1)

Publication Number Publication Date
USD559806S1 true USD559806S1 (en) 2008-01-15

Family

ID=38921420

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/242,545 Expired - Lifetime USD559806S1 (en) 2005-08-12 2005-11-14 Pair of stage arms for a semiconductor wafer delivery apparatus

Country Status (2)

Country Link
US (1) USD559806S1 (en)
TW (1) TWD112956S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD601978S1 (en) 2008-01-09 2009-10-13 Panasonic Corporation Printed circuit board

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5636960A (en) * 1992-07-29 1997-06-10 Tokyo Electron Limited Apparatus for detecting and aligning a substrate
US5740059A (en) * 1995-05-18 1998-04-14 Kabushiki Kaisha Toshiba Method of transporting substrates and apparatus for transporting substrates
US5772386A (en) * 1995-03-28 1998-06-30 Jenoptik Ag Loading and unloading station for semiconductor processing installations
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
US6132160A (en) * 1997-06-27 2000-10-17 Tokyo Electron Limited Substrate transferring apparatus
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US20020044860A1 (en) * 2000-04-05 2002-04-18 Yoshinobu Hayashi Processing system
US20020182040A1 (en) * 1998-09-22 2002-12-05 Yoshio Kimura Substrate processing apparatus and substrate processing method
US20020197138A1 (en) * 2001-06-22 2002-12-26 Mirae Corporation Exchanger for tray feeder
US20030133776A1 (en) * 2002-01-11 2003-07-17 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
US6811370B2 (en) * 1999-03-25 2004-11-02 N&K Technology, Inc. Wafer handling robot having X-Y stage for wafer handling and positioning
US20040265100A1 (en) * 2003-06-18 2004-12-30 Satoshi Ohkawara Semiconductor wafer processing machine
US6846149B2 (en) * 1999-04-02 2005-01-25 Aviza Technology, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
US20050220581A1 (en) * 2003-12-31 2005-10-06 Innolux Display Corp. Adjustable substrate transfer apparatus
US7033126B2 (en) * 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
US20070031222A1 (en) * 2005-08-05 2007-02-08 Tokyo Electron Limited Substrate transfer apparatus and method, and storage medium

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5636960A (en) * 1992-07-29 1997-06-10 Tokyo Electron Limited Apparatus for detecting and aligning a substrate
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
US5772386A (en) * 1995-03-28 1998-06-30 Jenoptik Ag Loading and unloading station for semiconductor processing installations
US5740059A (en) * 1995-05-18 1998-04-14 Kabushiki Kaisha Toshiba Method of transporting substrates and apparatus for transporting substrates
US6132160A (en) * 1997-06-27 2000-10-17 Tokyo Electron Limited Substrate transferring apparatus
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US20020182040A1 (en) * 1998-09-22 2002-12-05 Yoshio Kimura Substrate processing apparatus and substrate processing method
US6811370B2 (en) * 1999-03-25 2004-11-02 N&K Technology, Inc. Wafer handling robot having X-Y stage for wafer handling and positioning
US6846149B2 (en) * 1999-04-02 2005-01-25 Aviza Technology, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
US20020044860A1 (en) * 2000-04-05 2002-04-18 Yoshinobu Hayashi Processing system
US20020197138A1 (en) * 2001-06-22 2002-12-26 Mirae Corporation Exchanger for tray feeder
US20030133776A1 (en) * 2002-01-11 2003-07-17 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
US7033126B2 (en) * 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
US20040265100A1 (en) * 2003-06-18 2004-12-30 Satoshi Ohkawara Semiconductor wafer processing machine
US20050220581A1 (en) * 2003-12-31 2005-10-06 Innolux Display Corp. Adjustable substrate transfer apparatus
US20070031222A1 (en) * 2005-08-05 2007-02-08 Tokyo Electron Limited Substrate transfer apparatus and method, and storage medium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD601978S1 (en) 2008-01-09 2009-10-13 Panasonic Corporation Printed circuit board

Also Published As

Publication number Publication date
TWD112956S1 (en) 2006-09-11

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