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USD549189S1 - Dicing die-bonding film - Google Patents

Dicing die-bonding film Download PDF

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Publication number
USD549189S1
USD549189S1 US29/225,423 US22542305F USD549189S US D549189 S1 USD549189 S1 US D549189S1 US 22542305 F US22542305 F US 22542305F US D549189 S USD549189 S US D549189S
Authority
US
United States
Prior art keywords
bonding film
dicing die
view
dicing
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/225,423
Inventor
Sadahito Misumi
Takeshi Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUMURA, TAKESHI, MISUMI, SADAHITO
Application granted granted Critical
Publication of USD549189S1 publication Critical patent/USD549189S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of a dicing die-bonding film showing our new design, it being understood that the cut away portion indicates that the film has an indeterminate length wherein the pattern is repeated uniformly throughout the length thereof.
FIG. 2 is a rear view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a left side view thereof; and,
FIG. 6 is a right side view thereof.
The article to which the design is applied is affixed to the rear side of a semiconductor wafer with a circuit pattern formed, is diced (cut) into specified sizes together with the semiconductor wafer, and is bonded (affixed) on to the circuit substrate as it is.
The present article is formed by exfoliatively interleaving light-transmitting resin with circular patterns at the widthwise center section as well as colored patterns on the periphery and transparent resin, and measures as a whole about 230 to 400 mm wide and about 10 to 100 μm thick, with the circular patterns at the center about 160 to 310 mm in diameter, and is continuous horizontally only in “front view” and “rear view.”

Claims (1)

    CLAIM
  1. The ornamental design for a dicing die-bonding film, as shown and described.
US29/225,423 2004-09-21 2005-03-16 Dicing die-bonding film Expired - Lifetime USD549189S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004028520 2004-09-21
JP2004-028520 2004-09-21

Publications (1)

Publication Number Publication Date
USD549189S1 true USD549189S1 (en) 2007-08-21

Family

ID=38374429

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/225,423 Expired - Lifetime USD549189S1 (en) 2004-09-21 2005-03-16 Dicing die-bonding film

Country Status (2)

Country Link
US (1) USD549189S1 (en)
TW (1) TWD121842S1 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050208736A1 (en) * 2004-03-17 2005-09-22 Takeshi Matsumura Dicing die-bonding film
US20060148131A1 (en) * 2002-10-15 2006-07-06 Takeshi Matsumura Dicing/die-bonding film, method of fixing chipped work and semiconductor device
US20070137782A1 (en) * 2003-05-29 2007-06-21 Takeshi Matsumura Dicing die-bonding film, method of fixing chipped work and semiconductor device
US20080088036A1 (en) * 2003-12-26 2008-04-17 Takeshi Matsumura Dicing die-bonding film
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US20090209089A1 (en) * 2008-02-18 2009-08-20 Shuuhei Murata Dicing die-bonding film
US20100019365A1 (en) * 2006-09-12 2010-01-28 Nitto Denko Corporation Dicing/die bonding film
US20100233409A1 (en) * 2007-11-08 2010-09-16 Katsuhiko Kamiya Dicing die-bonding film
US20110053346A1 (en) * 2008-01-18 2011-03-03 Nitto Denko Corporation Dicing/die bonding film
US20110104873A1 (en) * 2008-01-18 2011-05-05 Nitto Denko Corporation Dicing/die bonding film
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD692056S1 (en) * 2012-12-19 2013-10-22 3M Innovative Properties Company Tape
USD694825S1 (en) * 2011-05-12 2013-12-03 3M Innovative Properties Company Bridge tape
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD874905S1 (en) * 2018-09-12 2020-02-11 Kent Gaddy Multipurpose strap consisting of a flexible strap and a flexible anchoring clip

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961804A (en) * 1983-08-03 1990-10-09 Investment Holding Corporation Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same
US5844348A (en) * 1995-06-06 1998-12-01 Murata Manufacturing Co., Ltd. Piezoelectric resonant part and method of manufacturing the same
US6457220B1 (en) * 1999-01-25 2002-10-01 Murata Manufacturing Co., Ltd. Electronic component, piezoelectric-resonant component and method for manufacturing electronic components and piezoelectric-resonant components
US20030207479A1 (en) * 2001-12-20 2003-11-06 John Border Laser array and method of making same
US20030226640A1 (en) * 2001-03-30 2003-12-11 Osamu Yamazaki Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies
US20050139973A1 (en) * 2003-12-26 2005-06-30 Takeshi Matsumura Dicing die-bonding film
US20050208736A1 (en) * 2004-03-17 2005-09-22 Takeshi Matsumura Dicing die-bonding film
US7054161B1 (en) * 2000-04-19 2006-05-30 James Stephen L Slotted adhesive for die-attach in BOC and LOC packages

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961804A (en) * 1983-08-03 1990-10-09 Investment Holding Corporation Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same
US5844348A (en) * 1995-06-06 1998-12-01 Murata Manufacturing Co., Ltd. Piezoelectric resonant part and method of manufacturing the same
US6457220B1 (en) * 1999-01-25 2002-10-01 Murata Manufacturing Co., Ltd. Electronic component, piezoelectric-resonant component and method for manufacturing electronic components and piezoelectric-resonant components
US7054161B1 (en) * 2000-04-19 2006-05-30 James Stephen L Slotted adhesive for die-attach in BOC and LOC packages
US20030226640A1 (en) * 2001-03-30 2003-12-11 Osamu Yamazaki Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies
US6977024B2 (en) * 2001-03-30 2005-12-20 Lintec Corporation Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies
US20030207479A1 (en) * 2001-12-20 2003-11-06 John Border Laser array and method of making same
US20050139973A1 (en) * 2003-12-26 2005-06-30 Takeshi Matsumura Dicing die-bonding film
US20050208736A1 (en) * 2004-03-17 2005-09-22 Takeshi Matsumura Dicing die-bonding film

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8586415B2 (en) 2002-10-15 2013-11-19 Nitto Denko Corporation Dicing/die-bonding film, method of fixing chipped work and semiconductor device
US20060148131A1 (en) * 2002-10-15 2006-07-06 Takeshi Matsumura Dicing/die-bonding film, method of fixing chipped work and semiconductor device
US8178420B2 (en) * 2002-10-15 2012-05-15 Nitto Denko Corporation Dicing/die-bonding film, method of fixing chipped work and semiconductor device
US20100093155A1 (en) * 2002-10-15 2010-04-15 Takeshi Matsumura Dicing/die-bonding film, method of fixing chipped work and semiconductor device
US7646103B2 (en) 2002-10-15 2010-01-12 Nitto Denko Corporation Dicing/die-bonding film, method of fixing chipped work and semiconductor device
US20070137782A1 (en) * 2003-05-29 2007-06-21 Takeshi Matsumura Dicing die-bonding film, method of fixing chipped work and semiconductor device
US7780811B2 (en) 2003-05-29 2010-08-24 Nitto Denko Corporation Dicing die-bonding film, method of fixing chipped work and semiconductor device
US7449226B2 (en) 2003-05-29 2008-11-11 Nitto Denko Corporation Dicing die-bonding film, method of fixing chipped work and semiconductor device
US7429522B2 (en) 2003-12-26 2008-09-30 Nitto Denko Corporation Dicing die-bonding film
US20080088036A1 (en) * 2003-12-26 2008-04-17 Takeshi Matsumura Dicing die-bonding film
US20090149003A1 (en) * 2004-03-17 2009-06-11 Takeshi Matsumura Dicing die-bonding film
US7508081B2 (en) 2004-03-17 2009-03-24 Nitto Denko Corporation Dicing die-bonding film
US20110147952A1 (en) * 2004-03-17 2011-06-23 Takeshi Matsumura Dicing die-bonding film
US20050208736A1 (en) * 2004-03-17 2005-09-22 Takeshi Matsumura Dicing die-bonding film
US7863182B2 (en) 2004-03-17 2011-01-04 Nitto Denko Corporation Dicing die-bonding film
US8304341B2 (en) 2004-03-17 2012-11-06 Nitto Denko Corporation Dicing die-bonding film
US20100019365A1 (en) * 2006-09-12 2010-01-28 Nitto Denko Corporation Dicing/die bonding film
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US20100233409A1 (en) * 2007-11-08 2010-09-16 Katsuhiko Kamiya Dicing die-bonding film
US20110104873A1 (en) * 2008-01-18 2011-05-05 Nitto Denko Corporation Dicing/die bonding film
US20110053346A1 (en) * 2008-01-18 2011-03-03 Nitto Denko Corporation Dicing/die bonding film
US8617928B2 (en) 2008-01-18 2013-12-31 Nitto Denko Corporation Dicing/die bonding film
US20090209089A1 (en) * 2008-02-18 2009-08-20 Shuuhei Murata Dicing die-bonding film
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD694825S1 (en) * 2011-05-12 2013-12-03 3M Innovative Properties Company Bridge tape
USD692056S1 (en) * 2012-12-19 2013-10-22 3M Innovative Properties Company Tape
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD874905S1 (en) * 2018-09-12 2020-02-11 Kent Gaddy Multipurpose strap consisting of a flexible strap and a flexible anchoring clip

Also Published As

Publication number Publication date
TWD121842S1 (en) 2008-03-11

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