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USD548705S1 - Attracting disc for an electrostatic chuck for semiconductor production - Google Patents

Attracting disc for an electrostatic chuck for semiconductor production Download PDF

Info

Publication number
USD548705S1
USD548705S1 US29/245,047 US24504705F USD548705S US D548705 S1 USD548705 S1 US D548705S1 US 24504705 F US24504705 F US 24504705F US D548705 S USD548705 S US D548705S
Authority
US
United States
Prior art keywords
electrostatic chuck
semiconductor production
attracting disc
attracting
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/245,047
Inventor
Daisuke Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAYASHI, DAISUKE
Application granted granted Critical
Publication of USD548705S1 publication Critical patent/USD548705S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of an attracting disc for an electrostatic chuck for semiconductor production, showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an attracting disc for an electrostatic chuck for semiconductor production, as shown and described.
US29/245,047 2005-09-29 2005-12-19 Attracting disc for an electrostatic chuck for semiconductor production Expired - Lifetime USD548705S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-028309 2005-02-03
JP2005028309 2005-09-29

Publications (1)

Publication Number Publication Date
USD548705S1 true USD548705S1 (en) 2007-08-14

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ID=38337434

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/245,047 Expired - Lifetime USD548705S1 (en) 2005-09-29 2005-12-19 Attracting disc for an electrostatic chuck for semiconductor production

Country Status (2)

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US (1) USD548705S1 (en)
TW (1) TWD114852S1 (en)

Cited By (67)

* Cited by examiner, † Cited by third party
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USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
US20100032310A1 (en) * 2006-08-16 2010-02-11 Novellus Systems, Inc. Method and apparatus for electroplating
US20100044236A1 (en) * 2000-03-27 2010-02-25 Novellus Systems, Inc. Method and apparatus for electroplating
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
USD650344S1 (en) * 2008-10-20 2011-12-13 Ebara Corporation Vacuum contact pad
USD654033S1 (en) * 2010-01-20 2012-02-14 Celadon Systems, Inc. Grooved wire support for a probe test core
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD689032S1 (en) * 2011-04-21 2013-09-03 Panasonic Corporation Electrostatic atomized water particle generating module
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
US8540857B1 (en) 2008-12-19 2013-09-24 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
USD790489S1 (en) * 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
USD858192S1 (en) * 2018-04-27 2019-09-03 Applied Materials, Inc. Gas distribution plate
USD868993S1 (en) * 2017-08-31 2019-12-03 Hitachi High-Technologies Corporation Electrode plate for a plasma processing apparatus
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
USD988300S1 (en) * 2021-03-09 2023-06-06 Thales Dis Ais Deutschland Gmbh IoT module
USD988299S1 (en) * 2021-06-18 2023-06-06 Telit Cinterion Deutschland Gmbh Cellular module
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1073913S1 (en) * 2021-11-26 2025-05-06 Tomoegawa Corporation Heat exchange plate
USD1082731S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1082728S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1082729S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor cover
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1093328S1 (en) * 2023-01-11 2025-09-16 Nuflare Technology, Inc. Susceptor
USD1094322S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094321S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor cover
USD1094320S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094323S1 (en) * 2023-01-11 2025-09-23 Nuflare Technology, Inc. Susceptor unit
USD1096676S1 (en) * 2022-10-20 2025-10-07 Nuflare Technology, Inc. Cover base for susceptors
USD1098057S1 (en) * 2022-10-20 2025-10-14 Nuflare Technology, Inc. Susceptor cover
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate

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US4502094A (en) * 1981-09-14 1985-02-26 U.S. Philips Corporation Electrostatic chuck
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US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US20020159217A1 (en) * 2001-01-29 2002-10-31 Ngk Insulators, Ltd. Electrostatic chuck and substrate processing apparatus
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US6721162B2 (en) * 1996-04-26 2004-04-13 Applied Materials Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
US20040212947A1 (en) * 2003-04-22 2004-10-28 Applied Materials, Inc. Substrate support having heat transfer system
US20040218339A1 (en) * 2003-01-29 2004-11-04 Kyocera Corporation Electrostatic chuck
US20050111161A1 (en) * 2003-11-25 2005-05-26 Daniel Tran Compact pinlifter assembly integrated in wafer chuck
US20060002053A1 (en) * 2004-03-31 2006-01-05 Applied Materials, Inc. Detachable electrostatic chuck for supporting a substrate in a process chamber
US20060161785A1 (en) * 2005-01-20 2006-07-20 Christopher Conner System and method for querying a network directory for information handling system user privileges
US20060221539A1 (en) * 2005-03-31 2006-10-05 Ngk Spark Plug Co., Ltd. Electrostatic chuck

Patent Citations (18)

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Publication number Priority date Publication date Assignee Title
US3078565A (en) * 1957-07-29 1963-02-26 Goddard & Goddard Company Magnetic chuck adapter plate
US4502094A (en) * 1981-09-14 1985-02-26 U.S. Philips Corporation Electrostatic chuck
US5350479A (en) * 1992-12-02 1994-09-27 Applied Materials, Inc. Electrostatic chuck for high power plasma processing
US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US20040190215A1 (en) * 1996-04-26 2004-09-30 Applied Materials, Inc. Electrostatic chuck having dielectric member with stacked layers and manufacture
US6721162B2 (en) * 1996-04-26 2004-04-13 Applied Materials Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US6033478A (en) * 1996-11-05 2000-03-07 Applied Materials, Inc. Wafer support with improved temperature control
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US20020159217A1 (en) * 2001-01-29 2002-10-31 Ngk Insulators, Ltd. Electrostatic chuck and substrate processing apparatus
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US20040218339A1 (en) * 2003-01-29 2004-11-04 Kyocera Corporation Electrostatic chuck
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
US20040212947A1 (en) * 2003-04-22 2004-10-28 Applied Materials, Inc. Substrate support having heat transfer system
US20050111161A1 (en) * 2003-11-25 2005-05-26 Daniel Tran Compact pinlifter assembly integrated in wafer chuck
US20060002053A1 (en) * 2004-03-31 2006-01-05 Applied Materials, Inc. Detachable electrostatic chuck for supporting a substrate in a process chamber
US20060161785A1 (en) * 2005-01-20 2006-07-20 Christopher Conner System and method for querying a network directory for information handling system user privileges
US20060221539A1 (en) * 2005-03-31 2006-10-05 Ngk Spark Plug Co., Ltd. Electrostatic chuck

Cited By (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100044236A1 (en) * 2000-03-27 2010-02-25 Novellus Systems, Inc. Method and apparatus for electroplating
US8475644B2 (en) 2000-03-27 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US20100032310A1 (en) * 2006-08-16 2010-02-11 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD650344S1 (en) * 2008-10-20 2011-12-13 Ebara Corporation Vacuum contact pad
US20100116672A1 (en) * 2008-11-07 2010-05-13 Novellus Systems, Inc. Method and apparatus for electroplating
US9309604B2 (en) 2008-11-07 2016-04-12 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
US8540857B1 (en) 2008-12-19 2013-09-24 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
USD654033S1 (en) * 2010-01-20 2012-02-14 Celadon Systems, Inc. Grooved wire support for a probe test core
US10190230B2 (en) 2010-07-02 2019-01-29 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9464361B2 (en) 2010-07-02 2016-10-11 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9394620B2 (en) 2010-07-02 2016-07-19 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
USD729753S1 (en) 2010-12-28 2015-05-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD689032S1 (en) * 2011-04-21 2013-09-03 Panasonic Corporation Electrostatic atomized water particle generating module
US10053792B2 (en) 2011-09-12 2018-08-21 Novellus Systems, Inc. Plating cup with contoured cup bottom
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709537S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
US10662545B2 (en) 2012-12-12 2020-05-26 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9834852B2 (en) 2012-12-12 2017-12-05 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
US10301739B2 (en) 2013-05-01 2019-05-28 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
USD793976S1 (en) 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9899230B2 (en) 2013-05-29 2018-02-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10923340B2 (en) 2015-05-14 2021-02-16 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
USD790489S1 (en) * 2015-07-08 2017-06-27 Ebara Corporation Vacuum contact pad
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11047059B2 (en) 2016-05-24 2021-06-29 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
USD868993S1 (en) * 2017-08-31 2019-12-03 Hitachi High-Technologies Corporation Electrode plate for a plasma processing apparatus
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
USD858192S1 (en) * 2018-04-27 2019-09-03 Applied Materials, Inc. Gas distribution plate
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD988300S1 (en) * 2021-03-09 2023-06-06 Thales Dis Ais Deutschland Gmbh IoT module
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
USD988299S1 (en) * 2021-06-18 2023-06-06 Telit Cinterion Deutschland Gmbh Cellular module
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1073913S1 (en) * 2021-11-26 2025-05-06 Tomoegawa Corporation Heat exchange plate
USD1092422S1 (en) * 2021-11-26 2025-09-09 Tomoegawa Corporation Heat exchange plate
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1099858S1 (en) * 2022-05-19 2025-10-28 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1096676S1 (en) * 2022-10-20 2025-10-07 Nuflare Technology, Inc. Cover base for susceptors
USD1094322S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094321S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor cover
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USD1094323S1 (en) * 2023-01-11 2025-09-23 Nuflare Technology, Inc. Susceptor unit
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USD1082729S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor cover
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