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USD529057S1 - Sputtering target - Google Patents

Sputtering target Download PDF

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Publication number
USD529057S1
USD529057S1 US29/211,416 US21141604F USD529057S US D529057 S1 USD529057 S1 US D529057S1 US 21141604 F US21141604 F US 21141604F US D529057 S USD529057 S US D529057S
Authority
US
United States
Prior art keywords
sputtering target
view
sputtering
target
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/211,416
Inventor
Matthew T. Willson
Henry L. Grohman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materion Advanced Materials Technologies and Services Inc
Original Assignee
Williams Advanced Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Williams Advanced Materials Inc filed Critical Williams Advanced Materials Inc
Priority to US29/211,416 priority Critical patent/USD529057S1/en
Assigned to WILLIAMS ADVANCED MATERIALS, INC. reassignment WILLIAMS ADVANCED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GROHMAN, HENRY L., WILSON, MATTHEW T.
Application granted granted Critical
Publication of USD529057S1 publication Critical patent/USD529057S1/en
Assigned to MATERION ADVANCED MATERIALS TECHNOLOGIES AND SERVICES INC. reassignment MATERION ADVANCED MATERIALS TECHNOLOGIES AND SERVICES INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: WILLAMS ADVANCED MATERIALS INC.
Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY AGREEMENT Assignors: MATERION ADVANCED MATERIALS TECHNOLOGIES AND SERVICES INC.
Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATERION ADVANCED MATERIALS TECHNOLOGIES AND SERVICES INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of the design.
FIG. 2 is a cross-sectional view of the upper portion of the design taken at line 2—2 of FIG. 1.
FIG. 3 is an enlarged detail of the cross-sectional view shown in FIG. 2.
FIG. 4 is a partial top plan view of the design shown in FIG. 1; and,
FIG. 5 is a cross-sectional view taken at line 5—5 of FIG. 4.

Claims (1)

    CLAIM
  1. The ornamental design for a sputtering target, as shown and described.
US29/211,416 2004-08-16 2004-08-16 Sputtering target Expired - Lifetime USD529057S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/211,416 USD529057S1 (en) 2004-08-16 2004-08-16 Sputtering target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/211,416 USD529057S1 (en) 2004-08-16 2004-08-16 Sputtering target

Publications (1)

Publication Number Publication Date
USD529057S1 true USD529057S1 (en) 2006-09-26

Family

ID=37019359

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/211,416 Expired - Lifetime USD529057S1 (en) 2004-08-16 2004-08-16 Sputtering target

Country Status (1)

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US (1) USD529057S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD643055S1 (en) * 2008-09-11 2011-08-09 Asm Japan K.K. Heater block for use in a semiconductor processing tool
USD799646S1 (en) * 2016-08-30 2017-10-10 Asm Ip Holding B.V. Heater block
USD859484S1 (en) * 2017-06-12 2019-09-10 Asm Ip Holding B.V. Heater block
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD927575S1 (en) * 2019-01-18 2021-08-10 Shinkawa Ltd. Heater block for bonding apparatus
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821841A (en) * 1972-08-18 1974-07-02 Brush Wellman Method for fabricating a beryllium fiber reinforced composite having a titanium matrix
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
US6471830B1 (en) * 2000-10-03 2002-10-29 Veeco/Cvc, Inc. Inductively-coupled-plasma ionized physical-vapor deposition apparatus, method and system
US6599399B2 (en) * 1997-03-07 2003-07-29 Applied Materials, Inc. Sputtering method to generate ionized metal plasma using electron beams and magnetic field
US6623605B2 (en) * 2001-12-06 2003-09-23 Applied Materials, Inc. Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821841A (en) * 1972-08-18 1974-07-02 Brush Wellman Method for fabricating a beryllium fiber reinforced composite having a titanium matrix
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
US6599399B2 (en) * 1997-03-07 2003-07-29 Applied Materials, Inc. Sputtering method to generate ionized metal plasma using electron beams and magnetic field
US6471830B1 (en) * 2000-10-03 2002-10-29 Veeco/Cvc, Inc. Inductively-coupled-plasma ionized physical-vapor deposition apparatus, method and system
US6623605B2 (en) * 2001-12-06 2003-09-23 Applied Materials, Inc. Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD643055S1 (en) * 2008-09-11 2011-08-09 Asm Japan K.K. Heater block for use in a semiconductor processing tool
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD799646S1 (en) * 2016-08-30 2017-10-10 Asm Ip Holding B.V. Heater block
USD859484S1 (en) * 2017-06-12 2019-09-10 Asm Ip Holding B.V. Heater block
USD927575S1 (en) * 2019-01-18 2021-08-10 Shinkawa Ltd. Heater block for bonding apparatus
USD959525S1 (en) 2019-01-18 2022-08-02 Shinkawa Ltd. Heater block for bonding apparatus
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications

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