USD525215S1 - Base for a semiconductor carrier - Google Patents
Base for a semiconductor carrier Download PDFInfo
- Publication number
- USD525215S1 USD525215S1 US29/231,789 US23178905F USD525215S US D525215 S1 USD525215 S1 US D525215S1 US 23178905 F US23178905 F US 23178905F US D525215 S USD525215 S US D525215S
- Authority
- US
- United States
- Prior art keywords
- base
- semiconductor carrier
- semiconductor
- carrier
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
FIG. 1 is a top-front perspective view of a base for a semiconductor carrier of our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a right-end view thereof; and,
FIG. 7 is a left-end view thereof.
Claims (1)
- The ornamental design for a base for a semiconductor carrier, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/231,789 USD525215S1 (en) | 2004-01-27 | 2005-06-10 | Base for a semiconductor carrier |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004001880 | 2004-01-27 | ||
| JP2004-001880 | 2004-07-01 | ||
| US29/210,045 USD507248S1 (en) | 2004-07-27 | 2004-07-27 | Semiconductor carrier |
| US29/231,789 USD525215S1 (en) | 2004-01-27 | 2005-06-10 | Base for a semiconductor carrier |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/210,045 Continuation-In-Part USD507248S1 (en) | 2004-01-27 | 2004-07-27 | Semiconductor carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD525215S1 true USD525215S1 (en) | 2006-07-18 |
Family
ID=36659513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/231,789 Expired - Lifetime USD525215S1 (en) | 2004-01-27 | 2005-06-10 | Base for a semiconductor carrier |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD525215S1 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD755742S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD1049066S1 (en) * | 2022-02-28 | 2024-10-29 | Syskey Technology Co., Ltd. | Base for a multi-chamber semiconductor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| US5451165A (en) | 1994-07-27 | 1995-09-19 | Minnesota Mining And Manufacturing Company | Temporary package for bare die test and burn-in |
| US5519332A (en) | 1991-06-04 | 1996-05-21 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
| US5541525A (en) | 1991-06-04 | 1996-07-30 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
| USD401567S (en) | 1997-04-25 | 1998-11-24 | Micron Technology, Inc. | Temporary package for semiconductor dice |
| US20010043074A1 (en) | 1998-08-28 | 2001-11-22 | David R. Hembree | Test carrier with molded interconnect for testing semiconductor components |
| US20040016993A1 (en) | 2002-07-24 | 2004-01-29 | Mirae Corporation | Test tray with carrier modules for a semiconductor device handler |
-
2005
- 2005-06-10 US US29/231,789 patent/USD525215S1/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5519332A (en) | 1991-06-04 | 1996-05-21 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
| US5541525A (en) | 1991-06-04 | 1996-07-30 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
| USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| US5451165A (en) | 1994-07-27 | 1995-09-19 | Minnesota Mining And Manufacturing Company | Temporary package for bare die test and burn-in |
| USD401567S (en) | 1997-04-25 | 1998-11-24 | Micron Technology, Inc. | Temporary package for semiconductor dice |
| US20010043074A1 (en) | 1998-08-28 | 2001-11-22 | David R. Hembree | Test carrier with molded interconnect for testing semiconductor components |
| US20040016993A1 (en) | 2002-07-24 | 2004-01-29 | Mirae Corporation | Test tray with carrier modules for a semiconductor device handler |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD785577S1 (en) | 2013-08-21 | 2017-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
| USD805485S1 (en) | 2013-08-21 | 2017-12-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
| USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| USD755742S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| USD1049066S1 (en) * | 2022-02-28 | 2024-10-29 | Syskey Technology Co., Ltd. | Base for a multi-chamber semiconductor |
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