USD522978S1 - Information storage semiconductor element - Google Patents
Information storage semiconductor element Download PDFInfo
- Publication number
- USD522978S1 USD522978S1 US29/219,665 US21966504F USD522978S US D522978 S1 USD522978 S1 US D522978S1 US 21966504 F US21966504 F US 21966504F US D522978 S USD522978 S US D522978S
- Authority
- US
- United States
- Prior art keywords
- information storage
- semiconductor element
- storage semiconductor
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims 2
Images
Description
FIG. 1 is a top perspective view of an information storage semiconductor element of the present invention;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof; and,
FIG. 6 is a first side view thereof, wherein the second side view is a mirror image thereof.
Claims (1)
- We claim the ornamental design for an information storage semiconductor element, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004019083 | 2004-06-25 | ||
| JP2004-019083 | 2004-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD522978S1 true USD522978S1 (en) | 2006-06-13 |
Family
ID=36576970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/219,665 Expired - Lifetime USD522978S1 (en) | 2004-06-25 | 2004-12-20 | Information storage semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD522978S1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD586060S1 (en) * | 2008-05-16 | 2009-02-03 | Peter Kahn | Paint brush holder |
| USD591697S1 (en) * | 2006-08-09 | 2009-05-05 | Cree, Inc. | Lamp package |
| USD879787S1 (en) * | 2017-11-21 | 2020-03-31 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
| USD880484S1 (en) * | 2018-04-26 | 2020-04-07 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
| USD1003889S1 (en) * | 2019-12-24 | 2023-11-07 | Hangzhou Chipjet Technology Co., Ltd. | Data processing chip |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| USD288557S (en) | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
| USD319629S (en) | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
| US5064968A (en) * | 1990-01-16 | 1991-11-12 | Hughes Aircraft Company | Domed lid for integrated circuit package |
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| US5347160A (en) | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
| US5371408A (en) * | 1991-11-29 | 1994-12-06 | Motorola, Inc. | Integrated circuit package with removable shield |
| US5394009A (en) | 1993-07-30 | 1995-02-28 | Sun Microsystems, Inc. | Tab semiconductor package with cushioned land grid array outer lead bumps |
| USD358805S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Detachable integrated circuit module |
| USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
| US20020043707A1 (en) * | 2000-10-10 | 2002-04-18 | Nec Corporation | Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same |
| USD474472S1 (en) | 2002-07-15 | 2003-05-13 | Sony Corporation | Information recording medium |
| USD487430S1 (en) | 2002-07-10 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor memory element |
| US20040099874A1 (en) * | 2002-11-21 | 2004-05-27 | Chih-Sung Chang | Package structure for light emitting diode and method thereof |
| US6972439B1 (en) * | 2004-05-27 | 2005-12-06 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode device |
-
2004
- 2004-12-20 US US29/219,665 patent/USD522978S1/en not_active Expired - Lifetime
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| USD288557S (en) | 1984-09-10 | 1987-03-03 | Motorola, Inc. | Semiconductor housing |
| USD319629S (en) | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
| US5064968A (en) * | 1990-01-16 | 1991-11-12 | Hughes Aircraft Company | Domed lid for integrated circuit package |
| US5371408A (en) * | 1991-11-29 | 1994-12-06 | Motorola, Inc. | Integrated circuit package with removable shield |
| US5347160A (en) | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| US5394009A (en) | 1993-07-30 | 1995-02-28 | Sun Microsystems, Inc. | Tab semiconductor package with cushioned land grid array outer lead bumps |
| USD358805S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Detachable integrated circuit module |
| USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
| US20020043707A1 (en) * | 2000-10-10 | 2002-04-18 | Nec Corporation | Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same |
| USD487430S1 (en) | 2002-07-10 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor memory element |
| USD474472S1 (en) | 2002-07-15 | 2003-05-13 | Sony Corporation | Information recording medium |
| US20040099874A1 (en) * | 2002-11-21 | 2004-05-27 | Chih-Sung Chang | Package structure for light emitting diode and method thereof |
| US6972439B1 (en) * | 2004-05-27 | 2005-12-06 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD591697S1 (en) * | 2006-08-09 | 2009-05-05 | Cree, Inc. | Lamp package |
| USD586060S1 (en) * | 2008-05-16 | 2009-02-03 | Peter Kahn | Paint brush holder |
| USD879787S1 (en) * | 2017-11-21 | 2020-03-31 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
| USD880484S1 (en) * | 2018-04-26 | 2020-04-07 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
| USD1003889S1 (en) * | 2019-12-24 | 2023-11-07 | Hangzhou Chipjet Technology Co., Ltd. | Data processing chip |
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