USD512695S1 - Diode with lead terminals - Google Patents
Diode with lead terminals Download PDFInfo
- Publication number
- USD512695S1 USD512695S1 US29/220,291 US22029104F USD512695S US D512695 S1 USD512695 S1 US D512695S1 US 22029104 F US22029104 F US 22029104F US D512695 S USD512695 S US D512695S
- Authority
- US
- United States
- Prior art keywords
- diode
- lead terminals
- terminals
- lead
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a top view of diode with lead terminals, showing our new design;
FIG. 2 is a bottom view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a left side view thereof.
Claims (1)
- The ornamental design for diode with lead terminals, as shown.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJD2004-019206 | 2004-06-28 | ||
| JP2004019206 | 2004-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD512695S1 true USD512695S1 (en) | 2005-12-13 |
Family
ID=35452921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/220,291 Expired - Lifetime USD512695S1 (en) | 2004-06-28 | 2004-12-28 | Diode with lead terminals |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD512695S1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3900813A (en) * | 1970-09-28 | 1975-08-19 | Denki Onkyo Company Ltd | Galvano-magnetro effect device |
| US6316832B1 (en) * | 1997-11-17 | 2001-11-13 | Canon Kabushiki Kaisha | Moldless semiconductor device and photovoltaic device module making use of the same |
| US20020005523A1 (en) * | 1999-03-18 | 2002-01-17 | Sony Corporation | Semiconductor light emitting device and manufacturing method thereof |
| US6696636B2 (en) * | 2001-02-23 | 2004-02-24 | Sumitomo Wiring Systems, Ltd. | By-pass rectifier element and terminal housing for solar battery modules using a by-pass rectifier element |
| US20040155321A1 (en) * | 2002-02-11 | 2004-08-12 | Abbott Donald C. | Method for fabricating preplated nickel/palladium and tin leadframes |
| US6803514B2 (en) * | 2001-03-23 | 2004-10-12 | Canon Kabushiki Kaisha | Mounting structure and mounting method of a photovoltaic element, mounting substrate for mounting a semiconductor element thereon and method for mounting a semiconductor element on said mounting substrate |
| US6864509B2 (en) * | 2002-02-06 | 2005-03-08 | Eugene Robert Worley | Packaging optically coupled integrated circuits using flip-chip methods |
-
2004
- 2004-12-28 US US29/220,291 patent/USD512695S1/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3900813A (en) * | 1970-09-28 | 1975-08-19 | Denki Onkyo Company Ltd | Galvano-magnetro effect device |
| US6316832B1 (en) * | 1997-11-17 | 2001-11-13 | Canon Kabushiki Kaisha | Moldless semiconductor device and photovoltaic device module making use of the same |
| US20020005523A1 (en) * | 1999-03-18 | 2002-01-17 | Sony Corporation | Semiconductor light emitting device and manufacturing method thereof |
| US6696636B2 (en) * | 2001-02-23 | 2004-02-24 | Sumitomo Wiring Systems, Ltd. | By-pass rectifier element and terminal housing for solar battery modules using a by-pass rectifier element |
| US6803514B2 (en) * | 2001-03-23 | 2004-10-12 | Canon Kabushiki Kaisha | Mounting structure and mounting method of a photovoltaic element, mounting substrate for mounting a semiconductor element thereon and method for mounting a semiconductor element on said mounting substrate |
| US6864509B2 (en) * | 2002-02-06 | 2005-03-08 | Eugene Robert Worley | Packaging optically coupled integrated circuits using flip-chip methods |
| US20040155321A1 (en) * | 2002-02-11 | 2004-08-12 | Abbott Donald C. | Method for fabricating preplated nickel/palladium and tin leadframes |
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