USD510325S1 - Thermal module - Google Patents
Thermal module Download PDFInfo
- Publication number
- USD510325S1 USD510325S1 US29/196,460 US19646003F USD510325S US D510325 S1 USD510325 S1 US D510325S1 US 19646003 F US19646003 F US 19646003F US D510325 S USD510325 S US D510325S
- Authority
- US
- United States
- Prior art keywords
- thermal module
- thermal
- module
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a thermal module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear elevational view thereof.
Claims (1)
- The ornamental design for a thermal module, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92306267 | 2003-10-15 | ||
TW92306267 | 2003-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD510325S1 true USD510325S1 (en) | 2005-10-04 |
Family
ID=35005398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/196,460 Expired - Lifetime USD510325S1 (en) | 2003-10-15 | 2003-12-31 | Thermal module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD510325S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD906989S1 (en) * | 2017-05-03 | 2021-01-05 | Fluence Bioengineering, Inc. | Heat sink for a luminaire |
USD950507S1 (en) * | 2020-04-28 | 2022-05-03 | Aic Inc. | Heat sink |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6137681A (en) * | 1998-08-07 | 2000-10-24 | Foxconn Precision Components Co., Ltd. | Thermal module |
US6412546B1 (en) * | 2000-03-15 | 2002-07-02 | Foxconn Precision Components Co., Ltd. | Heat dissipation device for integrated circuits |
US6480387B1 (en) * | 2002-03-14 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
US20030081382A1 (en) * | 2001-10-31 | 2003-05-01 | Lin Ching Huan | Thermal module |
US6560113B1 (en) * | 2002-01-30 | 2003-05-06 | Hon Hai Precision Ind. Co., Ltd. | Electronic device assembly having thermal module for heat dissipation |
US20030117773A1 (en) * | 2001-12-26 | 2003-06-26 | Nien-Tien Cheng | Thermal module |
-
2003
- 2003-12-31 US US29/196,460 patent/USD510325S1/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6137681A (en) * | 1998-08-07 | 2000-10-24 | Foxconn Precision Components Co., Ltd. | Thermal module |
US6412546B1 (en) * | 2000-03-15 | 2002-07-02 | Foxconn Precision Components Co., Ltd. | Heat dissipation device for integrated circuits |
US20030081382A1 (en) * | 2001-10-31 | 2003-05-01 | Lin Ching Huan | Thermal module |
US20030117773A1 (en) * | 2001-12-26 | 2003-06-26 | Nien-Tien Cheng | Thermal module |
US6560113B1 (en) * | 2002-01-30 | 2003-05-06 | Hon Hai Precision Ind. Co., Ltd. | Electronic device assembly having thermal module for heat dissipation |
US6480387B1 (en) * | 2002-03-14 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD906989S1 (en) * | 2017-05-03 | 2021-01-05 | Fluence Bioengineering, Inc. | Heat sink for a luminaire |
USD907592S1 (en) * | 2017-05-03 | 2021-01-12 | Fluence Bioengineering, Inc. | Heat sink for a luminaire |
USD950507S1 (en) * | 2020-04-28 | 2022-05-03 | Aic Inc. | Heat sink |
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