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USD510325S1 - Thermal module - Google Patents

Thermal module Download PDF

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Publication number
USD510325S1
USD510325S1 US29/196,460 US19646003F USD510325S US D510325 S1 USD510325 S1 US D510325S1 US 19646003 F US19646003 F US 19646003F US D510325 S USD510325 S US D510325S
Authority
US
United States
Prior art keywords
thermal module
thermal
module
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/196,460
Inventor
Chi-Chang Lin
Chih-Yuan Cheng
Heng-Tsung Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asustek Computer Inc
Original Assignee
Asustek Computer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asustek Computer Inc filed Critical Asustek Computer Inc
Assigned to ASUSTEK COMPUTER INC. reassignment ASUSTEK COMPUTER INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, CHIH-YUAN, LIN, CHI-CHANG, WANG, HENG-TSUNG
Application granted granted Critical
Publication of USD510325S1 publication Critical patent/USD510325S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a thermal module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a thermal module, as shown and described.
US29/196,460 2003-10-15 2003-12-31 Thermal module Expired - Lifetime USD510325S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW92306267 2003-10-15
TW92306267 2003-10-15

Publications (1)

Publication Number Publication Date
USD510325S1 true USD510325S1 (en) 2005-10-04

Family

ID=35005398

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/196,460 Expired - Lifetime USD510325S1 (en) 2003-10-15 2003-12-31 Thermal module

Country Status (1)

Country Link
US (1) USD510325S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD906989S1 (en) * 2017-05-03 2021-01-05 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD950507S1 (en) * 2020-04-28 2022-05-03 Aic Inc. Heat sink

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6137681A (en) * 1998-08-07 2000-10-24 Foxconn Precision Components Co., Ltd. Thermal module
US6412546B1 (en) * 2000-03-15 2002-07-02 Foxconn Precision Components Co., Ltd. Heat dissipation device for integrated circuits
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US20030081382A1 (en) * 2001-10-31 2003-05-01 Lin Ching Huan Thermal module
US6560113B1 (en) * 2002-01-30 2003-05-06 Hon Hai Precision Ind. Co., Ltd. Electronic device assembly having thermal module for heat dissipation
US20030117773A1 (en) * 2001-12-26 2003-06-26 Nien-Tien Cheng Thermal module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6137681A (en) * 1998-08-07 2000-10-24 Foxconn Precision Components Co., Ltd. Thermal module
US6412546B1 (en) * 2000-03-15 2002-07-02 Foxconn Precision Components Co., Ltd. Heat dissipation device for integrated circuits
US20030081382A1 (en) * 2001-10-31 2003-05-01 Lin Ching Huan Thermal module
US20030117773A1 (en) * 2001-12-26 2003-06-26 Nien-Tien Cheng Thermal module
US6560113B1 (en) * 2002-01-30 2003-05-06 Hon Hai Precision Ind. Co., Ltd. Electronic device assembly having thermal module for heat dissipation
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD906989S1 (en) * 2017-05-03 2021-01-05 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD907592S1 (en) * 2017-05-03 2021-01-12 Fluence Bioengineering, Inc. Heat sink for a luminaire
USD950507S1 (en) * 2020-04-28 2022-05-03 Aic Inc. Heat sink

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