USD509482S1 - Heat sink cap - Google Patents
Heat sink cap Download PDFInfo
- Publication number
- USD509482S1 USD509482S1 US29/180,905 US18090503F USD509482S US D509482 S1 USD509482 S1 US D509482S1 US 18090503 F US18090503 F US 18090503F US D509482 S USD509482 S US D509482S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink cap
- cap
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a heat sink cap, in accordance with the present invention;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a heat sink cap, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92301246 | 2003-03-06 | ||
| TW92301246 | 2003-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD509482S1 true USD509482S1 (en) | 2005-09-13 |
Family
ID=34910176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/180,905 Expired - Lifetime USD509482S1 (en) | 2003-03-06 | 2003-05-02 | Heat sink cap |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD509482S1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD917402S1 (en) * | 2017-08-22 | 2021-04-27 | Foxconn Interconnect Technology Limited | Protective cap |
| USD1010803S1 (en) * | 2021-10-13 | 2024-01-09 | Johnson Electric Asti S.R.L. | Part of a cooling fan module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4679118A (en) * | 1984-08-07 | 1987-07-07 | Aavid Engineering, Inc. | Electronic chip-carrier heat sinks |
| US5081067A (en) * | 1989-02-10 | 1992-01-14 | Fujitsu Limited | Ceramic package type semiconductor device and method of assembling the same |
| US5295043A (en) * | 1992-02-03 | 1994-03-15 | Tandon Corporation | Clip-on heat sink and method of cooling a computer chip package |
| US5981310A (en) * | 1998-01-22 | 1999-11-09 | International Business Machines Corporation | Multi-chip heat-sink cap assembly |
| US6534859B1 (en) * | 2002-04-05 | 2003-03-18 | St. Assembly Test Services Ltd. | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package |
| US20040070069A1 (en) * | 2000-11-14 | 2004-04-15 | Jai Subramanian | Lid and heat spreader design for a semiconductor package |
| US6784113B2 (en) * | 1998-09-03 | 2004-08-31 | Micron Technology, Inc. | Chip on board and heat sink attachment methods |
-
2003
- 2003-05-02 US US29/180,905 patent/USD509482S1/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4679118A (en) * | 1984-08-07 | 1987-07-07 | Aavid Engineering, Inc. | Electronic chip-carrier heat sinks |
| US5081067A (en) * | 1989-02-10 | 1992-01-14 | Fujitsu Limited | Ceramic package type semiconductor device and method of assembling the same |
| US5295043A (en) * | 1992-02-03 | 1994-03-15 | Tandon Corporation | Clip-on heat sink and method of cooling a computer chip package |
| US5981310A (en) * | 1998-01-22 | 1999-11-09 | International Business Machines Corporation | Multi-chip heat-sink cap assembly |
| US6784113B2 (en) * | 1998-09-03 | 2004-08-31 | Micron Technology, Inc. | Chip on board and heat sink attachment methods |
| US20040070069A1 (en) * | 2000-11-14 | 2004-04-15 | Jai Subramanian | Lid and heat spreader design for a semiconductor package |
| US6534859B1 (en) * | 2002-04-05 | 2003-03-18 | St. Assembly Test Services Ltd. | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD917402S1 (en) * | 2017-08-22 | 2021-04-27 | Foxconn Interconnect Technology Limited | Protective cap |
| USD1010803S1 (en) * | 2021-10-13 | 2024-01-09 | Johnson Electric Asti S.R.L. | Part of a cooling fan module |
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