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USD492267S1 - Composite electronic component - Google Patents

Composite electronic component Download PDF

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Publication number
USD492267S1
USD492267S1 US29/190,733 US19073303F USD492267S US D492267 S1 USD492267 S1 US D492267S1 US 19073303 F US19073303 F US 19073303F US D492267 S USD492267 S US D492267S
Authority
US
United States
Prior art keywords
electronic component
composite electronic
composite
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/190,733
Inventor
Keiji Kawajiri
Tomohisa Okimoto
Eiichi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAWAJIRI, KEIJI, KOGA, EIICHI, OKIMOTO, TOMOHISA
Application granted granted Critical
Publication of USD492267S1 publication Critical patent/USD492267S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the front, bottom and left side of a composite electronic component showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.

Claims (1)

  1. The ornamental design for a composite electronic component, as shown and described.
US29/190,733 2003-03-26 2003-09-25 Composite electronic component Expired - Lifetime USD492267S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003008181 2003-03-26
JP2003-008181 2003-03-26

Publications (1)

Publication Number Publication Date
USD492267S1 true USD492267S1 (en) 2004-06-29

Family

ID=32501263

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/190,733 Expired - Lifetime USD492267S1 (en) 2003-03-26 2003-09-25 Composite electronic component

Country Status (1)

Country Link
US (1) USD492267S1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD522451S1 (en) * 2005-04-14 2006-06-06 Microsoft Corporation Housing for a battery
USD544832S1 (en) * 2003-10-27 2007-06-19 Nokia Corporation Portion of a battery
USD546276S1 (en) * 2003-11-12 2007-07-10 Nokia Corporation Portion of a battery
USD584733S1 (en) * 2007-08-23 2009-01-13 Dell Products L.P. Storage device enclosure
USD590337S1 (en) * 2008-01-23 2009-04-14 Sony Corporation Rechargeable battery
US7608919B1 (en) 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems
USD618171S1 (en) 2008-01-23 2010-06-22 Sony Corporation Rechargeable battery
USD676851S1 (en) * 2012-03-16 2013-02-26 Sean W. Finnegan Tablet style computer handle
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
USD845235S1 (en) * 2017-10-25 2019-04-09 Chuwi Innovation And Technology (Shenzhen) Co., Ltd. Charger

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD298031S (en) 1985-04-19 1988-10-11 Channell William H Housing for electronic equipment for cable television installation
US5034709A (en) 1988-11-17 1991-07-23 Murata Manufacturing Co., Ltd. Composite electronic component
USD349687S (en) 1990-04-13 1994-08-16 Motorola, Inc. Radio frequency switch box
US5493769A (en) 1993-08-05 1996-02-27 Murata Manufacturing Co., Ltd. Method of manufacturing electronic component and measuring characteristics of same
US5644107A (en) 1992-07-27 1997-07-01 Murata Manufacturing Co., Ltd. Method of manufacturing a multilayer electronic component
US6380619B2 (en) 1998-03-31 2002-04-30 Tdk Corporation Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate
US6392297B2 (en) 1996-03-29 2002-05-21 Tokin Corporation Electronic circuit element of conductor/insulator stacked type using high machinability substrate and benzocyclobutene as insulator
US6525395B1 (en) 1999-10-19 2003-02-25 Murata Manufacturing Co., Ltd. Chip-type composite electronic component and manufacturing method thereof
US6700061B2 (en) 2000-10-17 2004-03-02 Murata Manufacturing Co., Ltd. Composite electronic component

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD298031S (en) 1985-04-19 1988-10-11 Channell William H Housing for electronic equipment for cable television installation
US5034709A (en) 1988-11-17 1991-07-23 Murata Manufacturing Co., Ltd. Composite electronic component
USD349687S (en) 1990-04-13 1994-08-16 Motorola, Inc. Radio frequency switch box
US5644107A (en) 1992-07-27 1997-07-01 Murata Manufacturing Co., Ltd. Method of manufacturing a multilayer electronic component
US5493769A (en) 1993-08-05 1996-02-27 Murata Manufacturing Co., Ltd. Method of manufacturing electronic component and measuring characteristics of same
US6392297B2 (en) 1996-03-29 2002-05-21 Tokin Corporation Electronic circuit element of conductor/insulator stacked type using high machinability substrate and benzocyclobutene as insulator
US6380619B2 (en) 1998-03-31 2002-04-30 Tdk Corporation Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate
US6525395B1 (en) 1999-10-19 2003-02-25 Murata Manufacturing Co., Ltd. Chip-type composite electronic component and manufacturing method thereof
US6700061B2 (en) 2000-10-17 2004-03-02 Murata Manufacturing Co., Ltd. Composite electronic component

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8021965B1 (en) 2003-09-04 2011-09-20 University Of Norte Dame Du Lac Inter-chip communication
US10410989B2 (en) 2003-09-04 2019-09-10 University Of Notre Dame Du Lac Inter-chip alignment
US7608919B1 (en) 2003-09-04 2009-10-27 University Of Notre Dame Du Lac Interconnect packaging systems
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
US8623700B1 (en) 2003-09-04 2014-01-07 University Of Notre Dame Du Lac Inter-chip communication
USD544832S1 (en) * 2003-10-27 2007-06-19 Nokia Corporation Portion of a battery
USD546276S1 (en) * 2003-11-12 2007-07-10 Nokia Corporation Portion of a battery
USD522451S1 (en) * 2005-04-14 2006-06-06 Microsoft Corporation Housing for a battery
USD584733S1 (en) * 2007-08-23 2009-01-13 Dell Products L.P. Storage device enclosure
USD618171S1 (en) 2008-01-23 2010-06-22 Sony Corporation Rechargeable battery
USD590337S1 (en) * 2008-01-23 2009-04-14 Sony Corporation Rechargeable battery
USD676851S1 (en) * 2012-03-16 2013-02-26 Sean W. Finnegan Tablet style computer handle
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
USD845235S1 (en) * 2017-10-25 2019-04-09 Chuwi Innovation And Technology (Shenzhen) Co., Ltd. Charger

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