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USD473354S1 - Vacuum processing equipment configuration - Google Patents

Vacuum processing equipment configuration Download PDF

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Publication number
USD473354S1
USD473354S1 US29/099,071 US9907199F USD473354S US D473354 S1 USD473354 S1 US D473354S1 US 9907199 F US9907199 F US 9907199F US D473354 S USD473354 S US D473354S
Authority
US
United States
Prior art keywords
processing equipment
vacuum processing
equipment configuration
side elevational
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/099,071
Inventor
Shigekazu Kato
Kouji Nishihata
Tsunehiko Tsubone
Atsushi Itou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to US29/099,071 priority Critical patent/USD473354S1/en
Assigned to HITACHI, LTD. reassignment HITACHI, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ITOU, ATSUSHI, KATO, SHIGEKAZU, NISHIHATA, KOUJI, TSUBONE, TSUNEHIKO
Application granted granted Critical
Publication of USD473354S1 publication Critical patent/USD473354S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is front, top and right side perspective view of cassettes storage eguipment in relation to a conveyor equipped robot and load and unload chambers showing our new design;
FIG. 2 is a top plan view;
FIG. 3 is a front side elevational view;
FIG. 4 is a right side elevational view;
FIG. 5 is a rear side elevational view;
FIG. 6 is a left side elevational view;
FIG. 7 is a bottom plan view; and,
FIG. 8 is a right side elevational view along line 8—8 of FIG. 2.
The details shown in broken lines in all views is for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a vacuum processing equipment configuration, as shown and described.
US29/099,071 1990-08-29 1999-01-12 Vacuum processing equipment configuration Expired - Lifetime USD473354S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/099,071 USD473354S1 (en) 1990-08-29 1999-01-12 Vacuum processing equipment configuration

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP22532190 1990-08-29
JP02-225321 1990-08-29
US75195191 1991-08-29
US9625693 1993-07-26
US30244394 1994-09-09
US44303995 1995-05-17
US59387096 1996-01-30
US88273197 1997-06-26
US6106298 1998-04-16
US29/099,071 USD473354S1 (en) 1990-08-29 1999-01-12 Vacuum processing equipment configuration

Publications (1)

Publication Number Publication Date
USD473354S1 true USD473354S1 (en) 2003-04-15

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Family Applications (1)

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US29/099,071 Expired - Lifetime USD473354S1 (en) 1990-08-29 1999-01-12 Vacuum processing equipment configuration

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US (1) USD473354S1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD818226S1 (en) * 2015-12-03 2018-05-15 Lg Electronics Inc. Robot vacuum cleaner
USD828660S1 (en) * 2016-06-08 2018-09-11 Lg Electronics Inc. Robot vacuum cleaner
USD840620S1 (en) * 2016-11-18 2019-02-12 Lg Electronics Inc. Robot for cleaning
USD840618S1 (en) * 2016-11-30 2019-02-12 Lg Electronics Inc. Robot for cleaning
USD840619S1 (en) * 2016-11-23 2019-02-12 Lg Electronics Inc. Robot for cleaning
USD877994S1 (en) * 2018-01-12 2020-03-10 Lg Electronics Inc. Robot for cleaning
USD901110S1 (en) * 2018-11-08 2020-11-03 Beijing Xiaomi Mobile Software Co., Ltd. Robot cleaner
USD929690S1 (en) * 2019-03-18 2021-08-31 Beijing Xiaomi Mobile Software Co., Ltd. Sweeper
USD936719S1 (en) * 2019-02-20 2021-11-23 Lg Electronics Inc. Home hub robot
USD940771S1 (en) * 2019-08-15 2022-01-11 Beijing Xiaomi Mobile Software Co., Ltd. Robot vacuum cleaner

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US3652444A (en) 1969-10-24 1972-03-28 Ibm Continuous vacuum process apparatus
US3981791A (en) 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US4138306A (en) 1976-08-31 1979-02-06 Tokyo Shibaura Electric Co., Ltd. Apparatus for the treatment of semiconductors
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US4318767A (en) 1979-11-27 1982-03-09 Tokyo Ohka Kogyo Kabushiki Kaisha Apparatus for the treatment of semiconductor wafers by plasma reaction
US4449885A (en) 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
US4457661A (en) 1981-12-07 1984-07-03 Applied Materials, Inc. Wafer loading apparatus
US4534314A (en) 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
US4563240A (en) 1983-08-10 1986-01-07 Hitachi, Ltd. Method and apparatus for plasma process
US4576698A (en) 1983-06-30 1986-03-18 International Business Machines Corporation Plasma etch cleaning in low pressure chemical vapor deposition systems
US4634331A (en) 1982-05-24 1987-01-06 Varian Associates, Inc. Wafer transfer system
US4705951A (en) 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system
EP0246453A2 (en) 1986-04-18 1987-11-25 General Signal Corporation Novel multiple-processing and contamination-free plasma etching system
US4715764A (en) 1986-04-28 1987-12-29 Varian Associates, Inc. Gate valve for wafer processing system
US4836733A (en) 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US4836905A (en) 1987-07-16 1989-06-06 Texas Instruments Incorporated Processing apparatus
US4851101A (en) 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
US4895107A (en) 1987-07-06 1990-01-23 Kabushiki Kaisha Toshiba Photo chemical reaction apparatus
US4902934A (en) 1987-03-30 1990-02-20 Sumitomo Metal Industries, Ltd. Plasma apparatus
US4903937A (en) 1987-09-24 1990-02-27 Varian Associates, Inc. Isolation valve for vacuum and non-vacuum application
US4909695A (en) 1986-04-04 1990-03-20 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4911597A (en) 1985-01-22 1990-03-27 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
US4915564A (en) 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
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US4924890A (en) 1986-05-16 1990-05-15 Eastman Kodak Company Method and apparatus for cleaning semiconductor wafers
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US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US4969790A (en) 1987-08-12 1990-11-13 Leybold Aktiengesellschaft Apparatus on the carousel principle for the coating of substrates
US5007981A (en) 1989-02-27 1991-04-16 Hitachi, Ltd. Method of removing residual corrosive compounds by plasma etching followed by washing
US5014217A (en) 1989-02-09 1991-05-07 S C Technology, Inc. Apparatus and method for automatically identifying chemical species within a plasma reactor environment
US5292393A (en) 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
EP0381338B1 (en) 1989-01-28 1994-06-22 Kokusai Electric Co., Ltd. Method and apparatus for the transfer of wafers in a vertical cvd diffusion apparatus
US5351415A (en) 1992-05-18 1994-10-04 Convey, Inc. Method and apparatus for maintaining clean articles
US5452166A (en) 1993-10-01 1995-09-19 Applied Magnetics Corporation Thin film magnetic recording head for minimizing undershoots and a method for manufacturing the same
US5462397A (en) 1993-03-16 1995-10-31 Tokyo Electron Limited Processing apparatus
US5504347A (en) 1994-10-17 1996-04-02 Texas Instruments Incorporated Lateral resonant tunneling device having gate electrode aligned with tunneling barriers
US5504033A (en) 1992-08-26 1996-04-02 Harris Corporation Method for forming recessed oxide isolation containing deep and shallow trenches
US5509771A (en) 1992-07-29 1996-04-23 Tokyo Electron Limited Vacuum processing apparatus
US5556714A (en) 1989-08-28 1996-09-17 Hitachi, Ltd. Method of treating samples
US5651858A (en) 1995-03-06 1997-07-29 Motorola Inc. Method for forming a tapered opening in silicon
US5685684A (en) 1990-11-26 1997-11-11 Hitachi, Ltd. Vacuum processing system

Patent Citations (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3652444A (en) 1969-10-24 1972-03-28 Ibm Continuous vacuum process apparatus
US3981791A (en) 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US4138306A (en) 1976-08-31 1979-02-06 Tokyo Shibaura Electric Co., Ltd. Apparatus for the treatment of semiconductors
US4226897A (en) 1977-12-05 1980-10-07 Plasma Physics Corporation Method of forming semiconducting materials and barriers
US4313815A (en) 1978-04-07 1982-02-02 Varian Associates, Inc. Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor
US4318767A (en) 1979-11-27 1982-03-09 Tokyo Ohka Kogyo Kabushiki Kaisha Apparatus for the treatment of semiconductor wafers by plasma reaction
US4311427A (en) 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US4313783A (en) 1980-05-19 1982-02-02 Branson International Plasma Corporation Computer controlled system for processing semiconductor wafers
US4457661A (en) 1981-12-07 1984-07-03 Applied Materials, Inc. Wafer loading apparatus
US4634331A (en) 1982-05-24 1987-01-06 Varian Associates, Inc. Wafer transfer system
US4449885A (en) 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
US4576698A (en) 1983-06-30 1986-03-18 International Business Machines Corporation Plasma etch cleaning in low pressure chemical vapor deposition systems
US4563240A (en) 1983-08-10 1986-01-07 Hitachi, Ltd. Method and apparatus for plasma process
US4534314A (en) 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
US4911597A (en) 1985-01-22 1990-03-27 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
US4909695A (en) 1986-04-04 1990-03-20 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4915564A (en) 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4705951A (en) 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system
EP0246453A2 (en) 1986-04-18 1987-11-25 General Signal Corporation Novel multiple-processing and contamination-free plasma etching system
US4715764A (en) 1986-04-28 1987-12-29 Varian Associates, Inc. Gate valve for wafer processing system
US4836733A (en) 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US4917556A (en) 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4924890A (en) 1986-05-16 1990-05-15 Eastman Kodak Company Method and apparatus for cleaning semiconductor wafers
US5292393A (en) 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US4902934A (en) 1987-03-30 1990-02-20 Sumitomo Metal Industries, Ltd. Plasma apparatus
US4895107A (en) 1987-07-06 1990-01-23 Kabushiki Kaisha Toshiba Photo chemical reaction apparatus
US4836905A (en) 1987-07-16 1989-06-06 Texas Instruments Incorporated Processing apparatus
US4969790A (en) 1987-08-12 1990-11-13 Leybold Aktiengesellschaft Apparatus on the carousel principle for the coating of substrates
US4851101A (en) 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
US4903937A (en) 1987-09-24 1990-02-27 Varian Associates, Inc. Isolation valve for vacuum and non-vacuum application
EP0381338B1 (en) 1989-01-28 1994-06-22 Kokusai Electric Co., Ltd. Method and apparatus for the transfer of wafers in a vertical cvd diffusion apparatus
US4936329A (en) 1989-02-08 1990-06-26 Leybold Aktiengesellschaft Device for cleaning, testing and sorting of workpieces
US5014217A (en) 1989-02-09 1991-05-07 S C Technology, Inc. Apparatus and method for automatically identifying chemical species within a plasma reactor environment
US5007981A (en) 1989-02-27 1991-04-16 Hitachi, Ltd. Method of removing residual corrosive compounds by plasma etching followed by washing
US5556714A (en) 1989-08-28 1996-09-17 Hitachi, Ltd. Method of treating samples
US5685684A (en) 1990-11-26 1997-11-11 Hitachi, Ltd. Vacuum processing system
US5351415A (en) 1992-05-18 1994-10-04 Convey, Inc. Method and apparatus for maintaining clean articles
US5509771A (en) 1992-07-29 1996-04-23 Tokyo Electron Limited Vacuum processing apparatus
US5504033A (en) 1992-08-26 1996-04-02 Harris Corporation Method for forming recessed oxide isolation containing deep and shallow trenches
US5462397A (en) 1993-03-16 1995-10-31 Tokyo Electron Limited Processing apparatus
US5675461A (en) 1993-10-01 1997-10-07 Applied Magnetics Corporation Thin film magnetic recording head for minimizing undershoots
US5452166A (en) 1993-10-01 1995-09-19 Applied Magnetics Corporation Thin film magnetic recording head for minimizing undershoots and a method for manufacturing the same
US5504347A (en) 1994-10-17 1996-04-02 Texas Instruments Incorporated Lateral resonant tunneling device having gate electrode aligned with tunneling barriers
US5651858A (en) 1995-03-06 1997-07-29 Motorola Inc. Method for forming a tapered opening in silicon

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
R.P.H. Chang, "Multipurpose plasma reactor for materials research and processing", J. Vac. Sci. Technol., vol. 14, No. 1, Jan./Feb. 1977, pp. 278-280.
Semiconductor Equipment Association of Japan, "Semiconductor News", vol. 4, pp. 38-43, Apr. 10, 1987 (w/translation).
Semiconductor Equipment Association of Japan, Terminological Dictionary of Semiconductor Equipment), front, table, p. 183, back, Nov. 20, 1987.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD818226S1 (en) * 2015-12-03 2018-05-15 Lg Electronics Inc. Robot vacuum cleaner
USD828660S1 (en) * 2016-06-08 2018-09-11 Lg Electronics Inc. Robot vacuum cleaner
USD840620S1 (en) * 2016-11-18 2019-02-12 Lg Electronics Inc. Robot for cleaning
USD840619S1 (en) * 2016-11-23 2019-02-12 Lg Electronics Inc. Robot for cleaning
USD840618S1 (en) * 2016-11-30 2019-02-12 Lg Electronics Inc. Robot for cleaning
USD877994S1 (en) * 2018-01-12 2020-03-10 Lg Electronics Inc. Robot for cleaning
USD901110S1 (en) * 2018-11-08 2020-11-03 Beijing Xiaomi Mobile Software Co., Ltd. Robot cleaner
USD936719S1 (en) * 2019-02-20 2021-11-23 Lg Electronics Inc. Home hub robot
USD929690S1 (en) * 2019-03-18 2021-08-31 Beijing Xiaomi Mobile Software Co., Ltd. Sweeper
USD940771S1 (en) * 2019-08-15 2022-01-11 Beijing Xiaomi Mobile Software Co., Ltd. Robot vacuum cleaner

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