[go: up one dir, main page]

USD404374S - Fin for use in a semiconductor wafer heat processing apparatus - Google Patents

Fin for use in a semiconductor wafer heat processing apparatus Download PDF

Info

Publication number
USD404374S
USD404374S US29/083,717 US8371798F USD404374S US D404374 S USD404374 S US D404374S US 8371798 F US8371798 F US 8371798F US D404374 S USD404374 S US D404374S
Authority
US
United States
Prior art keywords
fin
processing apparatus
semiconductor wafer
heat processing
wafer heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/083,717
Inventor
Norifumi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIMURA, NORIFUMI
Application granted granted Critical
Publication of USD404374S publication Critical patent/USD404374S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 a perspective view of fin for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a right side view thereof;
FIG. 3 a front elevational view thereof;
FIG. 4 a top plan view thereof;
FIG. 5 a bottom plan view thereof;
FIG. 6 a cross-sectional view taken along line VI--VI in FIG. 3;
FIG. 7 a cross-sectional view taken along line VII--VII in FIG. 3; and,
FIG. 8 a cross-sectional view taken along line VIII--VIII in FIG. 3.

Claims (1)

  1. I claim the ornamental design for a fin for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/083,717 1997-08-20 1998-02-12 Fin for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD404374S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6510497 1997-08-20
JP9-65104 1997-08-20

Publications (1)

Publication Number Publication Date
USD404374S true USD404374S (en) 1999-01-19

Family

ID=71729424

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/083,717 Expired - Lifetime USD404374S (en) 1997-08-20 1998-02-12 Fin for use in a semiconductor wafer heat processing apparatus

Country Status (1)

Country Link
US (1) USD404374S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus

Similar Documents

Publication Publication Date Title
USD404372S (en) Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) Cap for use in a semiconductor wafer heat processing apparatus
USD409158S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD405431S (en) Tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) Processing tube for use in a semiconductor wafer heat processing apparatus
USD396847S (en) Semiconductor device
USD452130S1 (en) Handle
USD407696S (en) Inner tube for use in a semiconductor wafer heat processing apparatus
USD428427S (en) Soldering station
USD463641S1 (en) Steam station base
USD405429S (en) Processing tube for use in a semiconductor wafer heat processing apparatus
USD396846S (en) Semiconductor device
USD404015S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404369S (en) Manifold cover for use in a semiconductor wafer heat processing apparatus
USD406113S (en) Processing tube for use in a semiconductor wafer heat processing apparatus
USD405430S (en) Inner tube for use in a semiconductor wafer heat processing apparatus
USD381011S (en) Heat sink
USD418485S (en) Semiconductor device
USD404368S (en) Outer tube for use in a semiconductor wafer heat processing apparatus
USD430362S (en) Protective elbow pad
USD415435S (en) Temperature controller for soldering irons
USD428859S (en) Semiconductor device
USD421969S (en) Semiconductor device