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USD1109284S1 - Flow control ring - Google Patents

Flow control ring

Info

Publication number
USD1109284S1
USD1109284S1 US29/946,376 US202429946376F USD1109284S US D1109284 S1 USD1109284 S1 US D1109284S1 US 202429946376 F US202429946376 F US 202429946376F US D1109284 S USD1109284 S US D1109284S
Authority
US
United States
Prior art keywords
flow control
control ring
view
ring
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/946,376
Inventor
Changyu Meng
Shuyang Zhang
Jereld Lee Winkler
Estiaque Haidar Shourov
Mojtaba Samiee
Jian-Wei Liang
Ziad Marwan Naboulsi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM IP Holding BV
Original Assignee
ASM IP Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM IP Holding BV filed Critical ASM IP Holding BV
Priority to US29/946,376 priority Critical patent/USD1109284S1/en
Priority to TW113306296F priority patent/TWD239406S/en
Priority to JP2024025054F priority patent/JP1794186S/en
Application granted granted Critical
Publication of USD1109284S1 publication Critical patent/USD1109284S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of the flow control ring, showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a back view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a top view thereof;
FIG. 8 is a bottom view thereof; and,
FIG. 9 is a cross section taken from FIG. 1 .

Claims (1)

    CLAIM
  1. The ornamental design of a flow control ring as shown and described.
US29/946,376 2024-06-07 2024-06-07 Flow control ring Active USD1109284S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/946,376 USD1109284S1 (en) 2024-06-07 2024-06-07 Flow control ring
TW113306296F TWD239406S (en) 2024-06-07 2024-11-29 Flow control ring
JP2024025054F JP1794186S (en) 2024-06-07 2024-12-04 Flow Control Ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/946,376 USD1109284S1 (en) 2024-06-07 2024-06-07 Flow control ring

Publications (1)

Publication Number Publication Date
USD1109284S1 true USD1109284S1 (en) 2026-01-13

Family

ID=95070847

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/946,376 Active USD1109284S1 (en) 2024-06-07 2024-06-07 Flow control ring

Country Status (3)

Country Link
US (1) USD1109284S1 (en)
JP (1) JP1794186S (en)
TW (1) TWD239406S (en)

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KR20050050685A (en) 2003-11-26 2005-06-01 삼성전자주식회사 Plasma processing apparatus
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US20060283551A1 (en) 2005-06-17 2006-12-21 Sung-Ku Son Confinement ring assembly of plasma processing apparatus
JP3867616B2 (en) 2002-04-19 2007-01-10 株式会社日立製作所 Semiconductor manufacturing apparatus and method
KR20070008766A (en) 2005-07-12 2007-01-18 삼성전자주식회사 Semiconductor manufacturing equipment
US20070022959A1 (en) 2005-07-29 2007-02-01 Craig Bercaw Deposition apparatus for semiconductor processing
WO2007076195A2 (en) 2005-11-22 2007-07-05 Genus, Inc. Small volume symmetric flow single wafer ald apparatus
US20080072821A1 (en) 2006-07-21 2008-03-27 Dalton Jeremic J Small volume symmetric flow single wafer ald apparatus
USD573711S1 (en) * 2007-03-01 2008-07-22 Ethicon Endo-Surgery, Inc. Iris valve ring
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
USD605739S1 (en) * 2009-01-23 2009-12-08 Victaulic Company Gasket
USD607091S1 (en) * 2007-01-10 2009-12-29 Victaulic Company Valve seat
US20100012036A1 (en) 2008-07-11 2010-01-21 Hugo Silva Isolation for multi-single-wafer processing apparatus
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US20100252200A1 (en) 2009-04-06 2010-10-07 Alexei Marakhtanov Grounded confinement ring having large surface area
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
US20110223334A1 (en) 2010-03-12 2011-09-15 Applied Materials, Inc. Atomic layer deposition chamber with multi inject
USD646764S1 (en) * 2010-11-04 2011-10-11 Faster S.P.A. Sealing gasket
US8043430B2 (en) 2006-12-20 2011-10-25 Lam Research Corporation Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber
US20120009765A1 (en) 2010-07-12 2012-01-12 Applied Materials, Inc. Compartmentalized chamber
US20120024479A1 (en) 2010-07-30 2012-02-02 Applied Materials, Inc. Apparatus for controlling the flow of a gas in a process chamber
USD655401S1 (en) * 2009-08-10 2012-03-06 Nippon Valqua Industries, Ltd. Hybrid seal member
USD655797S1 (en) * 2010-03-24 2012-03-13 Nippon Valqua Industries, Ltd. Hybrid seal member
US8216376B1 (en) 2009-01-15 2012-07-10 Intermolecular, Inc. Method and apparatus for variable conductance
US8440019B2 (en) 2008-04-07 2013-05-14 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8486821B1 (en) 2012-06-05 2013-07-16 Intermolecular, Inc. Method and apparatus for variable conductance
US8522715B2 (en) 2008-01-08 2013-09-03 Lam Research Corporation Methods and apparatus for a wide conductance kit
US20140076234A1 (en) 2004-02-26 2014-03-20 Applied Materials, Inc. Multi chamber processing system
US20150155187A1 (en) 2013-12-04 2015-06-04 Lam Research Corporation Annular baffle for pumping from above a plane of the semiconductor wafer support
US20150325414A1 (en) 2009-09-28 2015-11-12 Lam Research Corporation Unitized confinement ring arrangements and methods thereof
USD743513S1 (en) * 2014-06-13 2015-11-17 Asm Ip Holding B.V. Seal ring
TWI524416B (en) 2009-08-31 2016-03-01 蘭姆研究公司 A local plasma confinement and pressure control arrangement and methods thereof
KR20170127239A (en) 2016-05-11 2017-11-21 전북대학교산학협력단 Apparatus for manufacturing epitaxial wafer
US9837250B2 (en) 2013-08-30 2017-12-05 Applied Materials, Inc. Hot wall reactor with cooled vacuum containment
US20190136375A1 (en) 2013-02-11 2019-05-09 Globalwafers Co., Ltd. Liner assemblies for substrate processing systems
US10347470B2 (en) 2013-12-29 2019-07-09 Beijing Naura Microelectronics Equipment Co., Ltd. Process chamber and semiconductor processing apparatus
US10529577B2 (en) 2014-12-10 2020-01-07 Advanced Micro-Fabrication Equipment Inc. China Device of changing gas flow pattern and a wafer processing method and apparatus
US20200075295A1 (en) 2018-08-28 2020-03-05 Lam Research Corporation Confinement ring with extended life
US20210166924A1 (en) 2019-11-29 2021-06-03 Asm Ip Holding B.V. Substrate processing apparatus
US20210166925A1 (en) 2019-11-29 2021-06-03 Asm Ip Holding B.V. Substrate processing apparatus
US20220243322A1 (en) 2021-01-29 2022-08-04 Asm Ip Holding B.V. Substrate processing apparatus
US11417545B2 (en) 2017-08-08 2022-08-16 Asm Ip Holding B.V. Radiation shield
US20220259731A1 (en) 2021-02-16 2022-08-18 Asm Ip Holding B.V. Substrate processing apparatus with flow control ring, and substrate processing method
US20220336240A1 (en) 2021-04-20 2022-10-20 Asm Ip Holding B.V. Semiconductor processing apparatus
US20230024132A1 (en) 2020-01-10 2023-01-26 Picosun Oy Substrate processing apparatus and method
CN112908821B (en) 2019-12-04 2023-03-31 中微半导体设备(上海)股份有限公司 Double-station processor for realizing uniform exhaust and exhaust method thereof
US20230113063A1 (en) 2021-10-11 2023-04-13 Applied Materials, Inc. Dynamic processing chamber baffle
US20230411176A1 (en) 2022-06-21 2023-12-21 Asm Ip Holding B.V. Reaction chamber for processing semiconductor substrates with gas flow control capability

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD876504S1 (en) 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus

Patent Citations (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD244533S (en) * 1975-06-11 1977-05-31 Ite Imperial Corporation Water resistant gasket for conduits and the like
US5389197A (en) 1992-01-29 1995-02-14 Fujitsu Limited Method of and apparatus for plasma processing of wafer
US20030092266A1 (en) 1993-07-30 2003-05-15 Anderson Roger N. Gas inlets for wafer processing chamber
US5685914A (en) 1994-04-05 1997-11-11 Applied Materials, Inc. Focus ring for semiconductor wafer processing in a plasma reactor
US5468298A (en) 1994-04-13 1995-11-21 Applied Materials, Inc. Bottom purge manifold for CVD tungsten process
USD376206S (en) * 1995-03-24 1996-12-03 Republic Medical Inc. Heart valve locking ring
US5891348A (en) 1996-01-26 1999-04-06 Applied Materials, Inc. Process gas focusing apparatus and method
USD471981S1 (en) * 1997-09-03 2003-03-18 Republic Medical Products Inc. Heart valve stiffening ring
US6261408B1 (en) 2000-02-16 2001-07-17 Applied Materials, Inc. Method and apparatus for semiconductor processing chamber pressure control
US6433484B1 (en) 2000-08-11 2002-08-13 Lam Research Corporation Wafer area pressure control
US20030084849A1 (en) 2001-11-05 2003-05-08 Jusung Engineering Co., Ltd. Apparatus for chemical vapor deposition
JP3867616B2 (en) 2002-04-19 2007-01-10 株式会社日立製作所 Semiconductor manufacturing apparatus and method
US6716287B1 (en) 2002-10-18 2004-04-06 Applied Materials Inc. Processing chamber with flow-restricting ring
KR20050050685A (en) 2003-11-26 2005-06-01 삼성전자주식회사 Plasma processing apparatus
US20140076234A1 (en) 2004-02-26 2014-03-20 Applied Materials, Inc. Multi chamber processing system
US20050224180A1 (en) 2004-04-08 2005-10-13 Applied Materials, Inc. Apparatus for controlling gas flow in a semiconductor substrate processing chamber
US20060283551A1 (en) 2005-06-17 2006-12-21 Sung-Ku Son Confinement ring assembly of plasma processing apparatus
KR20070008766A (en) 2005-07-12 2007-01-18 삼성전자주식회사 Semiconductor manufacturing equipment
US20070022959A1 (en) 2005-07-29 2007-02-01 Craig Bercaw Deposition apparatus for semiconductor processing
WO2007076195A2 (en) 2005-11-22 2007-07-05 Genus, Inc. Small volume symmetric flow single wafer ald apparatus
US20080072821A1 (en) 2006-07-21 2008-03-27 Dalton Jeremic J Small volume symmetric flow single wafer ald apparatus
US8043430B2 (en) 2006-12-20 2011-10-25 Lam Research Corporation Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber
USD607091S1 (en) * 2007-01-10 2009-12-29 Victaulic Company Valve seat
USD614271S1 (en) * 2007-01-10 2010-04-20 Victaulic Company Valve seat
USD573711S1 (en) * 2007-03-01 2008-07-22 Ethicon Endo-Surgery, Inc. Iris valve ring
US8522715B2 (en) 2008-01-08 2013-09-03 Lam Research Corporation Methods and apparatus for a wide conductance kit
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US8440019B2 (en) 2008-04-07 2013-05-14 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US20100012036A1 (en) 2008-07-11 2010-01-21 Hugo Silva Isolation for multi-single-wafer processing apparatus
US20100081284A1 (en) 2008-09-29 2010-04-01 Applied Materials, Inc. Methods and apparatus for improving flow uniformity in a process chamber
US8216376B1 (en) 2009-01-15 2012-07-10 Intermolecular, Inc. Method and apparatus for variable conductance
USD614272S1 (en) * 2009-01-23 2010-04-20 Victaulic Company Gasket
USD605739S1 (en) * 2009-01-23 2009-12-08 Victaulic Company Gasket
US20100252200A1 (en) 2009-04-06 2010-10-07 Alexei Marakhtanov Grounded confinement ring having large surface area
USD655401S1 (en) * 2009-08-10 2012-03-06 Nippon Valqua Industries, Ltd. Hybrid seal member
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
TWI524416B (en) 2009-08-31 2016-03-01 蘭姆研究公司 A local plasma confinement and pressure control arrangement and methods thereof
US20150325414A1 (en) 2009-09-28 2015-11-12 Lam Research Corporation Unitized confinement ring arrangements and methods thereof
US20110223334A1 (en) 2010-03-12 2011-09-15 Applied Materials, Inc. Atomic layer deposition chamber with multi inject
USD655797S1 (en) * 2010-03-24 2012-03-13 Nippon Valqua Industries, Ltd. Hybrid seal member
US20120009765A1 (en) 2010-07-12 2012-01-12 Applied Materials, Inc. Compartmentalized chamber
US20120024479A1 (en) 2010-07-30 2012-02-02 Applied Materials, Inc. Apparatus for controlling the flow of a gas in a process chamber
USD646764S1 (en) * 2010-11-04 2011-10-11 Faster S.P.A. Sealing gasket
US8486821B1 (en) 2012-06-05 2013-07-16 Intermolecular, Inc. Method and apparatus for variable conductance
US20190136375A1 (en) 2013-02-11 2019-05-09 Globalwafers Co., Ltd. Liner assemblies for substrate processing systems
US9837250B2 (en) 2013-08-30 2017-12-05 Applied Materials, Inc. Hot wall reactor with cooled vacuum containment
US20150155187A1 (en) 2013-12-04 2015-06-04 Lam Research Corporation Annular baffle for pumping from above a plane of the semiconductor wafer support
US10347470B2 (en) 2013-12-29 2019-07-09 Beijing Naura Microelectronics Equipment Co., Ltd. Process chamber and semiconductor processing apparatus
USD743513S1 (en) * 2014-06-13 2015-11-17 Asm Ip Holding B.V. Seal ring
US10529577B2 (en) 2014-12-10 2020-01-07 Advanced Micro-Fabrication Equipment Inc. China Device of changing gas flow pattern and a wafer processing method and apparatus
KR20170127239A (en) 2016-05-11 2017-11-21 전북대학교산학협력단 Apparatus for manufacturing epitaxial wafer
US11417545B2 (en) 2017-08-08 2022-08-16 Asm Ip Holding B.V. Radiation shield
US20200075295A1 (en) 2018-08-28 2020-03-05 Lam Research Corporation Confinement ring with extended life
US20210166924A1 (en) 2019-11-29 2021-06-03 Asm Ip Holding B.V. Substrate processing apparatus
US20210166925A1 (en) 2019-11-29 2021-06-03 Asm Ip Holding B.V. Substrate processing apparatus
CN112908821B (en) 2019-12-04 2023-03-31 中微半导体设备(上海)股份有限公司 Double-station processor for realizing uniform exhaust and exhaust method thereof
US20230024132A1 (en) 2020-01-10 2023-01-26 Picosun Oy Substrate processing apparatus and method
US20220243322A1 (en) 2021-01-29 2022-08-04 Asm Ip Holding B.V. Substrate processing apparatus
US20220259731A1 (en) 2021-02-16 2022-08-18 Asm Ip Holding B.V. Substrate processing apparatus with flow control ring, and substrate processing method
US20220336240A1 (en) 2021-04-20 2022-10-20 Asm Ip Holding B.V. Semiconductor processing apparatus
US20230113063A1 (en) 2021-10-11 2023-04-13 Applied Materials, Inc. Dynamic processing chamber baffle
US20230411176A1 (en) 2022-06-21 2023-12-21 Asm Ip Holding B.V. Reaction chamber for processing semiconductor substrates with gas flow control capability

Also Published As

Publication number Publication date
JP1794186S (en) 2025-03-24
TWD239406S (en) 2025-07-11

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