US8235500B2 - Cast-in place ink feed structure using encapsulant - Google Patents
Cast-in place ink feed structure using encapsulant Download PDFInfo
- Publication number
- US8235500B2 US8235500B2 US12/773,191 US77319110A US8235500B2 US 8235500 B2 US8235500 B2 US 8235500B2 US 77319110 A US77319110 A US 77319110A US 8235500 B2 US8235500 B2 US 8235500B2
- Authority
- US
- United States
- Prior art keywords
- print head
- nozzle plate
- sacrificial material
- die
- head substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/76—Making other particular articles writing or drawing instruments, e.g. writing pens, erasing pens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
- B41J2/15—Arrangement thereof for serial printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Definitions
- the present invention generally relates to an ink jet print head, and more particularly, forming a fluid interconnect for a printing element.
- passageways are provided to connect an ink supply, such as a reservoir, to nozzle outlets in the print head.
- These passageways can be made at the edge of a die, or through holes in a bottom surface of the die. Feeding ink from a bottom of the device can use valuable space in the device and feeding ink from the edge can require an architecturally complicated device.
- FIGS. 1A and 1B An example of a typical fluidic micro-electromechanical system (MEMS) print head device 100 is illustrated in FIGS. 1A and 1B at sequential stages of assembly.
- FIG. 1A illustrates a silicon wafer 110 supporting a transducer 112 and a bond pad 114 .
- a fluid chamber 160 is formed on the silicon wafer 110 by a nozzle plate 130 distanced from the silicon wafer 110 with generalized support member 150 .
- At least one nozzle opening 140 is formed in the nozzle plate 130 and at least one fluid inlet 120 is formed in the silicon wafer 110 .
- FIG. 1B the device of FIG.
- FIG. 1A is shown placed onto a print head substrate 170 , wirebonded 116 , and sealed with encapsulant 190 at ends of the silicon wafer 110 , print head substrate 170 , and nozzle plate 130 junctions.
- An aperture 180 is formed in the print head substrate 170 .
- the area of the ink inlet 180 can be about 100 ⁇ 200 ⁇ m to facilitate deep reactive ion etching through the silicon wafer 110 .
- reactive ion etching is an expensive process. For example, a per wafer etch time on the order of about five hours can be needed to form a 500 to 600 ⁇ m deep ink inlet.
- an overall area of the silicon wafer must be large enough to accommodate formation of the ink inlet as well as allow for alignment tolerances, resulting in about a 20% margin at the edge of the silicon wafer. Typically, this margin is used for support member 150 of the nozzle plate 130 .
- the amount of silicon and surface area required for forming a fluid interconnect is typically defined by a combination of the ink inlet 120 and margin.
- the die can be about 2000 ⁇ m wide. If the total overhead of the ink inlet represents 200 ⁇ m, for example, a potential 10% reduction in usable space of the die results.
- a 2 mm ⁇ 12 mm die size yields 563 die. If the die width is reduced, for example, by 10% (1.8 mm), a yield of 624 die per wafer can be obtained. Accordingly, the die yield can be directly proportional to a reduction in the size of the cut die. This can become particularly important for architectures having large array designs where both die size and array size are important fabrication considerations.
- a method of forming an enclosed fluid path in a print head is provided.
- the exemplary method can include providing a die member and a truncated nozzle plate spaced from the upper surface of the die member.
- the die and nozzle plate are formed on a print head substrate having an aperture formed therein.
- a sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate.
- the sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate.
- a print head is provided.
- the exemplary print head can include a die member supporting at least one bond pad and at least one transducer and a truncated nozzle plate spaced from the die member, the nozzle plate positioned over the at least one transducer.
- a print head substrate supports the die member, the print head substrate having an aperture formed therein.
- a sacrificial material is positioned over the aperture of the print head substrate and abuts both a terminal end of the nozzle plate and an edge of the die member.
- An encapsulant is formed to bridge sacrificial material between the print head substrate and terminal end of the nozzle plate to seal the sacrificial material therein. Removal of the sacrificial material from the print head defines an enclosed fluid path within the print head.
- FIGS. 1A and 1B depict side views of a known MEMS jet print head in sequential stages of assembly
- FIG. 2 is a side sectional view illustrating a print head in accordance with embodiments of the present teachings
- FIGS. 3A through 3D are side views depicting stages of fabrication of the print head in accordance with embodiments of the present teachings
- FIG. 4 is a side view illustrating an exemplary profile of sacrificial material in the exemplary print head in accordance with embodiments of the present teachings
- FIG. 5 is a side view illustrating additional support for a portion of the print head in accordance with embodiments of the present teachings.
- FIG. 6 is a side view illustrating a terminal end of a nozzle plate in accordance with embodiments of the present teachings.
- Embodiments pertain generally to MEMS type ink jet print heads, and more particularly to the fluid feed structures thereof. Although the embodiments are described in connection with structures for “fluid”, it will be appreciated that the fluid can be ink, biologic fluid, industrial fluid, or chemical fluid, by way of non-limiting examples.
- FIG. 2 illustrates a completed print head structure 200 according to exemplary embodiments and includes a print head substrate 270 and a die 210 formed on the print head substrate 270 .
- the print head substrate 270 includes an aperture 280 formed therein.
- Components of the die 210 can include a transducer 212 , a bond pad 214 connected to the print head substrate 270 by a wirebond 216 , and a truncated nozzle plate 230 positioned above the die 210 .
- the nozzle plate 230 includes at least one nozzle opening 240 formed therein.
- the nozzle plate 230 can be spaced from the die 210 by a support member 250 adjacent the bond pad end of the die 210 and an encapsulant 290 at the truncated end of the die 210 .
- encapsulant 290 can be provided from the terminal end of the nozzle plate 230 to a surface of the print head substrate 275 outside of the print head aperture 280 .
- Further encapsulant 295 can be provided on the device at bond pad 214 /wirebond 216 region.
- the structure depicted in FIG. 2 defines a fluid chamber 260 formed between the nozzle plate 230 and die 210 as defined by the encapsulant 290 .
- a fluid path 262 can be defined by a region between the edge of the die 210 and the encapsulant 290 . Accordingly, fluid can enter the print head from the print head aperture 280 , flow through the fluid path 262 to the fluid chamber 260 , and exit the print head via the print head nozzle 240 .
- truncation of the nozzle plate is with respect to known nozzle plates, and is not necessarily intended to convey a shortening of the nozzle plate except as described in the following.
- a known function of the print head 200 can occur. More specifically, the transducer within the print head operates to eject fluid from an opening in the nozzle plate 240 .
- FIGS. 3A through 3D fabrication of the print head 300 and corresponding fluid feed structures will be described in further detail. It will be appreciated that FIGS. 3A through 3D are simplified for the purposes of explanation and that other steps and components may added or existing steps and components may be removed or modified.
- the print head 300 can include the die 310 , with transducer 312 and bond pad 314 components formed on the die 310 in a known manner.
- the die 310 can comprise silicon.
- the truncated nozzle plate 330 can be spaced from the die 310 by a support arm 350 or the like such that a distance of the nozzle plate from the die defines a fluid chamber 360 for the print head 300 .
- At least one dispensing nozzle 340 is formed in the nozzle plate 330 for dispensing fluid from the chamber 360 in response to actuation by the transducer 312 .
- the nozzle plate 330 is depicted initially as a truncated member, and will be supported at the terminal end 332 of the nozzle plate 330 by other components. As illustrated, the terminal end 332 of the nozzle plate 330 aligns with an edge 318 of the die 310 .
- the transducer 312 can be set in from the edge of the die 310 as shown. It will be appreciated that the truncated nozzle plate 330 is a departure from known nozzle plates which are supported as illustrated in FIGS. 1A and 1B . In effect, transducer 312 is surrounded on three sides, similar to a “comb” shape.
- the die 310 is mounted to the print head substrate 370 in a known manner.
- an aperture 380 is formed in the print head substrate 370 and can be the first point of entry for fluid to enter the print head 300 .
- the edge 318 of the die 310 can be positioned adjacent to the aperture 380 of the print head substrate 370 .
- the edge of the die can at times be set in from the aperture 380 by a predetermined distance, and can also be formed to overlap the aperture slightly according to various tolerances, as long as the ink flow is not impeded by the die.
- a sacrificial material 385 is positioned over the aperture 380 of the print head substrate 370 and abutting each of the die edge 318 and aligned with the terminal end 332 of the nozzle plate 330 .
- the sacrificial material seats in a manifold area at ends of the comb-shaped walls as described above.
- the alignment of the sacrificial material 385 can be either by overlapping the terminal end 332 of the nozzle plate 330 or by a corner to corner joining as shown in FIG. 3A . In either case, the sacrificial material 385 can be situated to straddle the aperture 380 of the print head substrate 370 .
- a wirebond 316 can be used to join the bond pad 314 with the print head substrate 370 in a known manner.
- a curable encapsulant 390 , 395 can be formed over portions of the print head 300 . More specifically, the encapsulant 395 can be formed to protect the bond pad 314 and wirebond 316 as is known in the art.
- the encapsulant 390 can be formed over the sacrificial material 385 from the print head substrate 375 outside the print head aperture 380 to the terminal end 332 of the nozzle plate 330 .
- the encapsulant 390 , 395 can be cured using any known curing method.
- a standard heat cure can be used to cure the encapsulant.
- any of a two-part room temperature cure, an ultraviolet cure, or a snap cure with a very short and high temperature time can be used to cure the encapsulant.
- the cured encapsulant 390 forms a seal over the sacrificial material 385 and completes a bridge from the terminal end 332 of the nozzle plate 330 to the print head substrate 375 .
- the encapsulant can be a molding compound injected into a mold for which the present device has an insert.
- the sacrificial material can be removed to obtain the final print head 300 as shown.
- the removal can be by heating the sacrificial material 385 such that it drains from the print head 300 through the aperture 380 of the print head substrate 370 .
- the sacrificial material 385 can be removed by using an appropriate solvent to dissolve the sacrificial material. Removal of the sacrificial material 385 results in a defined fluid path from the aperture 380 of the print head substrate 370 to the fluid chamber 360 via path 362 , and to the nozzle outlet 340 of the nozzle plate 330 . Further, this fluid path is obtained in the absence of a significant amount of the die 310 , thereby reducing overall silicon consumption for the print head.
- the method used to remove the sacrificial material 385 can be dependent upon the type of sacrificial material used.
- the sacrificial material can be a wax such as Apiezon Wax W having a 130° C. melt, a 90° C. softening, and hydrocarbon (i.e. Hexane) soluble.
- the sacrificial material can be a wax such as Aremco Crystalbond 590 having a 150° C. flow point, and isopropyl alcohol solubility or soluble with a proprietary solvent.
- the sacrificial material 385 can be applied to the print head 300 in a number of ways.
- the sacrificial material can be flowed into the die by melting prior to dicing, which can yield an additional benefit of cleanliness.
- the sacrificial material can be preformed pieces placed after die bonding.
- a heated dispensing of the sacrificial material can be performed after die placement to protect ink passages.
- FIG. 4 An example of a shape of the sacrificial material 485 formed by dispensing is illustrated in FIG. 4 .
- a more relaxed profile of the sacrificial material can be obtained.
- a profile of the sacrificial material can be arcuate.
- the terminal end 432 of the nozzle plate 430 is shown in FIG. 4 to have a triangular shaped end. With the triangular shaped end, tolerances for the encapsulant 490 and sacrificial material 485 need not be as rigid.
- the nozzle plate 530 is depicted with a thin, truncated end 532 .
- tolerances can be controlled by applying a thin coating to a surface of the sacrificial material 585 prior to applying the encapsulant 590 .
- the thin coating can be a UV curable coating suitable for forming a crust 592 within the encapsulant 590 upon removing the sacrificial material 585 . It will be appreciated that the crust 592 can be stronger and more durable than, or otherwise reinforce the encapsulant, thus providing an added strength to the bridge region connecting the nozzle plate 530 to the print head substrate 575 .
- the terminal end 632 of the nozzle plate 630 can be shaped to render a pyramid shaped fluid chamber 660 .
- the terminal end 632 can be formed using ODE (Orientation Dependent Etching) or anisotropic etching of silicon.
- ODE Orientation Dependent Etching
- crystal planes within the wafer can be used to form self-terminating structures.
- the cut line is placed such that a portion of the terminal slope is captured, thereby generating a larger end wall for a relaxed tolerance in the print head.
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- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/773,191 US8235500B2 (en) | 2007-03-30 | 2010-05-04 | Cast-in place ink feed structure using encapsulant |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/694,899 US7735225B2 (en) | 2007-03-30 | 2007-03-30 | Method of manufacturing a cast-in place ink feed structure using encapsulant |
US12/773,191 US8235500B2 (en) | 2007-03-30 | 2010-05-04 | Cast-in place ink feed structure using encapsulant |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/694,899 Division US7735225B2 (en) | 2007-03-30 | 2007-03-30 | Method of manufacturing a cast-in place ink feed structure using encapsulant |
Publications (2)
Publication Number | Publication Date |
---|---|
US20100214361A1 US20100214361A1 (en) | 2010-08-26 |
US8235500B2 true US8235500B2 (en) | 2012-08-07 |
Family
ID=39793526
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/694,899 Expired - Fee Related US7735225B2 (en) | 2007-03-30 | 2007-03-30 | Method of manufacturing a cast-in place ink feed structure using encapsulant |
US12/773,191 Expired - Fee Related US8235500B2 (en) | 2007-03-30 | 2010-05-04 | Cast-in place ink feed structure using encapsulant |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/694,899 Expired - Fee Related US7735225B2 (en) | 2007-03-30 | 2007-03-30 | Method of manufacturing a cast-in place ink feed structure using encapsulant |
Country Status (4)
Country | Link |
---|---|
US (2) | US7735225B2 (en) |
JP (1) | JP5069596B2 (en) |
KR (1) | KR101466595B1 (en) |
CN (1) | CN101274525B (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9539814B2 (en) | 2013-02-28 | 2017-01-10 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US9707753B2 (en) | 2013-02-28 | 2017-07-18 | Hewlett-Packard Development Company, L.P. | Printhead die |
US9751319B2 (en) | 2013-02-28 | 2017-09-05 | Hewlett-Packard Development Company, L.P. | Printing fluid cartridge |
US10029467B2 (en) | 2013-02-28 | 2018-07-24 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US10632752B2 (en) | 2013-02-28 | 2020-04-28 | Hewlett-Packard Development Company, L.P. | Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
US10994541B2 (en) | 2013-02-28 | 2021-05-04 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure with saw cut channel |
US11292257B2 (en) | 2013-03-20 | 2022-04-05 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
US11433571B2 (en) | 2019-02-06 | 2022-09-06 | Hewlett-Packard Development Company, L.P. | Movable mold insert adjuster |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8354742B2 (en) * | 2008-03-31 | 2013-01-15 | Stats Chippac, Ltd. | Method and apparatus for a package having multiple stacked die |
US9308726B2 (en) | 2012-02-16 | 2016-04-12 | Xerox Corporation | Printhead fluid paths formed with sacrificial material patterned using additive manufacturing processes |
US8984752B2 (en) * | 2012-06-06 | 2015-03-24 | Xerox Corporation | Printhead fabrication using additive manufacturing techniques |
JP7313884B2 (en) * | 2019-04-22 | 2023-07-25 | キヤノン株式会社 | LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF |
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JPH0230541A (en) | 1988-07-21 | 1990-01-31 | Canon Inc | Production of liquid injection apparatus |
US5538586A (en) * | 1994-10-04 | 1996-07-23 | Hewlett-Packard Company | Adhesiveless encapsulation of tab circuit traces for ink-jet pen |
US5751316A (en) | 1996-07-01 | 1998-05-12 | Xerox Corporation | Thermal ink jet printhead with ink resistant heat sink coating |
US6461798B1 (en) | 1995-03-31 | 2002-10-08 | Canon Kabushiki Kaisha | Process for the production of an ink jet head |
JP2004255869A (en) | 2003-02-07 | 2004-09-16 | Canon Inc | Manufacturing method of ink jet head |
JP2006069204A (en) | 2004-08-06 | 2006-03-16 | Canon Inc | Process for manufacturing liquid ejection head and process for manufacturing substrate for liquid ejection head |
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JP4221638B2 (en) * | 2001-02-16 | 2009-02-12 | ソニー株式会社 | Method for manufacturing printer head and method for manufacturing electrostatic actuator |
KR100538230B1 (en) * | 2003-09-27 | 2005-12-21 | 삼성전자주식회사 | Method for manufacturing monolithic inkjet printhead |
JP3897120B2 (en) * | 2004-06-17 | 2007-03-22 | ソニー株式会社 | Liquid ejecting apparatus and method of manufacturing liquid ejecting apparatus |
KR100560721B1 (en) * | 2004-08-23 | 2006-03-13 | 삼성전자주식회사 | A method of manufacturing an inkjet head having a metal chamber layer and an inkjet head manufactured thereby |
JP4665599B2 (en) * | 2005-05-12 | 2011-04-06 | ソニー株式会社 | Droplet discharge head and printing apparatus |
JP4678000B2 (en) * | 2006-03-31 | 2011-04-27 | ブラザー工業株式会社 | Inkjet head |
-
2007
- 2007-03-30 US US11/694,899 patent/US7735225B2/en not_active Expired - Fee Related
-
2008
- 2008-03-27 JP JP2008082442A patent/JP5069596B2/en not_active Expired - Fee Related
- 2008-03-28 CN CN2008100874700A patent/CN101274525B/en not_active Expired - Fee Related
- 2008-03-28 KR KR1020080029056A patent/KR101466595B1/en not_active Expired - Fee Related
-
2010
- 2010-05-04 US US12/773,191 patent/US8235500B2/en not_active Expired - Fee Related
Patent Citations (9)
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JPH0230541A (en) | 1988-07-21 | 1990-01-31 | Canon Inc | Production of liquid injection apparatus |
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Also Published As
Publication number | Publication date |
---|---|
JP5069596B2 (en) | 2012-11-07 |
US7735225B2 (en) | 2010-06-15 |
US20100214361A1 (en) | 2010-08-26 |
KR20080089267A (en) | 2008-10-06 |
JP2008254441A (en) | 2008-10-23 |
US20080239002A1 (en) | 2008-10-02 |
CN101274525A (en) | 2008-10-01 |
CN101274525B (en) | 2011-08-03 |
KR101466595B1 (en) | 2014-11-28 |
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